The Kynix Components

CatalogFeaturesApplicationsGeneral DescriptionPIN ConfigurationPIN FunctionAbsolute Maximum RatingsElectrical CharacteristicsSwitching CharacteristicsLow Speed Mode TimeSequence ChartCascade MethodData Transmission MethodTypical Application CircuitPackage ImformationDatasheet PDF DownloadFAQ FeaturesOutput port compressionBuilt in stabilivolt, Only add a resistance to IC VDD feet when under 24V powerGray level 256 can be adjusted and  scan  frequency not less than 400Hz/s.Built in signal reshaping circuit ,after wave resha- ping to the next driver, ensure wave-form distortion notBuilt-in electric reset circuit and power lost reset circuit.Cascading port transmission  signal  by  single  line.Any two point the distance more than 10m transmission signal without anyWhen the refresh rate is 30fps, low speed model cascade number are  not  less  than  512  points,  hig- h speed mode not less than 1024Send data at speeds of up to 400 Kbps and  800 Kbps ApplicationsLED decorativeIndoor/outdoor LED video or irregular screen General DescriptionThe WS2811 is 3 output channels special  for  LED  driver  circuit.  It  internal  include  intelligent  digital  port data latch and signal reshaping amplification drive circuit.Also include a precision internal  oscillator  and  a  12V voltage programmable  constant  current  output  drive.  In the purpose of reduce power supply ripple, the 3  output channels designed to delay turn-on function. IC use single NZR communication mode.After the chip power-on reset, the DIN  port  receivedata  from  con troller, the first  IC  collect  initial  24bit  data  then  sent  to  the  internal  data  latch,  theother  data  which  reshaping  by the internal signal reshaping amplification circuit sent to the next cascade IC through the DO port.  After  transmission for each chip,the signal  to  reduce  24bit.  IC  adopt  auto  reshaping  transmit  technology,  making  the chip cascade number is not limited the signal transmission, only depend on the speed of signal transmission. The data latch of IC depend on the received 24bit data produce different duty ratio signal at OUTR, OUTG, OUTB port. All chip synchronous send the received data to each segment when the DIN port input a reset signal. It will receive new data again. After the reset signal finished. Before a new reset signal received, the control signal of OUTR ,OUTG, OUTB port unchanged. IC sent PWM data that received justly to OUTR, OUTG, OUTB port, after receive a low voltage reset signal the time retain over 50us. We offer two package SOP8 and DIP8. PIN Configuration Figure: PIN Configuration PIN FunctionNO.SymbolFunction description1OUTROutput of Red PWM control2OUTGOutput of Green PWM control3OUTBOutput of Blue PWM control4GNDGround5DOUTData signal cascade output6DINData signal input7SETSet work mode of IC as low speed model(connect VDD)or high speed model(vacant)8VDDPower supply voltage Absolute Maximum RatingsPrameterSymbolRatingsUnitPower supply voltageVDD+6.0~+7.0VOutput voltageVOUT12VInput voltageVI-0.5～VDD+0.5VOperation junction temperatureTopt-25～+85℃Storage temperature rangeTstg-55~+150℃ Electrical Characteristics（TA=-20～+70℃，VDD=4.5～5.5V,VSS=0V,unless otherwise specified）PrameterSmybolconditionsMinTpyMaxUnitLow voltage output currentIOLROUT——18.5——mAIdoutVo=0.4V，DOUT10————mAInput currentIIVI=VDD/VSS————±1µA Input voltage levelVIHDIN，SET0.7VDD————VVILDIN，SET————0.3 VDDVHysteresis voltageVHDIN，SET——0.35——V Switching Characteristics（TA=-20～+70℃，VDD=4.5～5.5V,VSS=0V,unless otherwise specified）PrameterSymbolConditionMinTpyMaxUnitOperation frequencyFosc1————400——KHzFosc2————800——KHzTransmission delay timetPLZCL=15pF,DIN→ DOUT,RL=10KΩ —— —— 300 nsFall timetTHZCL=300pF,OUTR/ OUTG/OUTB————120µsData transmissionrateFMAXDuty ratio50%400————KbpsInput capcityCI——————15pF Low Speed Mode TimeT0H0 code,high voltage time0.5 µs±150nsT1H1 code,high voltage time1.2 µs±150nsT0L0 code,low voltage time2.0 µs±150nsT1L1 code,low voltage time1.3 µs±150nsRESlow voltage timeAbove 50µs  Sequence Chart   Cascade Method Data Transmission MethodNote: The data of D1 is send by MCU,and D2, D3, D4 through IC internal reshaping amplification to transmit.Composition of 24bit DataR7R6R5R4R3R2R1R0G7G6G5G4G3G2G1G0B7B6B5B4B3B2Note: Follow the order of RGB to sent data and the high bit sent at first. Typical Application Circuit1.power supply is 5V with 1 LED and constant current (18.5mA)drivingFigure 1 This driving mode use constant current output, the advantage of is the LED can retain luminance and colour temperature when the power supply lessen. We require, in order to prevent power spikes phenomenon and power reverse polarity, series a not more than 100ohm resistor at the po-wer supply pin(VDD). The capacitance 104 as bypass capacitor . To prevent the reflection and hot-swap protection, we suggest to connect a 33 ohm resistor at the data input or output port for impedance. 2.power supply is 12V with 3 LED and constant current(18.5mA) driving Figure 2The same as the front mode, it is also use  constant  current  output.  In  this  circuit,  R1  is  used  as  the  IC internal LDO divider resistance and the value is 2.7K. The capacitance 104 as bypass capacitor. To prevent  the reflection and hot-swap protection, we suggest to connect a 33ohm resistor at the data input or output port  for impedance.  At  the  OUTR  port  we  should  add  a  divider  resistance  RR.  The  value  of  RR  can be  derived by the following equation:VLEDR is the red LED forward conduction voltage drop. Package ImformationDIP-8 Package:   SymbolDimensions In MillmetersDimensions In InchesMinNomMaxMinNomMaxA——4.31——0.170A10.38——0.015——A23.153.403.650.1240.1340.144B0.380.460.510.0150.0180.020B11.271.521.770.0500.0600.070C0.200.250.300.0080.0100.012D8.959.209.450.3520.3620.372E6.156.456.650.2420.2520.262E1—7.62——0.300—e—2.54——0.1—L3.003.303.600.1180.1300.142θ0º—15º0º—15º SOP-8 Package  SymbolDimensions In MillmetersDimensions In InchesMinMaxMinMaxA1.3501.7500.0530.069A10.1000.2500.0040.010A21.3501.5500.0530.061b0.3300.5100.0130.020c0.1700.2500.0060.010D4.7005.1000.1850.200E3.8004.0000.1500.157E15.8006.2000.2280.244e1.2700.050L0.4001.2700.0160.050θ0º8º0º8º Datasheet PDF DownloadYou can download the datasheet from the link given below.WS2811-Datasheet FAQWhat is a WS2811?WS2811 is a simple RGB LED strip. It implies that with the contribution of an information signal you can screen every single LED color. You can get these information signals from various things like the Digital pin from Arduino Board, from an appropriate RGB LED controller, and some more. How many RGB LEDs can an Arduino power?So our final answer is that when using only the digital pins on an Arduino Uno board, we can individually control 13 LEDs so long as the current is limited to approximately 10 to 12 mA for each LED. Can you cut individually addressable LED strip?This kind of strips are very flexible and can be cut to any length you want. As you can see, the strip is divided into segments, and each segment contains one RGB LED. You can adjust its size by cutting the strip with a scissors in the right place (the proper places to cut the strip are marked). How many addressable LEDs can an Arduino control?A standard Arduino board (like a Duemilanove) provides 17 "free" I/O pins, not counting TX, RX, Reset, or pin 13. So, you can hook up 17*16=272 LEDs. How do I choose a LED strip power supply?Make sure the total wattage of your LED strip lighting is at least 20 percent less than the power supply's rated wattage. For example, if you have an LED strip light that requires 80 watts of power to run, you'll need a power supply that's rated for at least 96 watts. 

CatalogGBPC3504 FeaturesGBPC3504 PinoutAbsolute Maximum RatingsThermal CharacteristicsElectrical CharacteristicsTypical Performance CharacteristicsOrdering InformationPackage DimensionsGBPC3504 ManufacturerGBPC3504 DatasheetUsing Warnings GBPC3504 FeaturesIntegrally Molded Heat- Sink Provided Very Low ThermalResistance  for Maximum Heat DissipationSurge Overload Ratings from 300 A to 400AIsolated Voltage from Case to Lead over 2500 VUL Certified, UL #E258596Terminals Finish Material◆Silver (Solderable per MIL-STD-202, Method 208 for the wire type GBPC- W  package)◆Nickel for GBPC packageMounting Torque: 20 in-lbs MaximumThese are Pb-Free DevicesSuffx“W"Wire Lead Structure GBPC3504 PinoutThe following figure is the diagram of GBPC3504 pinout. GBPC3504 Pinout Absolute Maximum RatingsSymbol ParameterValue Units  005010204060810 VRRMMaximum Repetitive Reverse Voltage501002004006008001000VVRMSMaximum RMS Bridge Input Voltage3570140280420560700VVRDC Reverse Voltage (Rated VR)501002004006008001000VIF(AV)Average Rectified Forward Current at TC = 55°CGBPC1212A  GBPC1515   GBPC2525   GBPC3535 IFSMNon−Repetitive Peak Forward Surge CurrentGBPC12, 15, 25300A 8.3 ms Single Half−Sine−WaveGBPC35400ATSTGStorage Temperature Range−55 to +150°CTJOperating Junction Temperature−55 to +150°C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.These ratings are limiting values above which the serviceability of any semiconductor device may by impaired. Thermal CharacteristicsSymbolParameterValueUnitPDPower Dissipation83.3WRqJCThermal Resistance, Junction to Case (Note 2)1.5°C/W With Heatsink. Electrical CharacteristicsSymbolParameterTest ConditionsValueUnitVFForward Voltage Drop, per bridge6.0 AGBPC121.1 (Max)V  7.5 AGBPC15    12.5 AGBPC25    17.5 AGBPC35  IRReverse Current, per element at Rated VRTA = 25°C5.0 (Max)µA  TA = 125°C500 (Max)µAI2tRating for Fusing t < 8.35 msGBPC12, 15, 25375A2Sec  GBPC35660A2SecCTTotal Capacitance, per leg VR = 4.0 V, f = 1.0 MHzGBPC12, 15, 25180pF  GBPC35200pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Typical Performance Characteristics Forward Current Derating Curve Non−Repetitive Surge Current Forward Voltage Characteristics Reverse Current vs. Reverse Voltage Ordering InformationPart NumberMarkingPackagePacking MethodGBPC12005GBPC12005GBPC 4L(Pb−Free)BulkGBPC1201GBPC1201GBPC1202GBPC1202GBPC1204GBPC1204GBPC1206GBPC1206GBPC1208GBPC1208GBPC1210GBPC1210GBPC15005GBPC15005GBPC1501GBPC1501GBPC1502GBPC1502GBPC1504GBPC1504GBPC1506GBPC1506GBPC1508GBPC1508GBPC1510GBPC1510GBPC25005GBPC25005GBPC2501GBPC2501GBPC2502GBPC2502GBPC2504GBPC2504GBPC2506GBPC2506GBPC2508GBPC2508GBPC2510GBPC2510GBPC35005GBPC35005GBPC3501GBPC3501GBPC3502GBPC3502GBPC3504GBPC3504GBPC3506GBPC3506GBPC3508GBPC3508GBPC3510GBPC3510GBPC1201WGBPC1201WGBPC−W 4L(Pb−Free)GBPC1202WGBPC1202WGBPC1204WGBPC1204WGBPC1206WGBPC1206WGBPC1208WGBPC1208WGBPC1210WGBPC1210WGBPC15005WGBPC15005WGBPC1501WGBPC1501WGBPC1502WGBPC1502WGBPC1504WGBPC1504WGBPC1506WGBPC1506WGBPC1508WGBPC1508W Package DimensionsThe following diagram shows the GBPC3504 package. GBPC3504 Package GBPC3504 ManufacturerON Semiconductor is a Fortune 500 company driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. GBPC3504 DatasheetYou can download GBPC3504 datasheet from the link given below:GBPC3504 Datasheet Using WarningsNote: Please check their parameters and pin configuration before replacing them in your circuit. GBPC3504 FAQWhat does a bridge rectifier do?A bridge rectifier provides full-wave rectification from a two-wire AC input, resulting in lower cost and weight as compared to a rectifier with a 3-wire input from a transformer with a center-tapped secondary winding. Diodes are also used in bridge topologies along with capacitors as voltage multipliers. What are the advantages of bridge rectifier?The need for the center-tapped transformer is eliminated. It can be used in application floating output terminals, no output terminal is grounded. Transformer utilization factor, in case of the bridge rectifier, is higher than that of a center tap rectifier. Which is better center tapped or bridge rectifier?Bridge rectifier has certain advantages over centre tap rectifier. It possesses better transformer utilization factor, better voltage regulation etc. But it also has a drawback of more voltage drop as compared to centre tap as it has four diodes.

Catalog2SK170 Features2SK170 PinoutAbsolute Maximum RatingsElectrical CharacteristicsTypical Performance CharacteristicsRestrictions On Product Use2SK170 Manufacturer2SK170 DatasheetUsing Warnings2SK170 FAQ 2SK170 FeaturesRecommended for first stages of EQ and M.C. head amplifiers.High |Yfs|: |Yfs| = 22 mS (typ.) (VDS = 10 V, VGS = 0, IDSS = 3 mA)High breakdown voltage: VGDS = −40 VLow noise: En = 0.95 nV/Hz1/2 (typ.) (VDS = 10 V, ID = 1 mA, f = 1 kHz)High input impedance: IGSS = −1 nA (max) (VGS = −30 V) 2SK170 Pinout 2SK170 Pinout Absolute Maximum RatingsCharacteristicsSymbolRatingUnitGate-drain voltageVGDS-40VGate currentIG10mADrain power dissipationPD400mWJunction temperatureTj125°CStorage temperature rangeTstg-55~125°C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical CharacteristicsCharacteristicsSymbolTest ConditionMinTyp.MaxUnitGate cut-off currentIGSSVGS = -30 V, VDS = 0¾¾-1.0nAGate-drain breakdown voltageV (BR) GDSVDS = 0, IG = -100 mA-40¾¾V Drain currentIDSS(Note)VDS = 10 V, VGS = 0 2.6 ¾ 20 mAGate-source cut-off voltageVGS (OFF)VDS = 10 V, ID = 0.1 mA-0.2¾-1.5VForward transfer admittanceïYfsïVDS = 10 V, VGS = 0, f = 1 kHz¾22¾mSInput capacitanceCissVDS = 10 V, VGS = 0, f = 1 MHz¾30¾pFReverse transfer capacitanceCrssVDG = 10 V, ID = 0, f = 1 MHz¾6¾pF  Noise figureNF (1)VDS = 10 V, ID = 1.0 mA, RG = 1 kW,f = 1 kHz¾1.010  dBNF (2)VDS = 10 V, ID = 1.0 mA, RG = 1 kW,f = 1 kHz¾0.52 Note: IDSS classification GR: 2.6~6.5 mA, BL: 6.0~12 mA, V: 10~20 mA Typical Performance Characteristics Static Characteristics Id - Vds (low Voltage Region) ID - VGS |Yfs|-ID |Yfs|-IDSS VGS (OFF)-IDSS Ciss-VDS Crss-VGD En-ID NF-ID NF-VDS NF-RG NF-f IGSX - VDS Restrictions On Product UseToshibaCorporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without Thisdocument and any information herein may not be reproduced without prior written permission from  Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.ThoughTOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or  Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.Productis intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this  Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.Donot disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in Productshall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or Theinformation contained herein is presented only as guidance for Product  No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.ABSENTA WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR Donot use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.Pleasecontact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of  Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 2SK170 ManufacturerToshiba Electronic Devices & Storage Corporation (TDSC) offers a broad IC and discrete product line-up which includes Power, Small Signal, Optoelectronics, and Logic devices for automotive, multimedia, industrial, telecoms, and networking applications. TDSC develops, manufactures, and supplies innovative storage products including Enterprise and Consumer HDDs. 2SK170 DatasheetYou can download 2SK170 datasheet from the link given below:2SK170 Datasheet Using WarningsNote: Please check their parameters and pin configuration before replacing them in your circuit. 2SK170 FAQWhat is a field effect transistor?The field-effect transistor (FET) is a type of transistor that uses an electric field to control the flow of current in a semiconductor. FETs are devices with three terminals: source, gate, and drain. Field effect transistors generally display very high input impedance at low frequencies. What is difference between transistor and field effect transistor?Key Difference between BJT and FET. Bipolar junction transistors are bipolar devices, in this transistor, there is a flow of both majority & minority charge carriers. Field-effect transistors are unipolar devices, in this transistor, there are only the majority charge carriers flows. Why BJT and FET named so?Bipolar transistors are so named because they conduct by using both majority and minority carriers. The field-effect transistor (FET), sometimes called a unipolar transistor, uses either electrons (in N-channel FET) or holes (in P-channel FET) for conduction. You are correct. There are fields inside of a BJT.

CatalogProduct OverviewRN2483A-I/RM105 Related Video IntroductionRN2483A-I/RM105 CAD ModelsRN2483A-I/RM105 Pin ConfigurationRN2483A-I/RM105 Block DiagramRN2483A-I/RM105 FeaturesRN2483A-I/RM105 ApplicationsRN2483A-I/RM105 DatasheetRN2483A-I/RM105 SpecificationsRN2483A-I/RM105 ManufacturerUsing WarningRN2483A-I/RM105 FAQ Product OverviewMicrochip’s RN2483 Low-Power Long Range LoRa Technology Transceiver module provides an easy-touse, low-power solution for long range wireless data transmission. The advanced command interface offers rapid time to market. The RN2483 module complies with the LoRaWAN Class A protocol specifications. It integrates RF, a baseband controller, command Application Programming Interface (API) processor, making it a complete long range solution. The RN2483 module is suitable for simple long range sensor applications with external host MCU. RN2483A-I/RM105 Related Video IntroductionRN2483A-I/RM105 Video Description: Tutorial for connection Microchip RN2483 LoRa module to personal computer and using it with minicom on Ubuntu or another GNU/Linux distribution. RN2483A-I/RM105 CAD ModelsFigure: RN2483A-I RM105 PCB Symbol   Figure: RN2483A-I RM105 Footprint   Figure: RN2483A-I RM105 3D Models RN2483A-I/RM105 Pin ConfigurationFigure: RN2483A-I RM105 Pin Configuration RN2483A-I/RM105 Block Diagram Figure: RN2483A-I RM105 Block Diagram RN2483A-I/RM105 FeaturesGeneral FeaturesOn-Board LoRaWAN™ Protocol StackASCII Command Interface over UARTCompact Form Factor: 17.8 x 26.7 x 3.34 mmCastellated SMT Pads for Easy and Reliable PCBMountingEnvironmentally Friendly, RoHS CompliantEuropean RED Certified Radio ModuleDevice Firmware Upgrade (DFU) over UART, see“RN2483 LoRa® Technology Module CommandReference User’s Guide” (DS40001784) OperationalSingle Operating Voltage: 2.1V to 3.6V (3.3Vtypical)Temperature Range: -40°C to +85°CLow-Power ConsumptionProgrammable RF Communication Bit Rate up to300 kbps withFSK Modulation, 10937 bps with LoRa Technology ModulationIntegrated MCU, Crystal, EUI-64 Node IdentitySerial EEPROM,Radio Transceiver with Analog Front End, Matching Circuitry14 GPIOs for Control and Status, Shared with 13Analog Inputs RF/Analog FeaturesLow-Power Long Range Transceiver Operating inthe 433 MHzand 868 MHz Frequency BandsHigh Receiver Sensitivity: Down to -146 dBmTX Power: Adjustable up to +14 dBm highEfficiency PAFSK, GFSK and LoRa Technology ModulationIIP3 = -11 dBmUp to 15 km Coverage at Suburban and up to 5km Coverage at Urban Area RN2483A-I/RM105 ApplicationsAutomated Meter ReadingHome and Building AutomationWireless Alarm and Security SystemsIndustrial Monitoring and ControlMachine to Machine (M2M)Internet of Things (IoT) RN2483A-I/RM105 DatasheetYou can download the datasheet from the link given below:RN2483A-I/RM105 Datasheet RN2483A-I/RM105 SpecificationsProduct AttributeAttribute ValueManufacturer:MicrochipProduct Category:Sub-GHz ModulesSeries:RN2483Frequency:434 MHz, 868 MHzOutput Power:14 dBmInterface Type:UARTOperating Supply Voltage:2.1 V to 3.6 VSupply Current Transmitting:40 mASupply Current Receiving:14.2 mAOperating Temperature:-40°C ~ 85°CPackaging:TrayBrand:Microchip TechnologyMoisture Sensitive:YesProduct Type:Multiprotocol ModulesSubcategory:Embedded SolutionsTradename:LoRaUnit Weight:0.466375 oz RN2483A-I/RM105 ManufacturerMicrochip Technology Inc. is a publicly-listed American corporation that manufactures microcontroller, mixed-signal, analog and Flash-IP integrated circuits. Its products include microcontrollers (PIC, dsPIC, AVR and SAM), Serial EEPROM devices, Serial SRAM devices, embedded security devices, radio frequency (RF) devices, thermal, power and battery management analog devices, as well as linear, interface and wireless products. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. RN2483A-I/RM105 FAQWhat is RN2483A-I/RM105?The RN2483 is a fully-certified 433MHz / 868MHz module based on wireless LoRaWAN® (Low Power Wide Area Network) technology. The RN2483 Module utilizes a unique spread spectrum modulation within the sub-GHz band to enable long-range, low power, and high network capacity. What is an RF Transceiver?RF transceivers are devices or modules that contain both a transmitter (Tx) and a receiver (Rx). Tx and Rx elements usually share functionality including antenna interface, low pass filtering, Rx/Tx switching and associated control circuits. What is the function of RF transceiver?RF transceivers are electronic devices that receive and demodulate radio frequency (RF) signals, and then modulate and transmit new signals. They are used in many different video, voice and data applications. How does an RF module work?As the name suggests, RF module operates at Radio Frequency. This frequency range varies between 30 kHz & 300 GHz. In this RF system, the digital data is represented as variations in the amplitude of carrier wave. The RF transmitter receives serial data and transmits it wirelessly through through its RF antenna. How do RF modules transmit data?An RF transmitter receives serial data and transmits it wirelessly through RF through its antenna connected at pin4. The transmission occurs at the rate of 1Kbps - 10Kbps. The transmitted data is received by an RF receiver operating at the same frequency as that of the transmitter. 

Product OverviewThe MPL3115A2 is a compact piezoresistive absolute pressure sensor with an I2C interface. MPL3115 has a wide operating range of 20 kPa to 110 kPa, a range that covers all surface elevations on Earth. The fully internally compensated MEMS in conjunction with an embedded high resolution 24-bit equivalent ADC provide accurate pressure [Pascals] /altitude [meters] and temperature [degrees Celsius] data. The internal processing in MPL3115A2 removes compensation and unit conversion load from the system MCU, simplifying system design. This blog will introduce MPL3115A2 systematically from its features, pinout to its specifications, applications, also including MPL3115A2 datasheet and so much more. CatalogProduct OverviewRelated Video IntroductionMPL3115A2 FeaturesMPL3115A2 PinoutMPL3115A2 ApplicationsMPL3115A2 Symbol & FootprintMPL3115A2 Circuit DiagramMPL3115A2 Block DiagramMPL3115A2 PackageMPL3115A2 SpecificationMPL3115A2 ManufacturerMPL3115A2 DatasheetUsing WarningsMPL3115A2 FAQ Related Video Introduction Video: Portable Altimeter  using Arduino and pressure sensor (MPL3115A2) MPL3115A2 Video Description: This video shows you how ta make a poratble altimeter based on the  pressure sensor MPL3115A2, using an arduino nano. MPL3115A2 FeaturesOperating range: 20 kPa to 110 kPa absolute pressureCalibrated range: 50 kPa to 110 kPa absolute pressureCalibrated temperature output: −40 °C to 85 °CI2C digital output interfaceFully compensated internallyPrecision ADC  resulting in 0.1 meter of effective resolutionDirect reading– Pressure: 20-bit measurement (Pascals)– 20 to 110 kPa– Altitude: 20-bit measurement (meters)– –698 to 11,775 m– Temperature: 12-bit measurement (°C)– –40 °C to 85 °CProgrammable interruptsAutonomous data acquisition– Embedded 32-sample FIFO – Data logging up to 12 days using the FIFO– One-second to nine-hour data acquisition rate1.95 V to 3.6 V supply voltage, internally regulated1.6 V to 3.6 V digital interface supply voltageOperating temperature from −40 °C to +85 °C MPL3115A2 PinoutThe following figure is the diagram of MPL3115A2 pinout. MPL3115A2 Pinout MPL3115A2 ApplicationsHigh-accuracy altimetry and barometrySmartphones, tablets and wearable devicesGPS applications: dead reckoning, map assist, navigation, enhancement foremergency servicesWeather station equipment MPL3115A2 Symbol & FootprintThe followings are MPL3115A2 Symbol and Footprint. MPL3115A2 Symbol MPL3115A2 Footprint MPL3115A2 Circuit DiagramThe following is the circuit diagram of MPL3115A2. Typical application diagram MPL3115A2 Block DiagramThe following figure shows the block diagram of MPL3115A2. MPL3115A2 Block Diagram MPL3115A2 PackageThe following diagram shows the MPL3115A2 package. MPL3115A2 Package MPL3115A2 SpecificationTYPEDESCRIPTIONCategorySensors, TransducersMfrNXP USA Inc.PackageTrayPart StatusLast Time BuyApplicationsBoard MountPressure TypeAbsoluteOperating Pressure7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)Output TypeI²COutput24 bAccuracy±0.058PSI (±0.4kPa)Voltage - Supply1.95V ~ 3.6VPort StyleNo PortFeaturesTemperature CompensatedTermination StyleSMD (SMT) TabMaximum Pressure72.52PSI (500kPa)Operating Temperature -40°C ~ 85°CPackage / Case8-TLGASupplier Device Package8-LGA (3x5) MPL3115A2 ManufacturerNXP Semiconductors is a leading supplier of embedded controllers offering a broad portfolio of MCUs with Arm-based processors and microcontrollers for a variety of industries including automotive, wireless connectivity and more. They continue to drive innovation offering a strong Power Management portfolio for industrial and automotive applications, including multiple power supplies and battery management solutions. NXP products power and connect across the globe building solutions, helping enhance the proficiency of people, organizations and the world has a whole. MPL3115A2 DatasheetYou can download MPL3115A2 datasheet from the link given below:MPL3115A2 Datasheet Using WarningsNote: Please check their parameters and pin configuration before replacing them in your circuit. MPL3115A2 FAQWhat is a pressure sensor?A pressure sensor is a device or instrument which is able to measure the pressure in gases or liquids. A pressure sensor consists of a pressure-sensitive element which can determine the pressure being applied and components to convert the information into an output signal. Why are pressure sensors used?A pressure sensor is a device for pressure measurement of gases or liquids. Pressure sensors are used for control and monitoring in thousands of everyday applications. Pressure sensors can also be used to indirectly measure other variables such as fluid/gas flow, speed, water level, and altitude. How does a pressure level sensor work?A pressure sensor works by converting pressure into an analogue electrical signal. When pressure sensing technologies were first manufactured they were mechanical and used Bourdon tube gauges to move a needle and give a visual indication of pressure.

CatalogProduct OverviewW25Q128FVFIG Related Video IntroductionW25Q128FVFIG Pin ConfigurationW25Q128FVFIG Block DiagramW25Q128FVFIG FeaturesW25Q128FVFIG SPI / QPI OperationsW25Q128FVFIG DatasheetW25Q128FVFIG SpecificationsW25Q128FVFIG ManufacturerUsing WarningW25Q128FVFIG FAQProduct OverviewThe W25Q128FV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI(XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages. The W25Q128FV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128FV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. The W25Q128FV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers. W25Q128FVFIG Related Video IntroductionW25Q128FVFIG Video Description: In this video, I am going to explain how Flash Memory and Solid-state drives (SSD) work! Have fun, get some popcorn and enjoy! Everybody stores pictures, music, and videos on their devices nowadays. The encoded information is even stored when the device shuts down due to low energy. After powering it on again, we find the same media and are glad that it did not disappear. Flash memory was invented in 1984 by Japanese engineer Fujio Masuoka at the Toshiba Corporation. An electrical storage medium that does not require any energy to retain data. The name "Flash" was suggested by a coworker of Masuoka, Shoji Ariizumi because the erasure process of the newly invented device reminded him of a camera's flash. Later, the invention of flash memory allowed the wide use of solid-state-drives (SSD) that most of us have in their computers today. The fundamental building block of flash memory is the floating-gate MOSFET, in short, FGMOS. Dependant on the kind of used technology, flash cells can store one or up to four bits (single-level cell (SLC) = 1 bit; multi-level cell (MLC) = 2 bits; triple-level cell (TLC) = 3 bits; quad-level cell (QLC) = 4 bits) - five bits per cell (penta-level-cell (PLC) = 5 bits) is in development currently. In a nutshell, these memory cells are arranged right next to each other and layered on top of one another to realize a highly capable storage medium. This makes it possible to produce a chip with trillions of flash cells, which then can store up to 1 TB of data! A perfect SSD! Flash memory is amazing and you know what? Engineers and semiconductor manufacturers will continue to shrink the size of flash cells in order to improve storage capacity and to reduce the price per bit. Therefore creating even better technology and cheaper solid-state-drives (SSDs) in the future! W25Q128FVFIG Pin ConfigurationFigure: W25Q128FVFIG Pin ConfigurationPin DescriptionPIN NO.PIN NAMEI/OFUNCTION1/HOLD (IO3)I/OHold Input (Data Input Output 3)2VCC Power Supply3/RESETIReset Input4N/C No Connect5N/C No Connect6N/C No Connect7/CSIChip Select Input8DO (IO1)I/OData Output (Data Input Output 1)9/WP (IO2)I/OWrite Protect Input (Data Input Output 2)10GND Ground11N/C No Connect12N/C No Connect13N/C No Connect14N/C No Connect15DI (IO0)I/OData Input (Data Input Output 0)16CLKISerial Clock Input W25Q128FVFIG Block DiagramFigure: W25Q128FVFIG Block Diagram W25Q128FVFIG FeaturesNew Family of SpiFlash Memories– W25Q128FV: 128M-bit / 16M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware ResetHighest Performance Serial Flash– 104MHz Single, Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– More than 100,000 erase/program cycles– More than 20-year data retentionEfficient “Continuous Read” and QPI Mode– Continuous Read with 8/16/32/64-Byte Wrap– As few as 8 clocks to address memory– Quad Peripheral Interface (QPI) reduces instruction overhead– Allows true XIP (execute in place) operation– Outperforms X16 Parallel FlashLow Power, Wide Temperature Range– Single 2.7 to 3.6V supply– 4mA active current, <1µA Power-down (typ.)– -40°C to +85°C operating rangeFlexible Architecture with 4KB sectors– Uniform Sector/Block Erase (4K/32K/64K-Byte)– Program 1 to 256 byte per programmable page– Erase/Program Suspend & ResumeAdvanced Security Features– Software and Hardware Write-Protect– Power Supply Lock-Down and OTP protection– Top/Bottom, Complement array protection– Individual Block/Sector array protection– 64-Bit Unique ID for each device– Discoverable Parameters (SFDP) Register– 3X256-Bytes Security Registers with OTP locks– Volatile & Non-volatile Status Register BitsSpace Efficient Packaging– 8-pin SOIC / VSOP 208-mil– 8-pin PDIP 300-mil– 8-pad WSON 6x5-mm / 8x6-mm– 16-pin SOIC 300-mil (additional /RESET pin)– 24-ball TFBGA 8x6-mm– Contact Winbond for KGD and other options W25Q128FVFIG SPI / QPI OperationsFigure: W25Q128FV Serial Flash Memory Operation DiagramStandard SPI InstructionsThe W25Q128FV is accessed through an SPI compatible bus consisting of four signals: Serial Clock   (CLK), Chip Select(/CS), Serial Data Input (DI) and Serial Data Output  (DO). Standard SPI instructions use the DI  input pin to serially write instructions.  addresses or data to the device on the rising edge of CLK,  The DO output pin is used to read data or status from the device on the falling edge of CLK,   SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3 concerns the normal state of the CLK  signal when the SPI bus master is in standby and data is not being transferred to the Serial Flash. For Mode 0, the CLK  signal is normally low on the falling and rising edges of /CS. For Mode 3, the CLK  signal is normally high on the falling and rising edges of /CS. Dual SPI Instructions The W25Q128FV supports Dual SPI operation when using instructions such as “Fast Read Dual Output (3Bh)” and “Fast Read Dual I/O (BBh)”. These instructions allow data to be transferred to or from the device at two to three times the rate of ordinary Serial Flash devices, The Dual SPI Read instructions are ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing nonspeed-critical code directly from the SPI bus (XIP). When using Dual SPI instructions. the DI and DO pins become bidirectional I/O pins: IO0 and IO1. Quad SPI InstructionsThe W25Q128FV supports Quad SPI operation when using instructions such as “Fast Read Quad Output (6Bh)”, “Fast Read Quad I/O (EBh)”, “Word Read Quad I/O (E7h)” and “Octal Word Read Quad I/O (E3h)”. These instructions allow data to be transferred to or from the device four to six times the rate of ordinary Serial Flash. The Quad Read instructions offer a significant improvement in continuous and random access transfer rates allowing fast code-shadowing to RAM or execution directly from the SPI bus (XIP). When using Quad SPI instructions the DI and DO pins become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. Quad SPI instructions require the nonvolatile Quad Enable bit (QE) in Status Register-2 to be set. QPI InstructionsThe W25Q128FV supports Quad Peripheral Interface (QPI) operations only when the device is switched from Standard/Dual/Quad SPI mode to QPI mode using the “Enter QPI (38h)” instruction. The typical SPI protocol requires that the byte-long instruction code being shifted into the device only via DI pin in eight serial clocks. The QPI mode utilizes all four IO pins to input the instruction code, thus only two serial clocks are required. This can significantly reduce the SPI instruction overhead and improve system performance in an XIP environment. Standard/Dual/Quad SPI mode and QPI mode are exclusive. Only one mode can be active at any given time. “Enter QPI (38h)” and “Exit QPI (FFh)” instructions are used to switch between these two modes. Upon power-up or after a software reset using “Reset (99h)” instruction, the default state of the device is Standard/Dual/Quad SPI mode. To enable QPI mode, the non-volatile Quad Enable bit (QE) in Status Register-2 is required to be set. When using QPI instructions, the DI and DO pins become bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation modes. Hold FunctionFor Standard SPI and Dual SPI operations, the /HOLD signal allows the W25Q128FV operation to be paused while it is actively selected (when /CS is low). The /HOLD function may be useful in cases where the SPI data and clock signals are shared with other devices. For example, consider if the page buffer was only partially written when a priority interrupt requires use of the SPI bus. In this case the /HOLD function can save the state of the instruction and the data in the buffer so programming can resume where it left off once the bus is available again. The /HOLD function is only available for standard SPI and Dual SPI operation, not during Quad SPI or QPI. The Quad Enable Bit QE in Status Register-2 is used to determine if the pin is used as /HOLD pin or data I/O pin. When QE=0 (factory default), the pin is /HOLD, when QE=1, the pin will become an I/O pin, /HOLD function is no longer available. To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will activate on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the /HOLD condition will activate after the next falling edge of CLK. The /HOLD condition will terminate on the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not already low the /HOLD condition will terminate after the next falling edge of CLK. During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data Input (DI) and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept active (low) for the full duration of the /HOLD operation to avoid resetting the internal logic state of the device. Software Reset & Hardware /RESET pinThe W25Q128FV can be reset to the initial power-on state by a software Reset sequence, either in SPI mode or QPI mode. This sequence must include two consecutive commands: Enable Reset (66h) & Reset (99h). If the command sequence is successfully accepted, the device will take approximately 30uS (tRST) to reset. No command will be accepted during the reset period. For the WSON-8 and TFBGA package types, W25Q128FV can also be configured to utilize a hardware /RESET pin. The HOLD/RST bit in the Status Register-3 is the configuration bit for /HOLD pin function or RESET pin function. When HOLD/RST=0 (factory default), the pin acts as a /HOLD pin as described above; when HOLD/RST=1, the pin acts as a /RESET pin. Drive the /RESET pin low for a minimum period of ~1us (tRESET*) will reset the device to its initial power-on state. Any on-going Program/Erase operation will be interrupted and data corruption may happen. While /RESET is low, the device will not accept any command input. If QE bit is set to 1, the /HOLD or /RESET function will be disabled, the pin will become one of the four data I/O pins. For the SOIC-16 package, W25Q128FV provides a dedicated /RESET pin in addition to the /HOLD (IO3) pin as illustrated in Figure 1b. Drive the /RESET pin low for a minimum period of ~1us (tRESET*) will reset the device to its initial power-on state. The HOLD/RST bit or QE bit in the Status Register will not affect the function of this dedicated /RESET pin. Hardware /RESET pin has the highest priority among all the input signals. Drive /RESET low for a minimum period of ~1us (tRESET*) will interrupt any on-going external/internal operations, regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note:  W25Q128FVFIG DatasheetYou can download the datasheet from the link given below:W25Q128FVFIG Datasheet W25Q128FVFIG SpecificationsTypeDescriptionCategoryIntegrated Circuits (ICs)MemoryMfrWinbond ElectronicsSeriesSpiFlash®PackageTubePart StatusDiscontinued at Digi-KeyMemory TypeNon-VolatileMemory FormatFLASHTechnologyFLASH - NORMemory Size128Mb (16M x 8)Memory InterfaceSPI - Quad I/O, QPIClock Frequency104 MHzWrite Cycle Time - Word, Page50µs, 3msVoltage - Supply2.7V ~ 3.6VOperating Temperature-40°C ~ 85°C (TA)Mounting TypeSurface MountPackage / Case16-SOIC (0.295", 7.50mm Width)Supplier Device Package16-SOIC W25Q128FVFIG ManufacturerWinbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. W25Q128FVFIG FAQWhat is a serial flash memory?A serial Flash device is a non-volatile memory that can be electrically erased and reprogrammed. It is used for storing executable code in devices such as DVD players, DSL modems, routers, hard-disk drives, and printers. What is the purpose of SPI Flash memory?SPI Flash memory, also known as Flash storage, has become widespread in the embedded industry and is commonly used for storage and data transfers in portable devices. Common devices include phones, tablets, and media players, as well as industrial devices like security systems and medical products. What is the difference between flash memory and EEPROM?The main difference between EEPROM and flash memory is that most EEPROM devices can erase any byte of memory at any time. Flash memory can only erase an entire chunk, or "sector", of memory at a time. This means that flash memory can wear out faster than EEPROM.