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ⅠIntroductionAs electronic technology advances, there is a greater need for high-speed PCB design. Because they can work at high speeds with integrated circuits for most electronic devices, even simple ones. Some factors and parameters have to be considered when designing a high-speed PCB. Furthermore, you will discover that the fundamental PCB design rules and methods you have mastered are exactly what you need to learn. Needless to say, it will be extremely useful to PCB designers working on high-speed PCB designs.CatalogⅠIntroductionⅡ What is High-speed PCB Design?Ⅲ High-speed PCB Related VideoⅣ When Is a Printed Circuit Board Design Considered High Speed?Ⅴ High-speed PCB Design SkillsⅥ High speed PCB  Design ConsiderationsⅦ Setup for High-Speed DesignⅧ Floorplanning a High Speed PCBⅨ How to Tell If Your Project is High SpeedⅩFAQ Ⅱ What is High-speed PCB Design?High-speed PCB design is any design in which the physical characteristics of your PCB.  such as layout, packaging, interconnection, layer stack up, and so on, begin to impact the integrity of your signals. Furthermore, when you begin designing the boards and encounter issues such as delays, crosstalk, reflections, or emissions, you will enter the world of high-speed PCB design, Because of the attention paid to these issues, high-speed design is truly unique. You may be accustomed to designing a simple PCB  where you focus primarily on component placement and routing. However, it is more important to consider some factors when using a high-speed design, such as how close they are to signals, what width they will be, where you will place the traces, and what types of components they will be connected to. Furthermore, when the factors are considered, it will achieve a high level for your PCB design process.Figure1:What is High-speed PCB Design? Ⅲ High-speed PCB Related Video High-Speed PCB Design Tips - Phil's Lab #25 High-speed PCB Video Description: Quick overview of some general high-speed PCB design tips. Everything from stack-ups, controlled impedance traces, vias, and much more! Ⅳ When Is a Printed Circuit Board Design Considered High Speed?Certain characteristics can help you identify a high-speed  PCB design,  As a result, the design is fast if:It uses  HDMI , Ethernet,  SATA , PCI Express, USB, Thunderbolt, or other high-speed interfaces for fast data transfer; the circuit consists of several sub-circuits connected via high-speed interfaces (LVDS, DSI, CSI, SDIO,  DDR3 , etc.); the time of signal propagation over the track is at least 13 of the time of signal rise; the digital signal frequency is 50MHz or higher;Because the printed circuit board is so small, locating the components becomes a real challenge (especially when you come across a high-speed interface layout  ). Ⅴ High-speed PCB Design SkillsBe familiar with design software that provides advanced options.High-speed designs necessitate a plethora of complex features in your CAD software. Furthermore, there may not be many programs for hobbyists, and it rarely has advanced options based on Web suites. As a result, you must gain a better understanding of a powerful.High-speed routing  When it comes to high-speed traces.  a designer needs to understand the essential routing rules, such as not cutting ground planes and keeping trails short. As a result, keep digital lines a certain distance apart from crosstalk and shield any interference-creating elements from compromising signal integrity.Routing traces  with impedance controlImpedance matching is required for some types of signals with impedances ranging from 40 to 120 ohms. Antennae and a large number of differential pairs are examples of characteristic impedance matched hints.It is critical for designers to understand how to calculate trace width and layer stack for required impedance values. If the impedance values are incorrect, it can have a serious impact on the signal, resulting in data corruption. When creating a PCB  layout or a high-speed PCB  layout.  keep single-ended impedance Zo and differential impedance Zdiff in mind. Figure2: Parameters for Zdiff calculation Length matching traces  High-speed memory buses and interface buses have numerous lines. Because the lines can operate at high frequencies, it is critical that the signals travel from the transmitting terminal to the receiving terminal at the same time. Furthermore, it must have a feature known as length matching. As a result, most common standards define tolerance values that must match length.Figure3: High-speed PCB Design SkillsMinimizing loop areaHigh-frequency signals can cause  EMI  and EMC issues, so high-speed PCB  designers should be aware of these tips. As a result, they must follow basic rules such as having continuous ground planes, reducing loop areas by optimizing current return paths for traces.  and incorporating numerous stitching vias. Ⅵ High speed PCB  Design ConsiderationsThe importance of the PCB  layout cannot be overstated.PCB Design ConsiderationsSchematic considerationsTrace length tuningPCB materials and stack-up demands for high speedHigh-speed placement strategiesDifferential pair and trace length routing Crosstalk, impedance control, and parallelism considerationsUnderstanding stripline and microstripRouting topologies and best routing  practicesSimulators Ⅶ Setup for High-Speed DesignBefore the layout can begin, there are several design and database details that have to be addressed.SchematicWhile there is a lot to set up before you can start the layout of a high-speed design, most people don't give the schematic much thought. Designers need to check the parts, simulate the circuitry, and finish the design. Is the schematic, however, ready to be used for layout? If the designer cannot easily understand the intent of the circuitry, an unorganized schematic can make the PCB  layout difficult. High-speed signal paths, for example, must be laid out sequentially so that the designer can replicate component placement in the layout,  It's also a good idea to highlight parts of the design that you really understand.These include:Critical placement locations, as well as which side of the board certain parts may be required onKeep out zones should be established around critical components.High-speed routing data, such as topologies, measured lengths, and matched lengths.Information about a differential pair and controlled impedance. PCB LibrariesAs with any  PCB  layout.  the component footprints used for high-speed design must be checked and verified, but some additional library work may be required. Some footprints used in high-frequency or RF designs, for example, may require modifications to reduce pad sizes for signal integrity,  In addition, to accommodate high-density design requirements, some footprints may be reduced to their smallest size. However, component footprints should always adhere to industry and manufacturer specifications to the greatest extent possible to meet design for manufacturability (DFM) requirements. Many design tools, including Cadence's Allegro  PCB Editor, include online library browsing capabilities for importing vendor-specific footprint models. Materials and ComponentsBefore you begin the layout.  you must choose the materials that will be used to construct your high-speed circuit board. Harsh operating environments may necessitate a more robust board structure, and the physical properties of the materials will be required for calculated controlled impedance routing  :Consult with your manufacturer to determine whether your board will require high-speed materials.For high-speed and high-frequency applications, enhanced epoxy or PTFE materials may be a better choice.The dielectric constants of  FR-4  may be insufficient to hold the impedance values required, or the design may suffer from greater signal loss than is acceptable.The manufacturer will also need to review and confirm the PCB components. With today's supply chain issues, you'll want to make sure you have enough parts before committing to a design. Board Layer StackupSpecific board layer stack-ups are required for high-speed designs to aid in  EMI shielding and signal integrity,  The primary concern is to include a complete and continuous ground plane on an internal layer. Many boards will also have multiple ground plane layers spread across the board stack up to accommodate multiple layers of transmission line routing in microstrip or stripline configurations. The board layer stack-up must be created in the PCB CAD database or imported from another source. This is where the ability of PCB design systems to communicate directly with the vendor for stack-up information exchange, as demonstrated in the video above, can be extremely useful. Design RulesPCB design systems typically include a comprehensive set of design rules and constraints that can be applied to the design. Component and net classes will already be used in standard circuit board designs to specify spacing rules, trace widths, vias, and other constraints. With a high-speed design, a completely new set of rules should be established, including:Differential pairsSignal pathsRouting topologiesMeasured and matched trace lengthsTrace tuning parameters These rules can be set up for each design, or in many cases, imported from another layout to ease the designer’s workload. System ParametersThe parameters are the last but not least of the setups. Display parameters such as colors and fill patterns, grids, routing preferences, and a slew of others are among them. Designers can improve their tool efficiency by managing these parameters, Let's start laying out the board now that we've completed the high-speed design.Figure5: A PCB CAD system’s parameter setup menu for design colors Ⅷ Floorplanning a High Speed PCBIn a high-speed PCB layout  , there are no specific rules or standards for where components  should be placed. In general, the largest central processor IC  should be placed near the center of the board because it will typically need to interface with all other components  on the board in some way. Smaller integrated circuits (ICs) that connect directly to the central processor can be placed around the central IC  to keep routing between components  short and direct. Peripherals can then be added to the board to provide the necessary functionality.When the main controller IC  is near the center of the board, and other high-speed peripherals are placed around it, the high-speed layout works best. This is one of the reasons why motherboards have a large processor in the center of the board. The Altium Designer MiniPC project has its PCIe, DDR4, USB 3.0, and Ethernet peripherals arranged around the central FPGA SoC to facilitate routing.Figure6: high-speed PCB layoutOnce your components  are in place, you can use your design tools to begin routing your design. This is a critical aspect of high-speed board design because incorrect routing can compromise signal integrity. However, if the preceding steps were followed correctly, signal integrity is much easier to achieve. Set your impedance profile in your PCB design rules so that all routers in the design have the proper width, clearance, and spacing to maintain controlled impedance during routing. Ⅸ How to Tell If Your Project is High SpeedThere are a couple of schools of thought on this. The unfortunate reality is that there is no specific definition of what constitutes a high-speed PCB. It all comes down to a case-by-case assessment. As previously stated, if you're experiencing signal integrity issues on your PCB layout.  it's a good indication that you're working on a high-speed project.There's also the device-specific approach to consider. You'll be working on a high-speed project if you're designing a motherboard, cell phone board, or DSL router board. If you need to incorporate specific technologies into your layouts, such as HDMI, PCI Express, USB, or SATA, be aware that you will be dealing with high-speed design constraints.Figure7: Do you believe your design has a lot of traces? Take a look at this high-speed layout The final point to consider is whether you're working on a design with lumped or distributed circuits. What's the distinction? Designs with physical systems that are all small enough that they interact uniformly are referred to as lumped systems and are not fast. However, if your systems all operate independently within the confines of a larger whole, you have a distributed system and some high-speed design issues to deal with.Here is what you should remember:When the trace length becomes a significant fraction of the wavelength of the fastest signal, high-speed design considerations need to be considered.ⅩFAQ1. What is considered high speed design?High speed design specifically refers to systems that use high speed digital signals to pass data between components. The dividing line between a high speed digital design and a simple circuit board with slower digital protocols is blurry.2. What is high speed design Altium?High-Speed Design in Altium Designer. High-speed printed circuit board design is a process of balancing the circuit design requirements, device technologies, and fabrication materials and methodologies, to deliver a PCB that can transfer signals between the components, with integrity.3. What are high speed interfaces?High-Speed Serial Interface (HSSI) is a short-distance (50') communications interface that is used to interconnect routing and switching devices on slower local-area networks (LANs) with the higher-speed lines of a wide area network (WAN).4. What is high frequency PCB?High Frequency PCB is a type of PCB which is widely used in applications involving special signal transmission between objects. It is available in frequency range of 500MHz to 2GHz and is an ideal choice for mobile, microwave, radio frequency and high speed design applications.5. What is high speed signal in PCB?What is a high-speed signal in a PCB? Signals with frequencies ranging from 50 MHz to as high as 3 GHz are considered high-speed signals such as clock signals. Ideally, a clock signal is a square wave, but it is practically impossible to change its 'LOW' level to 'HIGH' level (and vice versa) instantly.

Introduction The transistor is a current-control device. For example, control the collector-emitter current by changing the base current. In a general voltage amplification occasion, this amplification effect comes from the use of resistors to convert current into voltage. In the small-signal model, the source of the base current is the ratio of the input voltage to the base-emitter dynamic resistance rbe, which is usually kΩ. So the base current is very small, and may only be a few tenths of mA. Through the amplification of the transistor, the base current is generated between the collector and the emitter by β times. This article will introduce how transistor works in the common-emitter amplifier circuit. Transistor Amplifiers Circuit Introduction Catalog Introduction Ⅰ Common-emitter Amplifier Circuit Formula Ⅱ Common-emitter Amplifier Circuit Design 2.1 Design Steps 2.2 Circuit Analysis 2.3 Common-emitter Circuit Design 2.4 Circuit Performance Parameters Ⅲ Common-emitter Amplifier Circuit Expansion 3.1 Increase Magnification 3.2 Low-voltage and Low-loss Circuit 3.3 Differential Output Circuit 3.4 Filter and Tuning Amplifier Circuit Ⅳ Summary Ⅴ FAQ Ⅰ Common-emitter Amplifier Circuit Formula Here, take the common emitter amplifier circuit as an example: Figure 1. Transistor Common-emitter Amplifier Circuit △Vo=VCC-△ieRc=VCC-β△ibRc=VCC-△Vi·Rc/rbe△Vi/rbe=△ibThus, the collector generates a current of β times ib:△ie=β△ibFurthermore, the output voltage can be obtained by the relative positive power supply potential:△Vo=VCC-△ieRc=VCC-β△ibRc=VCC-△Vi·Rc/rbeThus, we can get an inverted amplified voltage signal by AC coupling and controlling the collector resistance Re. But generally the emitter will have a resistance to control the gain, so the above formula is not practical. When designing a circuit in non-extreme situations, we often hope that the circuit can work with most general-purpose transistors, avoiding the parameter that depends on component parameters such as rbe. At the same time, it is very cumbersome to consider the base current in the specific calculation. Therefore, in the general design process, the existence of the base current is ignored in an approximate calculation (In some circuits, although the base current is ignored, it is still necessary to give the base a certain current drive to make the circuit working normally). In addition, the calculation of gain is the external circuit resistance not the rbe.Among them, the base-emitter tube voltage drop VBE is also a very important parameter, which is generally equal to 0.6V (silicon tube). The parameters of the transistor circuit can all be obtained according to VBE=0.6V and Ohm's law.The cumbersome part of the transistor circuit lies in the setting of the static operating point. Usually, careless design will cause clipping and distortion of the output waveform. Therefore, the selected values of some experimental values can be used for reference. The overall design idea is: quantitatively determine the voltage and current to calculate the resistance.   Ⅱ Common-emitter Amplifier Circuit Design The common-emitter amplifier circuit is a typical inverting amplifier, which has a wide range of applications and stable effects. First show the overall design ideas, and then explain the purpose and principles of the design in steps. 2.1 Design Steps 1) Determine the supply voltage VCC, and determine the static emitter current IE according to the frequency curve/noise curve/others.2) Determine VE, where selects 1~2V to absorb temperature drift.3) According to VE and IE, calculate the emitter static resistance RE ( IE≈IC).4) Determine the magnification Av, and apply the relationship Av=RC/RE to calculate the static collector resistance RC. At this point, the static working point has been established.5) Check whether the static operating point meets the requirements: positive output swing limit=VCC-IE·RC, negative output swing limit=IE·RC-VE. It is necessary to ensure that the amplified output voltage does not exceed the swing limit (usually the swing limit is larger). If RC is too large, there will be a downside clipping, so is the small RC. In addition, determine whether the power exceeds the limit: PC=VCE·IC.6) Determine the base bias voltage as follows: According to VBE=0.6V, it is easy to get VB=VE+0.6 (divide the voltage from the power supply through the resistor). Since ib is considered to be small and negligible, the current IB0 flowing through the base voltage divider resistors (R1, R2 in the above figure) should be much larger than ib. ib is approximately calculated as IC/β, and IB0 is about an order of magnitude larger than ib, so R2=VB/IB0, R1=(VCC-VR2)/IB0.7) Finally, determine the AC coupling capacitor value and the power supply decoupling capacitor value.Let's first use a designed common-emitter amplifier circuit to intuitively understand the waveforms of the next parts: Figure 2. Transistor Common Emitter Amplifier Circuit Design As shown in the figure, the circuit uses 2SC2240 tube, 15V power supply, and the input and output are AC coupled. The output signals are as following:  Figure 3. 4-channel Signal Waves The pale blue waveform is the input signal, selecting the sine wave of 1kHz, 1Vpp.The green is the output signal, amplified by about 5 times, and it is inverted.The blue is the base signal, which can be seen because the DC level is raised due to the influence of the base bias resistance.The red is the emitter signal, which is only a fixed value away from the base signal.   2.2 Circuit Analysis First, perform a DC analysis, that is, determine the static operating point. In the initial design process, the design and verification of static operating points are also the first to proceed. The static potential of the base can be easily calculated according to the base bias resistance, and the static potential of the emitter can be determined according to the voltage drop of the base-emitter tube as a constant. Therefore, according to the magnitude of the emitter resistance, the magnitude of the collector-emitter current can be obtained, and then the collector static potential can be obtained from the power supply voltage.Why is the static operating point important? Take the NPN transistor as an example, which is equivalent to two back-to-back diodes. If requiring the diode work, you must give it a proper bias to make it reasonably conductive. In the circuit, the base-collector diode prevents internal feedback, and the base-emitter diode is the key to achieving amplification. In other words, it is enough to design an external circuit so that the current flows normally in the base-emitter diode. This idea will be mentioned in the analysis of the carrying capacity of the emitter follower.Find the AC voltage gain. When the input voltage changes △vi, it will cause the emitter current to produce an AC change △ie. Since the base emitter voltage drop is constant, it does not contribute to the AC change, so △ie=vi/RE. Therefore, the emitter AC output voltage can be determined as vo=△ieRC=vi·RC/RE, and the AC gain is Av=RC/RE. This conclusion can quickly analyze the magnification of the common-emitter circuit.The output power rails are VCC and VE respectively, which are determined by the current characteristics of the transistor during operation, and there is generally no rail-to-rail output. According to the output power rail and the AC amplification factor, the circuit can be used.When the input and output are not AC coupled, the input (especially for DC) will cause the output waveform to be distorted.   2.3 Common-emitter Circuit Design After understanding the circuit characteristics, you can design the common emitter circuit according to the design steps at the beginning of this section. The static operating point and magnification have been determined during the analysis, and the other parts are designed below.Supply voltage: According to the swing of the output voltage, we can determine the size of the voltage. Usually the power supply voltage is larger than the output peak-to-peak value.Transistor: Select the appropriate transistor according to the operating frequency, required power, noise level and β, etc.Emitter current: Determine the size of the emitter current according to the frequency characteristics by consulting the device manual.RC and RE: Determined by the emitter voltage and current, and the magnification, pay attention to review the upper and lower limits of the swing and the rated power.Base bias resistance: VB is determined according to VE, thereby determining the voltage divider resistance of the power supply. Note that the current flowing through the voltage divider resistor should be one to two orders of magnitude higher than the base current. The base current is calculated by dividing the collector-emitter current by β.Coupling capacitor: The AC coupling capacitor is generally 10uF. Note that the coupling capacitor of the output stage and the input impedance of the next stage will form a high-pass filter. The cutoff frequency of the filter should be handled carefully.   2.4 Circuit Performance Parameters Through the method of AC analysis, we can obtain some characteristic parameters of the designed circuit, such as input and output impedance, magnification and so on.Input impedance: According to AC analysis, the input impedance is the parallel value of the base bias resistance. In small signal analysis, the base emitter dynamic resistance rbe should also be connected in parallel.Output impedance: The method to determine the output impedance is to add a load to the circuit. When the peak-to-peak output value drops to half of the no-load, the load impedance is the output value. Generally, the output impedance of the common-emitter amplifier circuit is the collector resistance RC.Magnification: Due to the influence of the base current, the actual magnification is about 10% lower than the design value. So the design formula is more practical.   Ⅲ Common-emitter Amplifier Circuit Expansion By improving the general common-emitter amplifier circuit, various application circuits with other characteristics can be obtained. This section introduces the means to increase the magnification, the low-voltage power supply circuit, the differential output circuit, and the tuning amplifier circuit. 3.1 Increase Magnification According to the introduction of the design circuit, the voltage gain is mainly determined by the ratio of the collector resistance RC to the emitter resistance RE. So it is common to change the ratio of the resistance to change the gain. However, the problem arises: these two resistors are responsible for determining the working current at the same time. Because the DC operating point is changed arbitrarily, the circuit is likely to be distorted or even not work.From another perspective, voltage gain belongs to the category of "AC Analysis", and the static operating point belongs to "DC Analysis". So add some reactive components to the circuit to change the ratio under the AC perspective, the resistance value during DC analysis does not change.This can be achieved by connecting the emitter resistor in parallel, or making the resistor in parallel with the capacitor, that is, modifying the circuit in the first section: Figure 4. Common-emitter Amplifier Circuit Pay attention to the emitter in the above figure. In the AC analysis, the resistor R4 is short-circuited by the capacitor. At this time, it is equivalently considered that the emitter resistor is only R7 (330Ω). From the signal source and the oscilloscope, the signal has been amplified nearly 50 times at this time. It is much larger than the original design value (10k/2k=5), thus realizing the expansion of voltage gain. If the original emitter resistance is not split, but the entire capacitor is connected in parallel, the maximum gain βRC/rbe will be obtained at this time.How to choose the capacitance value? It should be noted that after the capacitors are connected in parallel, the entire circuit will have high-pass characteristics, and the cut-off frequency is f=1/2πRC. If this high-pass characteristic is not required, the C capacitance value can be selected to a larger value between 47uF~100uF.In addition, the capacitor C6 has the function of temperature compensation. 3.2 Low-voltage and Low-loss Circuit If the op amp circuit is powered by a dry battery (1.5V), it is not realistic, but the transistor circuit can be done. The key is to use the conduction voltage drop of the external diode to offset the base-emitter voltage and have small small. The circuit in the figure below can still amplify small signals as designed even under 1.5V power supply: Figure 5. Common-emitter Amplifier Circuit But the disadvantage is that the maximum voltage of the system is always below the supply voltage. Because of the small circuit loss, it is suitable for low power consumption. 3.3 Differential Output Circuit Fully differential op amps can provide dual-mode output, and many transmission lines also require differential transmission. Transistor circuits can also perform differential output. In addition to the principle of a common emitter amplifier circuit, the principle of an emitter follower is also used. The following figure shows the circuit connection of the differential output. Figure 6. Common-emitter Amplifier Circuit It can be seen that two differential signals with the same shape and opposite phase are output. The collector signal is in phase with the input signal, and the emitter output signal is in phase with the input signal. However, the output impedance of the two signals is different due to the different lead-out positions. The output impedance of the inverted output is higher (RC), and the output impedance of the non-inverted output is lower, which is suitable for driving the load. The inverted output is generally connected to the emitter follower before driving.In addition, the static potential of the base should be set between VCC and GND as much as possible to expand the undistorted output range.   3.4 Filter and Tuning Amplifier Circuit The introduction of reactive components in the circuit will cause the properties of the circuit to change with the frequency. We can use this property to design LPF, HPF, and tuning amplifier commonly used in high-frequency circuits. Actually, it uses the characteristic that the impedance of the reactance element changes with the frequency, and then changes the voltage gain at the current frequency. The impedance at the resonance frequency is often purely resistive and has an extreme value to achieve frequency selective amplification. The following show low-pass, high-pass and frequency selective amplifiers at specific frequencies:① LPF Figure 7. Common-emitter Amplifier Circuit As shown in the figure, a low-pass filter is constructed (the input of the bode tester is placed at the base instead of the output of the signal generator, because the input coupling capacitor will form a high-pass filter with the input resistor, which affects the observation effect), and its cut-off frequency is about 1.06kHz, calculated by f=1/2πRcC.From the sinusoidal steady-state analysis, the impedance of the RC parallel loop is R/√(1+(wRC)^2). As the frequency increases, the impedance decreases, so the voltage gain decreases, forming a low-pass characteristic.② HPF Figure 8. Common-emitter Amplifier Circuit As shown in the figure, a high-pass filter is constructed, and the calculation of its cut-off frequency is similar to that of LPF.At the gain peak point, the voltage gain reaches 50dB, which is close to the β value of the transistor. Then the gain is attenuated due to the deterioration of the transistor's frequency characteristics.③ 10.7MHz Figure 9. Common-emitter Amplifier Circuit By replacing RC with an LC network with a resonance frequency of 10.7MHz, a frequency selective amplifier can be obtained. As shown in the figure, the amplification factor is 35dB at 10.7M, while the amplification factor when detuning 1MHz is only 12.6dB. The disadvantage is that the pass-band is slightly wider, the rectangular coefficient is not good enough, and the equivalent quality factor of the loop is about 65.2, which is relatively large. In addition, the high-frequency decoupling capacitor has been changed to 1uF. Resonant Amplifier Circuit Example: Figure 10. Resonant Amplifier Circuit Example   Ⅳ Summary Transistor amplifier circuit is the basis of an operational amplifier circuit, and common-emitter configuration is the most commonly used form. Drawing lessons from the feature that the amplifier's magnification can be easily determined by the ratio of two resistors, and the gain of the common emitter amplifier can also be approximated by the ratio of the two resistors.   Ⅴ FAQ 1. What are transistor amplifiers used for?Amplifiers are derived from the transistors because they are capable of operating under three regions active, cut-off and saturation. For the purpose of amplification, the focus will be on the active region. The main purpose of these amplifiers is to enhance the strength of the applied input signal without alteration. 2. How does a transistor amplify current?Transistors are normally used as amplifiers. ... The small current travels from the voltage source into the base of the transistor. A current at the base turns on the transistor. The current is then amplified and travels from the emitter of the transistor to the collector. 3. What is a common emitter transistor amplifier?The common emitter amplifier is a three basic single-stage bipolar junction transistor and is used as a voltage amplifier. The input of this amplifier is taken from the base terminal, the output is collected from the collector terminal and the emitter terminal is common for both the terminals. 4. Why common emitter is used in amplifier?Common emitter (CE) configuration. ... Common emitter transistors are used most widely, because a common emitter transistor amplifier provides high current gain, high voltage gain and high power gain. This type of transistor gives for a small change in input there is small change in output. 5. What is the use of CE amplifier?In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier. It offers high current gain (typically 200), medium input resistance and a high output resistance. 6. How does transistor work as amplifier?A transistor acts as an amplifier by raising the strength of a weak signal. The DC bias voltage applied to the emitter base junction, makes it remain in forward biased condition. ... Thus a small input voltage results in a large output voltage, which shows that the transistor works as an amplifier. 7. What is common emitter amplifier circuit?The Common Emitter Amplifier circuit has a resistor in its Collector circuit. The current flowing through this resistor produces the voltage output of the amplifier. ... The Base of the transistor used in a common emitter amplifier is biased using two resistors as a potential divider network. 8. What are the main parts of a transistor amplifier circuit?A Single stage transistor amplifier has one transistor, bias circuit and other auxiliary components. The following circuit diagram shows how a single stage transistor amplifier looks like. When a weak input signal is given to the base of the transistor as shown in the figure, a small amount of base current flows. 9. What is the phase difference in common emitter amplifier?The phase difference between the input and output voltage of CE amplifier circuit is. The phase difference of 1800 between the signal voltage and output voltage in a common emitter amplifier is known as phase reversal. 10. When an NPN transistor is used as an amplifier?For a npn transistor to be used as an amplifier, forward bias has to be applied on the transistor. Thus, when an npn transistor is used as an amplifier, holes move from base to emitter. So, the correct answer is option D i.e. holes move from base to emitter. 11. When an NPN junction transistor is used as an amplifier in CE mode?A transistor is used in the common emitter mode as an amplifier then: (A) the base emitter junction is forward baised. (B) the base emitter junction is reverse baised. (C) the input signal is connected in series with the voltage applied to bias the base emitter junction. 12. How is an NPN transistor used as an amplifier show with its circuit diagram?The circuit of a common-emitter amplifier using an n-p-n transistor is shown below : In a common emitter amplifier circuit, the input signal voltage and output collector voltage are in opposite phase. i.e 180° out of phase. Thus the phase difference between the input signal and output voltage is 180°. 13. How does a common emitter amplifier work?Operation of Common Emitter AmplifierWhen a signal is applied across the emitter-base junction, the forward bias across this junction increases during the upper half cycle. This leads to an increase in the flow of electrons from the emitter to a collector through the base, hence increases the collector current. 14. What is β for a CE configuration?Base Current Amplification Factor (β)The base current amplification factor is defined as the ratio of the output and input current in a common emitter configuration. In common emitter amplification, the output current is the collector current IC, and the input current is the base current IB. 15. What is current gain CE configuration?The current gain of a transistor in CE configuration is defined as the ratio of output current or collector current (IC) to the input current or base current (IB). The current gain of a transistor in CE configuration is high. Therefore, the transistor in CE configuration is used for amplifying the current.

Introduction The operational amplifier has a non-inverting input terminal and an inverting input terminal in the electronic circuit. The polarity of the input terminal and the output terminal are the same is a non-inverting amplifier, and the polarity of the input terminal and the output terminal are opposite called inverting amplifier. The inverting amplifier circuit has the function of amplifying the input signal as inverting output. Inverting Op Amp and The Concept of Virtual Ground in Op Amp Catalog Introduction Ⅰ Inverting Amplifier Basics Overview 1.1 Working Principle 1.2 Inverting Amplifier Gain Calculator 1.3 Inverting Amplifier Features 1.4 Inverting Amplifier Functions Ⅱ Inverting Amplifier Applications Ⅲ Inverting Amplifier Explain with Diagrams: NE5532 Ⅳ Inverting Amplifier Circuit Design Steps Ⅴ FAQ Ⅰ Inverting Amplifier Basics Overview 1.1 Working Principle As shown in Figure 1, the inverting amplifier circuit has the function of amplifying the input signal as inverting output. "Inverting" means that the positive and negative signs are reversed. This amplifier uses negative feedback technology, which used to return a part of the output signal to the input. In Figure, the wiring method of connecting the output Vout to the inverting input terminal (-) via R2 is negative feedback. Figure 1. Inverting Amplifier Circuit Operational amplifiers have such characteristics. When the power supply voltage is not applied to the output terminal, the non-inverting input terminal (+) and the inverting input terminal (-) are considered to have the same voltage, that is to say, it can be regarded as a virtual short circuit. Therefore, when the positive input terminal (+) is 0V, the voltage at output is also 0V.The input impedance of the operational amplifier is extremely high, and there is basically no current in the inverting input terminal (-). Therefore, when the current flows to R2, the I1 and I2 are basically equal. Based on the above conditions, using Ohm's Law for R2, we get Vout=-I1xR2. I1 is negative because I2 flows from point A where the voltage is 0V. From another point of view, when the input voltage of the inverting input terminal (-) rises, the output will be inverted and amplified greatly in the negative direction. Since the output voltage in the negative direction is connected to the inverting input terminal via R2, the voltage rise of the inverting input terminal (-) will be blocked. Both the inverting input terminal and the non-inverting input terminal voltage become 0V, and the output voltage is stable.   1.2 Inverting Amplifier Gain Calculator Calculate the gain through the relationship between the input and output in this amplifier circuit. The gain of an inverting op amp is the ratio of the feedback resistance to the input resistance, that is, the ratio of Vout to Vin, and the formula is Vout/Vin= (-I1xR2) /(I1xR1)=-R2/R1. The resulting gain is negative, indicating that the waveform is inverting.The current flowing through R1: I1=(Vi-V-)/R1...aThe current flowing through R2: I2=(V--Vout)/R2……bV-=V+=0………………cI1=I2……………………dSolve the above algebraic equations to get Vout=(-R2/R1)*Vi.This is the input and output relationship of the inverting amplifier circuit.   1.3 Inverting Amplifier Features It can reduce the input impedance or keep a certain value.It can be used as a current input type.Virtual short-circuit point is generated at a certain potential.Its positive input port is free.If the signal source impedance is low, it is easier to obtain a required S/N.The magnification is -Rf/R.   1.4 Inverting Amplifier Functions The inverting amplifier is the basic gain stage in the CMOS circuit. It adopts a common source structure, and the load can be an active load or a current source.Advantages: The potential of the two input terminals is always approximately zero (the non-inverting terminal is grounded, and the inverting terminal is virtual ground). With only differential mode signals,it has strong anti-interference ability.Disadvantages: The input impedance is very small, equal to the resistance of the series resistance from the signal to the input.   Ⅱ Inverting Amplifier Applications Figure 2. Basic Inverting Amplifier Circuit 1) As a IntegratorThe original resistor R2 of the inverting amplifier is replaced by a capacitor C2. At this time, the relationship between the input signal Vi and the output signal Vo forms an integral relationship.2) As a DifferentiatorReplace the original resistor R1 of the inverting amplifier with an electric capacitor C. At this time, the relationship between the input signal Vi and the output signal Vo is differential.3) As a AdderIf the inverting amplifier is slightly changed, the relationship between the input signal and the output signal Vo at this time, if R1 = R2 = R3 =...= Rn = Rf, it can be simplified to Vo = -(V1+V2+V3+.. .+Vn), is additive.   Ⅲ Inverting Amplifier Explain with Diagrams: NE5532 The equivalent resistance seen between the input terminal and the ground of the inverting amplifier circuit is equal to the equivalent resistance between the input terminal and the virtual ground, so the input resistance of the circuit is Ri=R. It can be seen that although the input resistance of the ideal operational amplifier is infinite, the input resistance of the inverting proportional arithmetic circuit is not large because of the parallel negative feedback introduced by the circuit. Figure 3. NE5532 Audio Amplfier Circuit In order to increase the input resistance, R must be increased. For example, when the scale factor is -50, if Ri=10kΩ, R should be 10kΩ and Rf should be 500kΩ. If Ri=100kΩ, R should be 100kΩ and Rf should be 5MΩ. In fact, when the resistance in the circuit is too large, on the one hand, due to the process, the stability of the resistance is poor and the noise is large, on the other hand, when the resistance is of the same order of magnitude as the input resistance of the integrated op amp, the proportional coefficient -Rf/R of the circuit will change greatly, and its value will not only be determined by the feedback network. Therefore, it is necessary for practical applications to use a resistor with a smaller resistance value to get a larger scale factor and a larger input resistance.Look at the following two simulations: Figure 4. Current and Voltage Measuring From above, it doesn't matter without R0, take a look at this below. Figure 5. Current and Voltage Measuring Their output is different, if the expected result is -4V. The reading value -3.608V obviously does not meet the design requirements. We now know that the resistance value of Rs in Figure 5 is orders of magnitude greater than the input resistance of the integrated operational amplifier. Next, if have R0, look at the picture below. Figure 6. Current and Voltage Measuring It can be seen from Figure 6 that after adding R0, the output of the op amp is normal. Why is this?In a TTL circuit, the transistor has a bias current, which will produce a DC voltage drop on the feedback resistor of the e pole. Although it is small, the amplifier has a high amplification factor, which affects the output accuracy greatly. A resistor in the same value as the negative terminal is connected to the positive terminal to cancel the effect of the bias current.R0 is a compensation resistor, which minimizes the bias current error to ensure the symmetry of the differential amplifier circuit of the input stage. When its value is u=0 (that is, the input terminal is grounded), the inverting input terminal is always the equivalent resistance, that is, the parallel connection of the resistance of each branch, so R0=Rs/Rf, through Rf in the circuit, induce negative feedback. According to practical experience, it is best to add a compensation resistor to improve the stability of the circuit. Of course, it can be omitted under normal circumstances.   Ⅳ Inverting Amplifier Circuit Design Steps Inverting amplifiers are several commonly used amplifier types. How to use operational amplifiers design inverting amplifier circuit? The following sharing is the detailed steps.Step 1: Determine the magnification.As shown in the figure below, the amplification factor of the inverting amplifier is (-R2/R1). Figure 7. Determine the Magnification Step 2: Determine the supply voltage.Ensure that the output voltage after the input voltage Vin is multiplied by the amplification factor (-R2/R1) will not exceed the power supply voltage. If it is not the rail-to-rail operational amplifier used, it is better to have a margin of 1~2V. Figure 8. Determine the Supply Voltage Step 3: Determine the gain bandwidth product (GBW).If you are amplifying an AC signal, you need to consider the gain bandwidth product. The calculation formula is: bandwidth of input signal × design gain, select an operational amplifier whose GBW is greater than the required one. Step 4: Check the bandwidth with the slew rate (SR).If the amplifying is a large AC signal, there may be insufficient bandwidth, and it may not be accurate enough to calculate based on the gain-bandwidth product.SR = 2*pi*f*Vp -> f = SR/(2*pi*Vp), where Vp: peak output voltage.If the calculated value f is less than the input voltage frequency, the operational amplifier is not suitable and needs to be replaced. The actual bandwidth should be the smaller of the gain bandwidth product and the slew rate. Step 5: Determine the input offset voltage.Since the offset voltage is also a DC signal, if it is to amplify the DC signal, it should be noted that the offset voltage will also be amplified by the corresponding multiple. If the accuracy is high, try to choose an operational amplifier with a small offset voltage. Step 6: Determine the resistance value.In step 1, the ratio of R1 and R2 has been determined. R1 is generally 1k~10k. A small value is prone to cause gain errors, and a larger value will increase noise (resistor thermal noise). R2 takes the resistance value corresponding to the multiple of R1.It is better to choose the chip resistor, because the parasitic parameters are small.R3=R1/R2, if R1 and R2 are connected in parallel, which are not required.   Ⅴ FAQ 1. What is the inverting amplifier?An inverting op amp is an operational amplifier circuit with an output voltage that changes in the opposite direction as the input voltage. In other words, it is out of phase by 180o。   2. What is inverting amplifier and its application?The inverting amplifier is an important circuit configuration using op-amps and it uses a negative feedback connection. An inverting amplifier, like the name suggests, inverts the input signal as wells as amplifies it.   3. How does an inverting amplifier circuit work?In an inverting amplifier circuit, the operational amplifier inverting input receives feedback from the output of the amplifier. Assuming the op-amp is ideal and applying the concept of virtual short at the input terminals of op-amp, the voltage at the inverting terminal is equal to non-inverting terminal.   4. What are the applications of inverting amplifier?op-amp inverting amplifier. Op amp summing amplifier: Based around the inverting amplifier circuit with its virtual earth summing point, this circuit is ideal for summing audio inputs. It is widely used in audio mixer and many other applications where voltages need to be summed.   5. Why is it called inverting amplifier?It is called Inverting Amplifier because the op-amp changes the phase angle of the output signal exactly 180 degrees out of phase with respect to input signal. Same as like before, we use two external resistors to create feedback circuit and make a closed loop circuit across the amplifier.   6. What are the characteristics of inverting amplifier?1) No Current Flows into the Input Terminals.2) The Differential Input Voltage is Zero as V1 = V2 = 0 (Virtual Earth)   7. What is the formula of inverting amplifier?One final point to note about the Inverting Amplifier configuration for an operational amplifier, if the two resistors are of equal value, Rin = Rƒ then the gain of the amplifier will be -1 producing a complementary form of the input voltage at its output as Vout = -Vin.   8. What are advantages and disadvantages of inverting amplifier?Advantages and Disadvantages of Inverting AmplifierIt follows the negative feedback. The gain factor of these amplifiers is very high. The output generated will be out of phase with the applied input signal. The potential values at both the inverting and the non-inverting terminals maintained at zero.   9. What are the advantages of inverting amplifier?The op amp circuit for the inverting amplifier offers many advantages including relatively low input impedance, a low output impedance and the level of gain that is required (within the limits of the op amp and the gain required from the overall circuit.   10. What is the use of inverting amplifier?The inverting amplifier is an important circuit configuration using op-amps and it uses a negative feedback connection. An inverting amplifier, like the name suggests, inverts the input signal as wells as amplifies it.   11. What is mean by inverting amplifier?An inverting amplifier takes an input signal and turns it upside down at the op amp output. When the value of the input signal is positive, the output of the inverting amplifier is negative, and vice versa. ... The amount of amplification depends on the ratio between the feedback and input resistor values.   12. How an opamp is used as inverting amplifier?Theory: An inverting amplifier using opamp is a type of amplifier using opamp where the output waveform will be phase opposite to the input waveform. The input waveform will be amplifier by the factor Av (voltage gain of the amplifier) in magnitude and its phase will be inverted.   13. What is an inverting amplifier used for?op-amp inverting amplifier. Op amp summing amplifier: Based around the inverting amplifier circuit with its virtual earth summing point, this circuit is ideal for summing audio inputs. It is widely used in audio mixer and many other applications where voltages need to be summed.   14. How does an inverting amplifier work?An inverting amplifier takes an input signal and turns it upside down at the op amp output. When the value of the input signal is positive, the output of the inverting amplifier is negative, and vice versa.   15. What is the gain of an inverting amplifier?The gain of inverting amplifier is Av= – Rf/Ri.

Introduction The audio power amplifier, also called power amp, is a sound-producing device that reconstructs the input audio signal on the output element. The reconstructed signal volume and power level must be idea, effective and low distortion. The audio frequency range is about 20Hz to 20000Hz, so the amplifier must have a good frequency response in this range. Depending on the application, the power level varies greatly, from the milliwatt level of earphones to the several watts of TV or PC audio, to the tens of watts of home stereo and car audio, to the more powerful home and commercial audio, even the system’s hundreds of watts are large enough to meet the sound requirements of the movie theater or auditorium. Catalog Introduction Ⅰ What is Audio Power Amplifier? Ⅱ Types of Audio Power Amplifiers 2.1 Class A Power Amplifier 2.2 Class B Power Amplifier 2.3 Class AB Power Amplifier 2.4 Class D Power Amplifier Ⅲ Audio Power Amplifiers Comparisons Ⅳ Audio Power Amplifier Circuit Architecture Ⅴ Typical Audio Amplifier Circuits Examples Ⅵ FAQ Ⅰ What is Audio Power Amplifier? Audio power amplifier is one of the important components of multimedia products and is widely used in the field of consumer electronics. Linear audio power amplifiers have always dominated the traditional audio amplifier market due to their low distortion and good sound quality. With the popularization of portable multimedia devices such as mobile phones, tablet PC, and notebook computers, the efficiency and volume of linear power amplifiers can meet the requirements of the market, for example, class D power amplifiers have become more and more popular for their advantages such as high efficiency and small size.The development of audio amplifier has experienced three generations of electron tube (vacuum tube), bipolar transistor and field effect tube. The tube audio amplifier has a mellow tone, but it is bulky, with the disadvantages of high power consumption, extremely unstable, and poor high-frequency response. Bipolar transistor audio amplifiers have bandwidth, large dynamic range, high reliability, long life, and high-frequency response, but its static power consumption and on-resistance are very large, so it is difficult to improve its efficiency. The FET audio amplifier has the same mellow tone as the electronic tube, and its dynamic range is wide, and more importantly, its on-resistance is small, which can achieve very high efficiency. audio power amplifier" width="410" height="250" /> Figure 1. Hi-Fi Audio Power Amplifier Ⅱ Types of Audio Power Amplifiers There are many types of audio power amplifiers, and more than ten modes of it commonly used, such as Class A, Class B, Class AB, Class C, Class D, Class E, Class F, Class G, Class H, and Class S, but only four types suitable for audio applications: Class A, Class B, Class AB and Class D. 2.1 Class A Power Amplifier The main feature of the Class A power amp is: The operating point Q of the amplifier is set near the midpoint of the load line, and the transistor is turned on during the entire cycle of the input signal. The amplifier can work in a single tube or push-pull state. Since the amplifier works in the linear range of the characteristic curve, transient and alternating distortion are small. The circuit is simple and the debugging is convenient. Class A power amplifiers only need one transistor to provide current to the load, and the conduction angle is 360°C during a complete signal cycle. This kind of power amplifier has low distortion, but often requires a large static current and is low in efficiency. Theoretically, the maximum working efficiency of a class A power amplifier is 25%, so a heat sink is required when working. 2.2 Class B Power Amplifier Class B power amplifier is composed of two complementary transistors. In a complete signal cycle, each amplifier tube will be turned on in one half cycle and turned off in the other half cycle, that is, the conduction angle is only 180°C. Because it has no static current, it has a higher efficiency. In theory, the maximum efficiency of a Class B power amplifier can reach 78%. However, when the input signal is close to zero, the amplifier tube has a critical conduction state, resulting in crossover distortion. 2.3 Class AB Power Amplifier Class AB power amplifier inserts two diodes into the input end of the Class B power amplifier. When the input is close to zero, the amplifier tube has been slightly turned on, so that the conduction angle of each amplifier tube is greater than 180°C and less than 360°C. It overcomes the crossover distortion of Class B power amplifiers, and the efficiency is between Class A and Class B power amplifiers, based on a common structure of traditional linear power amplifiers. However, the medium output voltage is usually far away from the power supply voltage, and a lot of power consumption is consumed in the transistor. Therefore, even a well-designed amplifier, its efficiency is still low. 2.4 Class D Power Amplifier Class D (digital audio power) power amplifier is a kind of input analog audio signal or PCM digital information into PWM (pulse brightness modulation) or PDM (pulse density modulation) pulse signals, which is used to control the amplifier power switching devices turn on/off audio power amplifiers, also known as switching amplifiers. It has the outstanding advantage of high efficiency.The output stage of the Class D power amplifier consists of two complementary power tubes. Driven by the high-frequency control pulse signal, the power tubes work in the on-off state. One is turned on and the other is turned off. Therefore, the amplifier does not require static power consumption, that is, it has a very high efficiency. In theory, the efficiency of Class D power amplifiers can reach 100%, but in fact it is over 80%, which is 2 to 3 times that of traditional linear power amplifiers.The digital audio power amplifier also looks like a one-bit power digital-to-analog converter. The amplifier is composed of four parts: input signal processing circuit, switching signal forming circuit, high-power switching circuit (half-bridge and full-bridge) and low-pass filter (LC). In electronics, Class D amplifiers use a very high frequency switch circuit to amplify the audio signal. DIY Class D Audio Amplifier Class D amplifiers have the following advantages:1) It has a high efficiency, usually above 85%.2) Small size, which can save a lot of space than analog amplifier circuits.3) Connection without crack noise.4) Have low distortion and good frequency response curve. Few peripheral components, easy to design and debug.   Ⅲ Audio Power Amplifiers Comparisons 1) Class A, B, and AB amplifiers are analog amplifiers, and class D amplifiers are digital amplifiers. 2) Class B and Class AB push-pull amplifiers have higher efficiency and less distortion than Class A amplifiers, and their transistors consume less power and have better heat dissipation. However, Class B amplifiers will have poor switching characteristics during the transition between transistor on and off states or cause alternate distortion due to improper selection of circuit parameters. 3) The Class D amplifier has high efficiency and low distortion, a good frequency response curve, and fewer peripheral components. 4) Class AB amplifier and Class D amplifier are the basic circuit forms of audio power amplifiers at present. Figure 2. Amplifier Circuit Example Ⅳ Audio Power Amplifier Circuit Architecture The purpose of audio amplifier is to reproduce the audio input signal with high efficiency and low distortion on the sound output element at the required volume and power level. The frequency range of the audio signal is 20 Hz to 20000 Hz, so the audio amplifier must have a good frequency response. Audio amplifiers usually consist of preamplifiers and power amplifiers.PreamplifierThe amplitude of the audio signal source signal is generally very small and cannot directly drive the power amplifier. Therefore, they must be amplified to a certain condition first, which requires the use of a preamplifier. In addition to the signal amplification function, it can also have functions such as volume adjustment, tone control, loudness control, and channel equalization.Power amplifierThe power amplifier is referred to as the power amplifier for short, and its purpose is to provide the load with a large enough current drive capability to achieve power amplification. Class D power amplifier works in the on-off state. In theory, it does not require static current and has high efficiency.The topological structure of a typical Class D power amplifier circuit is shown in Figure 2: It consists of a triangle wave generator, a comparator, a power output stage and an LC low-pass filter. Figure 3. Class D Power Amplifier Circuit Figure 2 is a schematic diagram of the working principle of a Class D power amplifier. The sine wave audio input signal and the triangular wave signal with a much higher frequency are modulated by the comparator to obtain a PWM modulation signal whose duty cycle is proportional to the amplitude of the input signal. It pushes the output power tube to work in the on-off state. The output end of the tube obtains an output signal with a constant duty cycle. The amplitude of the output signal is the power supply voltage and has a strong current drive capability. After signal modulation, the output signal contains both the input signal and the fundamental component of the modulated triangle wave, as well as their higher harmonics and combinations. After LC low-pass filtering, the high-frequency components in the output signal are filtered out, and a low-frequency signal with the same frequency and amplified amplitude as the original audio signal is obtained on the load.   Ⅴ Typical Audio Amplifier Circuits Examples The following is a brief introduction of AN7115 audio power amplifier circuit. Figure 4. AN7115 Audio Amplifier Circuit AN7115 has an output power of 2.1W and a noise output of 3mV under the conditions of V=9.0V, THD=10%, and RL=8Ω.Limit parameters: Vcc=13V, power dissipation (without radiator) is 1.2W, and 2.25W with a radiator. Working temperature: -20℃ to 70℃, suitable for small portable radio recorders and audio equipment as power amplifiers. TDA2030 adopts V-shaped 5-pin single in-line plastic package structure. According to the shape of the pin, it can be divided into H-type and V-type. This integrated circuit is widely used in car stereo radio and tape recorders and mid-power audio equipment. It has the characteristics of small size, high output power, low distortion, etc., and has an internal protection circuit. Circuit characteristics are as followed: Figure 5. TDA2030 Audio Power Amplifier Circuit 1) Very few external components.2) The output power is large, Po=18W (RL=4Ω).3) The use of ultra-small package (TO-220) can increase the assembly density.4) The boot impact is minimal.5) It contains various protection circuits, so it is safe and reliable to work. The main protection circuits include: short circuit protection, thermal protection, ground wire coupling open circuit, power supply polarity reverse connection (Vsmax=12V), and load discharge voltage kickback, etc. Figure 6. Mini Audio Power Amplifier Ⅵ FAQ 1. What is audio power amplifier?An audio power amplifier (or power amp) is an electronic amplifier that amplifies low-power electronic audio signals such as the signal from radio receiver or electric guitar pickup to a level that is high enough for driving loudspeakers or headphones. Audio power amplifiers are found in all manner of sound systems including sound reinforcement, public address and home audio systems and musical instrument amplifiers like guitar amplifiers.   2. How do audio amplifiers work?An amplifier takes an input signal from a source, such as a laptop, turntable or CD player, and creates a larger copy of the original signal before it's sent to the speakers. It gets the power to do this from your mains electricity, which is sent directly to the power supply within the amplifier.   3. What does an audio power amplifier do?An audio power amplifier (or power amp) is an electronic amplifier that amplifies low-power electronic audio signals such as the signal from radio receiver or electric guitar pickup to a level that is high enough for driving loudspeakers or headphones.   4. What is the most powerful audio amplifier?Classic audio brand McIntosh has announced its most powerful integrated amplifier. The fully loaded, hybrid MA12000 Integrated Amplifier is McIntosh's most powerful integrated amplifier ever offering 350W per channel.   5. Do you need amplifier for speakers?Powered speakers do not need an amplifier. They have an amplifier already installed in them which is why they are called 'powered speakers' to begin with. Depending on the speakers' input options, you can hook them up to different audio sources without the need for a separate amplifier.   6. Does an amplifier improve sound quality?Amplifiers ideally amplify audio signals linearly and, therefore, do not technically improve or worsen sound quality. However, less-than-ideal amplifiers, amp settings and amplifier-speaker combinations may worsen sound quality. Amps are nevertheless needed to drive speakers and headphones properly.   7. Why do I need a power amplifier?Some users prefer to separate input switching and AV processing from the task of providing power for, and connection of, loudspeakers through separate AV preamp/processors and power amplifiers. ... A separate preamp and power amp results in more equipment and cable clutter.   8. Which is better power amplifier or integrated amplifier?A preamplifier / power amp does generally offer better quality; while flat output has become common place, keeping your switching circuitry separate from your amplification and having two separate power supplies can reduce the internal interference that can be introduced into your signal.   9. What is a home audio amplifier?A home theater amplifier (also known as an audio-visual receiver or simply an AVR) is a powerful piece of kit that combines amplifiers and digital signal processors to convert output from a range of source devices into high quality sound and video. In short, it is the hub of a home theater set up.   10. What is the most powerful audio amplifier?Classic audio brand McIntosh has announced its most powerful integrated amplifier. The fully loaded, hybrid MA12000 Integrated Amplifier is McIntosh's most powerful integrated amplifier ever offering 350W per channel.   11. What is the purpose of an audio amplifier?The goal of audio amplifiers is to reproduce input audio signals at sound-producing output elements, with desired volume and power levels—faithfully, efficiently, and at low distortion.   12. What do you mean by audio amplifier?Any electronic device that increases the power of an electrical signal whose vibrations are confined to the audio frequency range—the range that can be perceived by the human ear—is an audio amplifier.

IntroductionWith the advancement of automobile technology, an increasing number of cars are equipped with car tire pressure monitoring systems, which provide us with a quick and real-time understanding of the car tire pressure, and we no longer have to worry about insufficient and excessive tire pressure before driving, and the car tire pressure monitoring system has brought great convenience to our car. Currently, most car tires are equipped with pressure sensors to detect pressure changes in order to ensure the safety of car driving. According to relevant statistics, tire pressure reaches a reasonable value, which can not only improve driving safety but also reduce fuel consumption. So, how does a car tire pressure sensor work? This article will introduce in detail.Video: Tire Pressure Sensors CatalogIntroductionⅠ Principles of Tire Pressure Sensors in AutomobilesⅡ Design Background of TPMSⅢ Tire Pressure Sensors in a Tire Pressure Monitoring SystemⅣ Details of Tire Pressure Sensors in Direct Tire Pressure Monitoring SystemⅤ SummaryⅥ Frequently Asked Questions about Tire Pressure Sensors Ⅰ Principles of Tire Pressure Sensors in Automobiles1.Strain Sensors in AutomobilesThe principle of a strain sensor is primarily based on the resistive strain effect,when the conductor undergoes mechanical deformation due to external action, a corresponding change in resistance value occurs. Calculate the required pressure by first calculating the magnitude of strain using the relationship between the change in resistance value and the change in output electrical signal. The strain gauge pressure sensor is primarily used to measure the dynamic or static pressure of a flowing medium, such as the inlet and outlet gas or liquid pressure of power pipeline equipment, engine pressure, internal combustion engine pipeline pressure, and so on.The most widely used strain gauge is the paste strain gauge (strain gauge). Its main disadvantages are small output signal, narrow linear range, and poor dynamic response (see resistance strain gauge, semiconductor strain gauge). However, due to the small size of strain gauge, many specifications of commercial strain gauge can be selected, and the form of elastic sensor can be flexibly designed to adapt to various applications, strain type pressure sensor made by strain gauge is still widely used. According to the different structure of elastic sensor, strain type pressure sensor can be roughly divided into strain tube type, diaphragm type, strain beam type and combined type.Figure:Strain Sensors in Automobiles 2.Piezoresistive Pressure Sensors in AutomobilesThe piezoresistive pressure sensor's pressure sensitive element is a piezoresistive element that operates on the piezoresistive effect. The term "piezoresistive element" actually refers to the diffusion resistance created by integrated circuit technology on a semiconductor substrate. When subjected to external force, its resistance changes due to resistivity change. During normal operation, diffusion resistors must be attached to elastic elements, and monocrystalline silicon diaphragms are commonly used.The piezoresistive pressure sensor's main advantages are its small size, relatively simple structure, good dynamic response, high sensitivity, and ability to measure micro pressures of more than ten Pascals. It is a relatively ideal one, and it is currently being developed and applied at a rapid pace. Sensor of pressure. Non-linearity and temperature affect the measurement accuracy of this sensor, affecting the size of the piezoresistive coefficient. Microprocessors are used in today's intelligent piezoresistive pressure sensor to compensate for nonlinearity and temperature. It integrates the sensor and computer on the same silicon chip using large-scale integrated circuit technology, and it has functions such as signal detection, processing, and memory. As a result, the sensor's stability and measurement accuracy are greatly improved.Figure:Piezoresistive Pressure Sensor 3.Other Automotive Pressure SensorsFurthermore, differential transformer type pressure sensors (LVDT) and surface elastic wave pressure sensors are available (SAW). SAW type pressure sensors have small size, light weight, low power consumption, high reliability, high sensitivity, high resolution, digital output, and so on. LVDT type pressure sensors have larger output, easy to digital output, but poor anti-interference. It is used to detect the pressure of an automobile suction valve and can operate reliably in high temperatures. Ⅱ Design Background of TPMSThe tire pressure influences both the car's excellent performance and the length of the tire's service life. According to SAE (Society of Automotive Engineers) data, there are more than 260,000 traffic accidents caused by tire failure in the United States each year, with flat tires accounting for 70% of highway accidents. Furthermore, natural tire leakage or under-inflation is the leading cause of tire failure. Every year, approximately 75% of tire failures occur. The data also shows that in high-speed driving, punctures caused by tire failure are a major cause of traffic accidents.Flat tires, the unseen killer, have caused numerous human tragedies and incalculable economic losses to the country and businesses. As a result, in order to reduce the number of traffic accidents caused by flat tires, the US federal government has mandated that automakers accelerate the development of TPMS ( Tire Pressure Monitoring System).Figure:Tire Pressure Monitoring System Ⅲ Tire Pressure Sensors in a Tire Pressure Monitoring SystemThere are two main tire pressure monitoring system solutions: direct system and indirect system.The direct tire pressure monitoring system measures tire pressure directly using the pressure sensor installed in each tire and displays and monitors the tire pressure. The system will automatically alert if the tire pressure is too low or if there is a leak.To monitor tire pressure, the indirect tire pressure monitoring system compares the speed difference between tires using the wheel speed sensor of the automobile abs system.The main disadvantages of this type of system are as follows: 1. The accurate instantaneous air pressure value of each tire cannot be displayed; 2. It is not possible to alarm when the pressure of the same axle, same side wheel, or all tires drops at the same time; and 3. Factors such as vehicle speed and detection accuracy cannot be taken into account simultaneously.Figure:Tire Pressure Sensors in a TPMS Ⅳ Details of Tire Pressure Sensors in Direct Tire Pressure Monitoring SystemThere are two types of direct tire pressure monitoring systems: active and passive.The active system makes capacitive or piezoresistive pressure sensors on silicon using mems technology. Each rim has a pressure sensor, and the signal is transmitted via radio frequency. It is set up in the wireless cab. The pressure sensitive signal is received by the receiving device, which then displays the current tire pressure after some signal processing.The advantage of active technology is that it is relatively mature, and the modules developed can be applied to tires of various brands, but the disadvantages are also more noticeable. Its induction module requires battery power, posing a problem with system service life.The passive tire pressure monitoring system's sensor is based on surface acoustic waves. A radio frequency electric field is used to generate a surface acoustic wave in this sensor. The surface acoustic wave changes as it passes through the surface of the piezoelectric substrate material. The change in the surface acoustic wave can indicate tire pressure. Although this technology does not require battery power, it does necessitate the integration of the transponder into the tire, and it can only be implemented if tire manufacturers agree on a common standard. The tire pressure monitoring system must detect abnormal tire pressure conditions, and it can only do so with high resolution and accuracy. Battery life is limited, and capacity is affected by temperature as well. It is best for the sensor to perform passive detection in order to improve system reliability. According to studies, the information collected by tire pressure sensors can be used to monitor vehicle suspension failures and correct navigation systems. As a result, the future automotive pressure sensor should be a passive intelligent sensor with multiple functions. Ⅴ SummaryIn recent years, automotive sensors have been the fastest growing and most widely used sensor category. The growth of the automotive industry encourages the rapid development of automotive pressure sensors. Sensor performance is improving as a result of advances in manufacturing and process technology, and tire pressure monitoring is becoming increasingly important. Ⅵ Frequently Asked Questions about Tire Pressure Sensors1.When should a tire pressure sensor be replaced?TPMS sensors are designed to last for many years.5-10 years is a likely lifespan. Given their cost, most drivers will be inclined to replace TPMS sensors on an “as needed” basis.In other words, only once their batteries have expired, or other TPMS components have failed. 2.Is it safe to drive with tire pressure sensor fault?No, driving with the TPMS Light on is not safe. It means one of your tires is underinflated or overinflated. This can cause undue wear on the tire, potentially lead to a tire failure, and cause a blowout dangerous to you and other drivers on the road. 3.How much does it cost to replace a tire pressure sensor?The average cost for TPMS sensor replacement is between $207 and $257. Labor costs are estimated between $53 and $67 while parts are priced between $154 and $190. This range does not include taxes and fees, and does not factor in your specific vehicle or unique location. Related repairs may also be needed. 4.How do you fix a tire pressure sensor?Without starting the car, turn the key to the “On” position. Press the TPMS reset button and hold it until the light blinks three times, then release it. Start the car and let it run for 20 minutes to reset the sensor. You'll usually find the tire pressure monitor reset button beneath the steering wheel. 5.How do I know if my tire pressure sensor is bad?A small light illuminates at the dashboard's display panel whenever there is a problem with the tire pressure sensors. It appears as a vivid yellow exclamation point inside of a U symbol; you'd be easily able to spot it. As soon as it turns on, the driver must check the tire for less or no air.  

IntroductionPrinted Circuit Board(PCB) is a board of most modern electronic devices that has lines and pads that connect various points together. Even if it is a small board, its manufacturing process is very cumbersome and exquisite. Here will introduce the PCB manufacturing process steps by steps with pictures and video.How is PCB made?The following are the detailed PCB producing processes:IntroductionStep 1. PCB CAD FileStep 2. Plate ProductionStep 3. PCB Inner LayersStep 4. Board Punching and CheckingStep 5. LaminationStep 6. DrillStep 7. Copper Chemical Precipitation on the HolesStep 8. PCB Outer LayersStep 9. Computer Control and Copper ElectroplatingStep 1. PCB CAD FileThe first step in PCB production is to organize and check the PCB layout. The PCB manufacturers get the CAD files from the PCB design company, and they will convert them into a unified format-Extended Gerber RS-274X or Gerber X2, because each CAD software has its own unique file format. Then the electronic engineers will check whether the PCB layout conforms to the manufacturing process, and whether there are any defects and other issues.Figure 1. PCB CAD FileWhen making a PCB at home, the PCB layout can be printed on paper with a laser printer, and then transferred to the copper clad laminate. During the printing process, because the printer is prone to lack of ink and breakpoints, it is necessary to manually fill up the ink with an oil-based pen. Figure 2. PCB Laser PrintingHowever, the factory generally uses photocopying to print the PCB layout on the film. If it is a multi-layer PCB, the layout film photocopied on each layer will be arranged in order.Figure 3. PCB Film Arranged in OrderThen the film will be punched with alignment holes. Alignment holes are very important, which is essential to align the materials of each layer of the PCB.Step 2. Plate ProductionClean the copper plate. If there is dust, it may cause the final circuit to be short-circuited or broken.Figure 4. Clean the Copper PlateThe figure below is an example of an 8-layer PCB, which is actually made up of 3 copper clad laminates plus 2 copper films, and then glued them together with prepregs. The production sequence is to start with the middle board (4th- and 5th-layer of circuits), continuously stack together, and then fix. The production of 4-layer PCB is similar, including one core board and two copper films.Figure 5. 8-layer PCB Plate DisplayStep 3. PCB Inner LayersFirst, make the two-layer circuit of the middle core board. After the copper clad laminate is cleaned, it will be covered with a photosensitive film on the surface. This film will solidify when exposed to light, forming a protective film on the copper foil.Figure 6. PCB CoreInsert the two-layer PCB layout film and the double-layer copper clad laminate into the upper PCB layout film to ensure that the upper and lower PCB layout films are stacked accurately.Figure 7. PCB Layout Film PlacingThe machine irradiates the photosensitive film on the copper foil with a UV lamp. The transparent film is cured under the light, and there is still no cured photosensitive film. The copper foil covered under the cured film is the required PCB layout, which is equivalent to the function of the laser printer ink of the manual PCB. In addition, the copper foil covered by the black film will be corroded away, and the cured transparent film will be preserved.Figure 8. Cured Photosensitive FilmClean the uncured photosensitive film with lye, and the required copper foil circuit will be covered by the cured film.Figure 9. Clean Uncured Photosensitive FilmThen use a strong base, such as NaOH, to etch away the unnecessary copper foil.Figure 10. Copper Foil EtchingTear off the cured photosensitive film to expose the copper foil of the required PCB layout.Figure 11. Tear Off the Cured Photosensitive FilmStep 4. Board Punching and CheckingThe core board has been successfully produced. Then punch alignment holes on it to facilitate with other materials.Figure 12. Punch Alignment Holes on PCBOnce the core board is pressed together with other layers, it cannot be modified. So PCB checking is very important. The machine will automatically compare with the PCB layout drawing to find out the error.Figure 13. PCB Layout Drawing ComparisonThe first two layers of PCB boards have been made.Step 5. LaminationA new raw material is introduced here called Prepreg, which is the adhesive among the core boards(PCB layers>4), as well as the core board and the outer copper foil, and it also plays a role in insulation.Figure 14. PCB Prepreg and CopperThe lower copper foil and the two layers of prepreg have been fixed in advance through the alignment hole and the lower iron plate, and then the finished core board is also placed in the alignment hole, and finally the two layers of prepreg, a layer of copper foil and a layer of pressure-bearing aluminum plate covers the core plate.Figure 15. Fixed PCB Prepreg and CopperIn order to improve work efficiency, this factory will stack three different PCB boards together before fixing them. The upper iron plate is magnetically attracted to facilitate alignment with the lower iron plate. After the two layers of iron plates are successfully aligned by inserting the alignment pins, the machine compresses the space between the iron plates as much as possible, and then fixes them with nails.Figure 16. Fixed PCB LayersThe PCB boards clamped by the iron plates are placed on the holder, and then sent to the vacuum heat press for laminating. The high temperature can melt the epoxy resin in the prepreg and fix the core boards and copper foils together under pressure.Figure 17. PCB Layers LaminationAfter the lamination, remove the upper iron plate that presses the PCB. Then remove the pressure-bearing aluminum plate. The aluminum plate also plays the role of isolating different PCBs and ensuring the smoothness of the outer copper foil of the PCB. Finally the PCB taken out at this time will be covered by a layer of smooth copper foil.Figure 18. Remove the Upper Iron Plate and Aluminum PlateStep 6. DrillSo how to connect 4 layers of copper foils that are not in contact with each other in the PCB? First, make the through-hole through the PCB, and then metalize the hole wall to conduct electricity.Figure 19. PCB DrillPut a layer of aluminum plate on the punching machine, and then put the PCB on it. Since drilling is a relatively slow process, in order to improve efficiency, according to the number of layers of the PCB, 1 to 3 identical boards are stacked for drilling together. Finally, cover the uppermost PCB with a layer of aluminum plate. The upper and lower of aluminum plates are used to prevent the copper foil on the PCB from tearing when drilling.Figure 20. PCB DrillNext, you only need to select the correct drilling program on the computer, and the rest is done automatically by the drilling machine. The drill bit is driven by air pressure, and the maximum rotation speed can reach 150,000 revolutions per minute. Because such a high rotation speed is sufficient to ensure the smoothness of the hole wall.Figure 21. Drill ProgramThe replacement of the drill bit is also automatically completed by the machine according to the program. The smallest drill bit can reach a diameter of 100 microns, while the diameter of a human hair is 150 microns.Figure 22. Drill ReplaceIn the previous process, the molten epoxy was squeezed out of the PCB, so it needed to be cut off. Here the profiling milling machine cuts its periphery according to the correct XY coordinates of the PCB.Figure 23. Cuts PCB PeripheryStep 7. Copper Chemical Precipitation on the HolesSince almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25-micron copper film on the hole wall. The thickness of the copper film needs to be realized by electroplating, but the hole wall is composed of non-conductive epoxy resin and glass fiber board. So the first step is to deposit a layer of conductive material on the hole wall, and form a 1 micron copper film on the entire PCB surface by chemical deposition. The entire process such as chemical treatment and cleaning is controlled by the machine.Step 8. PCB Outer LayersNext, the PCB outer layer is transferred to the copper foil. The process is similar to the transfer principle of the previous PCB inner core board. The PCB layout is transferred to the copper foil by photocopying film and photosensitive film. The only difference is positive films will be used as boards.The transfer of the internal PCB layout described above uses the subtractive method, and the negative film is used as the board. The PCB is covered by the cured photosensitive film as a circuit, and the uncured film is cleaned. After the exposed copper foil is etched, the PCB layout circuit is protected by the cured film. The transfer of the outer PCB layout adopts the normal method, and the positive film is used as the board. The non-circuit area is covered by the cured photosensitive film on the PCB. After cleaning the uncured film, electroplating is performed. Where there is a film, it cannot be electroplated, and where there is no film, copper is plated first and then tin is plated. After the film is removed, alkaline etching is performed, and finally the tin is removed. So the circuit pattern remains on the board because it is protected by tin.Put the cleaned PCB on both sides of the copper foil into the laminating machine, and the photosensitive mold will be pressed onto the copper foil.Figure 24. LaminatorFix the printed PCB layout film of the upper and lower layers through the holes, and put the PCB board in the middle. Then, the photosensitive film under the light-transmitting film is cured by the irradiation of the UV lamp, which is the circuit that needs to be reserved.Figure 25. PCB Expose to the UV LightAfter cleaning off the unnecessary and uncured photosensitive film, inspect the PCB board.Figure 26. PCB CheckingClamp the PCB with clips, and electroplate the copper. As mentioned earlier, in order to ensure that the holes have sufficient conductivity, the copper film plated on the hole walls must have a thickness of 25 microns, so the entire system will be automatically controlled by the computer to ensure its accuracy.Figure 27. PCB Copper PlatingStep 9. Computer Control and Copper ElectroplatingAfter the copper film is electroplated, the computer gives instructions to electroplate a thin layer of tin. Then, check to ensure that the thickness of the plated copper and tin is correct.Figure 28. Electroplated Copper and Tin InspectionNext, a complete automated assembly line completes the etching process. Then, clean the cured photosensitive film on the PCB.Figure 29. Clean Cured Photosensitive FilmThen use a strong alkali to clean the unnecessary copper foil covered by it.Figure 30. Clean the Unnecessary Copper FoilFinally, use the tin stripping solution to strip the tin plating on the PCB layout copper foil. After cleaning, the 4-layer PCB layout is complete. Frequently Asked Questions about PCB Manufacturing Process1. Which are the techniques of PCB manufacturing?There are several PCB manufacturing methods that a PCB can be submitted to before reaching the final product. These methods include preparing the board's surface, placing components, soldering, cleaning, and inspection and testing. 2. What is PCB design process?Step 1 – The DesignStep 2 – Printing the DesignStep 3 – Creating the SubstrateStep 4 – Printing the Inner LayersStep 5 – Ultraviolet LightStep 6 – Removing Unwanted CopperStep 7 – Inspection.Step 8 – Laminating the Layers 3. Which software is best for PCB design?Top 8 Best PCB Design Software of 2021PROTEL (Altium Designer)PADS (PowerPCB)ORCADAllegroEagle (Easily Applicable Graphical Layout Editor)KicadEasyEdaFritzing 4. What is a PCB layer?A PCB is defined as a number of copper layers in a well defined sequence. Copper layers of a PCB are usually just named layers or also called SIGNAL layer. However, to define the complete PCB, other layers are required. They are usually named by their functionality and position. 5. What are the components of a PCB?Some common PCB components include:Battery: provides the voltage to the circuit.Resistors: control the electric current as it passes through them. They’re colour coded to determine their value.LEDs: light emitting diode. Lights up when current flows through it, and will only allow current to flow in one direction.Transistor: amplifies charge.Capacitators: these are components which can harbour electrical charge.Inductor: stores charge and stops and change in current.Diode: allows current to pass in one direction only, blocking the other.Switches: can either allow current or block depending if they are closed or open.