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Silicon Valley startup Flex Logix Technologies has announced that it is now in the business of selling newly developed programmable chip technology to hardware makers—they believe they have found a new way to produce field-programmable gate arrays (FPGAs) that is both cheaper and more amendable to being added to existing systems.For many years hardware and software have held on to a rigid standard—hardware was designed in a very generic way then set firm—the IC chips were given the ability to do certain things, and that was it. Software was then created to run on the platform that had been developed. But this old-school design strategy has one serious flaw—hardware updates take too long and cost too much money. Into this void steps Geoff Tate, CEO of Flex Logix—he claims that engineers with his company have come up with a new and better way to create FPGAs, paving the way for their use in a variety of specialized applications. FPGAs are identical in most respects to regular old microprocessors, at least in how they function—the difference is that they can be programmed. The reason that all of the microprocessors in our phones, computers, etc. aren't FPGAs is because they cost more to make and consume more energy. Tate claims that his engineers have figured out a way to put all the programmable logic on the same chip, something that other big-name makers have not been able to do. That makes things easier for chip designers and for those on the manufacturing end, making the new chips a viable option for certain applications.Tate says that communications gear is one of the best candidates for the new chip design—standards, needs and new advances mean they could benefit greatly from chips that could be updated when needed, instead of going back to the design table every round. Another area where the chips could prove useful is large data centers—just last year Microsoft announced that it had put FPGAs into its Bing search system and saw a speed-up of 95 percent.Instead of making the chips, Flex Logix plans to license its technology to others in the field or directly to those already making the old-fashioned kind. As a sign of the company's optimism, Tate recently told the media that he expects to see products based on the new technology hitting the market as early as next year. 

The ongoing research in the field of microelectronics and semiconductor microchips is made by Dr. Yue Kuo, professor in the Artie McFerrin Department of Chemical Engineering at Texas A&M University, is continuing, which is evolving everyday technology such as cellphones, televisions, computers and more through the use of light emitting diodes (LED).Kuo's research group focuses on the development of semiconductors for micro and nano electronic uses. This has entailed working with technologies from television screens to devices like universal serial bus (USB) flash drives to make them faster, smaller and more power efficient.Kuo and his research group have developed a new type of LED known as a solid state incandescent light emitting device (SSI-LED). This device would emit light for an extended lifetime at a very low energy cost. Kuo currently has one of these LEDs his group has deployed that has been continuously emitting light for in excess of 18,000 hours. The development of these LED devices has progressed from the same kind of technology that powered the first incandescent light bulb developed by Thomas Edison."The chips used to make electronic devices work from the vacuum tube," Kuo said. "It was invented in 1907, and this tube was big. The first computer ever invented was made of thousands of these tubes. However, these vacuum tubes are not very reliable and the power consumption is very high and they burn out easily."Kuo explains that technology has leaped from the vacuum tube, to transistor, to the modern microchip, which enables scientists to fit billions and billions of transistors into a single chip. Beyond microchips are the semiconductors that Kuo primarily works with that form the essential computer hardware components of electronic circuits. While advanced, similar issues that plagued traditional vacuum tubes such as a short life span and energy inefficiency, still effect modern day semiconductors, according to Kuo."What I and my group have done is invented a new light bulb that is very similar in comparison to the leap from a vacuum tube to a computer chip," Kuo said. "We make a small chip with no vacuum that can emit light, but is so small, smaller than your fingernail, that it will not burn out after even 20,000 hours of use.For comparison, current larger incandescent light bulbs have a maximum lifespan of around 2,000 hours of use, meaning that Kuo's SSI-LED is both more energy efficiency and has greater device longevity than conventional technology in addition to being no bigger than a human fingernail. The SSI-LED that Kuo and his group have developed has many uses, one of which includes potentially using the light emitting technology to transfer electrical signals within computing devices. Kuo believes that a development of this magnitude would change the way everyday computer users are able to communicate with one another."The computer chips we have today are very fast, but as you know nothing satisfies us and no matter how fast we have, we want faster," Kuo said. "We've come, in terms of the modern design for computer chips, almost near the limit. The current speed is limited by how fast the signal is transmitted by metal. What we want to do is to transmit signals by light."The LED Kuo's group has invented is made out of silicon, giving it the potential to transmit signals in machines by light. This method would send signals tens of thousands of times faster than current transmission methods allow."SSI-lEDs are an extension of Edison's technology in a way," Kuo said. "Inside each are many, many small dots that emit light, each one is like Edison's lamp. The engineers in my group use chemical engineering training to make computer chips and transistors that we make into things like your LCD TV's that affect the lives of all people every day and that kind of potential is limitless." 

When a global leader in providing equipment, services and software used for manufacturing semiconductors makes an announcement, industry players sit up and listen, as the technologies are going to impact market activity in devices such as smartphones, flat screen TVs and solar panels. Tuesday's announcement from Applied Materials was big. The Santa Clara, California based equipment supplier announced the launch of its Endura Volta CVD Cobalt chip making machine. This is the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films, said the company. The news is in the word "cobalt." The company sees cobalt as a superior metal encapsulation film. "Applied Materials announced that the Endura Volta CVD Cobalt system represents the first material change in more than 15 years of copper barrier/seed (CuBS) development, "a new materials era" for extending copper interconnect technology. It is not only the first material change but an important change in materials for microchip wiring. Actually, the news is in the word "cobalt" and in the word "wiring." The reliability and performance of the wiring that connects the billions of transistors in a chip is critical to achieve high yields for device manufacturers. "As wire dimensions shrink to keep pace with Moore's Law, interconnects are more prone to killer voids and electromigration failures," said Dr. Randhir Thakur, executive vice president and general manager of the Silicon Systems Group at Applied Materials.Writing in the Applied Materials blog, Kavita Shah, global product manager, commented on the announcement: With today's dimensions, she said, "it becomes exceptionally difficult to achieve perfect copper fill in 100% of the trenches and vias that make up the circuitry of a device. Other performance-degrading effects, such as electro-migration, which can cause movement of copper that leaves voids in the wiring, also become significantly more problematic. The smallest defect can kill a device; interconnect performance and reliability begin to suffer under these conditions."The announcement said that complete envelopment of copper lines with cobalt creates an engineered interface that demonstrates over 80x improvement in device reliability.Writing in The Wall Street Journal, Don Clark said the company has announced a way "to head off defects that are becoming a stumbling block as manufacturers keep shrinking the size of transistors that act as tiny switches on chips." Customers who want to make the shift will buy the production machine to apply the cobalt, using a process called chemical vapor deposition (CVD).According to the article, Sundar Ramamurthy, Applied's vice president and general manager of metal deposition products. said 75 of the CVD chambers for processing individual wafers are already in customer hands for testing purposes. Clark said, "The machines aren't likely to be introduced in large volumes "until manufacturers are ready for their next process change to create smaller transistors."    

Vendors and consumers can agree: connectivity matters, and not just poetically speaking, or in the context of social networking. As for many, staying digitally connected is quite real a requirement and has become a lifeline of its own, in terms of ability to do work and in terms of access to vital information. San Diego-based Ethertronics is a business that provides connectivity via antenna and RF systems solutions. On Tuesday the company announced news of an active steering IC, with embedded processor for Multiple Input Multiple Output (MIMO) applications. This is the EC482, with potential impact on cable and satellite markets. The company said its team can integrate EC482 products, including access points, set-top boxes, WiFi clients, WiFi extenders, wearables and other Internet of Things (IoT) devices.Translating what this means, Gigaom's senior writer Kevin Fitchard, who covers mobile broadband, carriers and wireless technologies, said that the new chip from Ethertronics "will bring its active steering algorithms to Wi-Fi antennas, increasing their range and boosting their throughput in less than optimal conditions." Ethertronics Chief Scientist Jeff Shamblin told Firchard that with the new version of the EtherChip, "active steering helps signals navigate multiple walls and ceilings which often separate a router from a Wi-Fi device."Quoted in RCR Wireless News, Shamblin, referring to the Active Steering technology, said, "Now that we can dynamically control the radiation pattern, not only can we improve the communication link you're trying to establish, we can start to null out interfering sources, so it brings interference mitigation."The EE Times explained that the company was leveraging its experience developing embedded antennas to create a line of dedicated beamforming chips. "Algorithms on EC482's processor monitor RF link performance on a wireless device to generate up to four radiation patterns and select the optimal antenna for the best performance," wrote Jessica Lipsky, associate editor. "The company's EtherChip EC482 aims to improve RF signal for Wi-Fi and 5 GHz backend applications."The company said the EtherChip EC482 had "superior single- and multi-antenna performance at frequencies even beyond the WiFi high-band." The operating frequency range is 100 MHz to 7000 MHz. The small footprint is just 3.0 x 3.0 x 0.75 mm3 in a QFN 24-pin package. Very low power consumption is required for operation, said the news release, which makes the EC482 suitable for even battery-operated systems.Ethertronics will show its new EtherChip EC482 and "Active Steering" solutions during Mobile World Congress next month in Barcelona.Laurent Disclos, Ethertronics CEO, shared his predictions in January for the new year in RCR Wireless News. "Regardless of the application – streaming a favorite show via a 5 GHz set-top box, keeping tabs on one's health via a wearable, or simply placing a voice call via a smartphone – the antenna is the only RF sensor in a wireless device, and those of us working to make that heartbeat stronger will have an exciting year in 2015, and beyond." 

Linear Technology introduces the LTM4631, a dual 10-A or single 20-A µModule (power module) step-down regulator in a 1.91-mm-high LGA package with a 16 x 16-mm footprint. The packaging is what makes this module significant and sets it apart from the competition. Why? Because the device provides a regulator, including the inductor, in one package, while others, like Intersil and Altera/Enpirion, need two chips for the solution. That means that the Linear product needs 400 mm2 compared to the 750 mm2 for the Intersil product and about 600 mm2 for the Altera/Enpirion solutions. At 1.91 mm, the height of the package is also very significant because it means it’s under 2.00 mm, which is a barrier to designs that aim to provide solutions for the underside of the PCB. Presently, Altera/Enpirion, at 1.85 mm, is the only other company that can offer a solution profile less than 2.00 mm. The LTM4631 regulator, although a very significant achievement in packaging, is not a solution for every design because not everyone is looking for a cutting-edge solution. However, for the targeted markets, designers could find this device to be aspirin for their design pains. It is a solution you can’t find anywhere else. The micro-module can be placed on a PCB very close to the load, such as an FPGA, and can share one heat sink covering both of the low-profile packages. It frees space on the topside for components such as DDR-QDR memory and transceiver ICs. Examples of applications include plug-in and mezzanine cards in embedded systems, data storage systems, gateway controllers, and 40- to 100-Gbps networks. These applications are very competitive and gaining space as shown in the figure is a significant advantage, to system designers.  When I first looked at this product, I was very impressed with the specs, especially the packaging, but the price could give you heartburn. Some companies with the technical chops could design a discrete solution for a much lower cost, but then there’s the obvious problem of excessive footprint caused by all of those components. There is also a potential of reduced reliability with discretes. At $24.88 ea/1,000, deciding to use this product isn’t quite a no-brainer, but if you do, it means that you want to spend your engineering time on what you design best, such as embedded systems or gateway controllers, and getting the extra board space for your latest product.  The LTM4631 wasn’t just a simple redesign of what Linear already offered, although according to Afshin Odabaee, business unit manager of power modules for Linear Technology, at the start of the regulator design, they thought it would take about six months to finish. It took much longer to finish — almost 2 years. But they learned a lot along the way, such as how to get the inductor smaller, what materials to use in the inductor, and even how to get the accuracy down to 1.5% for the total dc output error over line, load and temperature. The specs for the LTM4631 show that it operates from 4.5- to 15-V input supplies and regulates an output voltage from 0.6 to 1.8 V with ±1.5% maximum total dc output voltage error from –40°C to 125°C. Its two outputs operate 180° out-of-phase, each capable of delivering 10 A or 20 A when the outputs current share. Two devices can current share, delivering up to 40 A while minimizing input and output ripple current. The device features output overcurrent foldback and overvoltage protection. 

An alliance led by IBM Research today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches—transistors—on the fingernail-sized chips that power everything from smartphones to spacecraft.To achieve the higher performance, lower power and scaling benefits promised by 7nm technology, researchers had to bypass conventional semiconductor manufacturing approaches. Among the novel processes and techniques pioneered by the IBM Research alliance were a number of industry-first innovations, most notably Silicon Germanium (SiGe) channel transistors and Extreme Ultraviolet (EUV) lithography integration at multiple levels.Industry experts consider 7nm technology crucial to meeting the anticipated demands of future cloud computing and Big Data systems, cognitive computing, mobile products and other emerging technologies. Part of IBM's $3 billion, five-year investment in chip R&D (announced in 2014), this accomplishment was made possible through a unique public-private partnership with New York State and joint development alliance with GLOBALFOUNDRIES, Samsung, and equipment suppliers. The team is based at SUNY Poly's NanoTech Complex in Albany."For business and society to get the most out of tomorrow's computers and devices, scaling to 7nm and beyond is essential," said Arvind Krishna, senior vice president and director of IBM Research. "That's why IBM has remained committed to an aggressive basic research agenda that continually pushes the limits of semiconductor technology. Working with our partners, this milestone builds on decades of research that has set the pace for the microelectronics industry, and positions us to advance our leadership for years to come."Microprocessors utilizing 22nm and 14nm technology power today's servers, cloud data centers and mobile devices, and 10nm technology is well on the way to becoming a mature technology. The IBM Research-led alliance achieved close to 50 percent area scaling improvements over today's most advanced technology, introduced SiGe channel material for transistor performance enhancement at 7nm node geometries, process innovations to stack them below 30nm pitch and full integration of EUV lithography at multiple levels. These techniques and scaling could result in at least a 50 percent power/performance improvement for next generation mainframe and POWER systems that will power the Big Data, cloud and mobile era."Governor Andrew Cuomo's trailblazing public-private partnership model is catalyzing historic innovation and advancement. Today's announcement is just one example of our collaboration with IBM, which furthers New York State's global leadership in developing next generation technologies," said Dr. Michael Liehr, SUNY Poly Executive Vice President of Innovation and Technology and Vice President of Research. "Enabling the first 7nm node transistors is a significant milestone for the entire semiconductor industry as we continue to push beyond the limitations of our current capabilities."The 7nm node milestone continues IBM's legacy of historic contributions to silicon and semiconductor innovation. They include the invention or first implementation of the single cell DRAM, the Dennard Scaling Laws, chemically amplified photoresists, copper interconnect wiring, Silicon on Insulator, strained engineering, multi core microprocessors, immersion lithography, high speed SiGe, High-k gate dielectrics, embedded DRAM, 3D chip stacking and Air gap insulators.