The Kynix Components

CatalogFeaturesProduct SummaryOrdering InformationAbsolute Maximum RatingsThermal Resistance RatingsSpecificationsTypical CharacteristicsThermal RatingsPackage Information SQD40P10-40L_GE3 DatasheetSQD40P10-40L_GE3 ManufacturerSQD40P10-40L_GE3 FAQ FeaturesHalogen-free According to IEC  61249-2-21 DefinitionTrenchFET® Power MOSFETPackage with Low Thermal ResistanceAEC-Q101 Qualifiedd100 % Rg and UIS TestedCompliant to RoHS Directive  2002/95/EC Product SummaryVDS (V)-100RDS(on) (Ω) at VGS = - 10 V0.04RDS(on) (Ω) at VGS = - 4.5 V0.048ID (A)-38ConfigurationSingle Ordering InformationPackageTO-252Lead (Pb)-free and Halogen-freeSQD40P10-40L-GE3 Absolute Maximum Ratings (TC = 25 °C, unless otherwise noted)PARAMETERSYMBOLLIMITUNITDrain-Source VoltageVDS-100VGate-Source VoltageVGS± 20Continuous Drain CurrentTC = 25 °CID-38ATC = 125 °C-22Continuous Source Current (Diode Conduction)aIS-50Pulsed Drain CurrentbIDM-150Single Pulse Avalanche CurrentL = 0.1 mHIAS-44Single Pulse Avalanche EnergyEAS96mJMaximum Power DissipationbTC = 25 °CPD136WTC = 125 °C45Operating Junction and Storage Temperature RangeTJ, Tstg- 55 to + 175°C Thermal Resistance RatingsPARAMETERSYMBOLLIMITUNITJunction-to-AmbientPCB MountcRthJA50°C/WJunction-to-Case (Drain)RthJC1.1 Notesa.Package limited.b.Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.c.When mounted on 1" square PCB (FR-4 material).d.Parametric verification ongoing. Specifications (TC = 25 °C, unless otherwise noted)PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX.UNITStaticDrain-Source Breakdown VoltageVDSVGS = 0 V, ID = - 250 μA-100--VGate-Source Threshold VoltageVGS(th)VDS = VGS, ID = - 250 μA-1-2-2.5Gate-Source LeakageIGSSVDS = 0 V, VGS = ± 20 V--± 100nAZero Gate Voltage Drain CurrentIDSSVGS = 0 VVDS = - 100 V---1μAVGS = 0 VVDS = - 100 V, TJ = 125 °C---50VGS = 0 VVDS = - 100 V, TJ = 175 °C---250On-State Drain CurrentaID(on)VGS = - 10 VVDS ≤ - 5 V-30--ADrain-Source On-State ResistanceaRDS(on)VGS = - 10 VID = - 9.2 A-0.0330.04ΩVGS = - 10 VID = - 9.2 A, TJ = 125 °C--0.074VGS = - 10 VID = - 9.2 A, TJ = 175 °C--0.093VGS = - 4.5 VID = - 7.7 A-0.0370.048Forward TransconductancebgfsVDS = - 15 V, ID = - 9.2 A-35-SDynamicbInput CapacitanceCissVGS = 0 VVDS = - 25 V, f = 1 MHz-44335545pFOutput CapacitanceCoss-301380Reverse Transfer CapacitanceCrss-208260Total Gate ChargecQgVGS = - 10 VVDS = - 50V, ID = - 9.2 A-96144nCGate-Source ChargecQgs-8.4-Gate-Drain ChargecQgd-23.5-Gate ResistanceRgf = 1 MHz1.53.134.7ΩTurn-On Delay Timectd(on)VDD = - 50 V, RL = 6.49 ΩID ≌ - 7.7 A, VGEN = - 10 V, Rg = 1.0 Ω-1117nsRise Timectr-1117Turn-Off Delay Timectd(off)-78117Fall Timectf-1523Source-Drain Diode Ratings and CharacteristicsbPulsed CurrentaISM ---150AForward VoltageVSDIF = - 7.7 A, VGS = 0 V--0.8-1.5V Notesa.Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.b.Guaranteed by design, not subject to production testing.c.Independent of operating temperature. Typical Characteristics (TA = 25 °C, unless otherwise noted)Figure: Output Characteristics  Figure: Transfer Characteristics   Figure: Transconductance   Figure: On-Resistance vs. Drain Current   Figure: Capacitance   Figure: Gate Charge   Figure: On-Resistance vs. Junction Temperature   Figure: Source Drain Diode Forward Voltage   Figure: On-Resistance vs. Gate-to-Source Voltage   Figure: Threshold Voltage   Figure: Drain Source Breakdown vs. Junction Temperature Thermal Ratings (TA = 25 °C, unless otherwise noted) Figure: Safe Operating Area Package Information Figure: TO-252AA Case Outline MILLIMETERSINCHESDIM.MIN.MAX.MIN.MAX.A2.182.380.0860.094A1-0.127-0.005b0.640.880.0250.035b20.761.140.030.045b34.955.460.1950.215C0.460.610.0180.024C20.460.890.0180.035D5.976.220.2350.245D14.1-0.161-E6.356.730.250.265E14.32-0.17-H9.410.410.370.41e2.28 BSC0.090 BSCe14.56 BSC0.180 BSCL1.41.780.0550.07L30.891.270.0350.05L4-1.02-0.04L51.011.520.040.06 SQD40P10-40L_GE3 DatasheetYou can download the datasheet from the link given below:SQD40P10-40L_GE3 Datasheet SQD40P10-40L_GE3 ManufacturerVishay Intertechnology, Inc. is an American manufacturer of discrete semiconductors and passive electronic components founded by Polish-born businessman Felix Zandman. Vishay has manufacturing plants in Israel, Asia, Europe, and the Americas where it produces rectifiers, diodes, MOSFETs, optoelectronics, selected integrated circuits, resistors, capacitors, and inductors. Vishay Intertechnology revenues for 2018 were $3.035 billion. As of December 31, 2018, Vishay Intertechnology had approximately 24,100 full-time employees. SQD40P10-40L_GE3 FAQWhat is P-channel Mosfet used for?P-channel MOSFETs are often used for load switching. The simplicity of P-channel solutions on the high side makes them equally attractive for applications such as Low-Voltage Drives and non-isolated Point of Loads in systems where space is at a premium. Which Mosfet is faster N-channel or P-channel?The mobility of electrons, which are carriers in the case of an n-channel device, is greater than that of holes, which are the carriers in the p-channel device. Thus an n-channel device is faster than a p-channel device. Where are MOSFETs used?Power MOSFETs are commonly used in automotive electronics, particularly as switching devices in electronic control units, and as power converters in modern electric vehicles. The insulated-gate bipolar transistor (IGBT), a hybrid MOS-bipolar transistor, is also used for a wide variety of applications. 

CatalogDescriptionHighlightsApplicationsSuperior PHY and Interface TechnologyBest-in-Class Power ConsumptionKey SpecificationsRelated Products VSC8531XMW DatasheetVSC8531XMW ManufacturerVSC8531XMW FAQ DescriptionLow-power, small form-factor Cu PHY with  IEEE 802.3az Energy Efficient Ethernet (EEE) and Wake-on-LAN (WoL), with widest I/O  LVCMOS  support. The VSC8531 device, offered in a tiny 6 mm x 6 mm single-row QFN package, is designed for space-constrained 10/100/1000BASE-T applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines. The device supports the industry’s widest range of  LVCMOS levels for a parallel MAC interface including 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the  MDIO /MDC interface. VSC8531 includes Microsemi’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features  Wake-on-LAN power management using magic packets. HighlightsEcoEthernet™ 2.0, with Energy Efficient EthernetWidest voltage range, fully-compliant parallel MACinterface deviceTiny 6 mm x 6 mm QFN packageConfigurable drive strength on MAC interface enablesbetter control of system- level EMI /EMC Applications3D printers, 2D printersIoT applications, such as digital signage and eHealthConsumer electronics, such as CPE, UHDTV, mediaservers, and NAS  Superior PHY and Interface Technology10/100/1000BASE-T Ethernet copper transceiver(IEEE 802.3ab compliant) with Microsemi exclusive non-TDR based VeriPHY™ cable diagnostics software enables testing without taking down link or impacting data bandwidth while in 1000BASE-T modePatented line driver with low-EMI voltage mode and integrated line-side termination resistorsWOL support using magic packetsHP Auto-MDIX and manual MDI/MDIX  supportRGMII/RMII MAC interface with widest voltage range support in the industry: 1.5 V, 1.8 V, 2.5 V, and 3.3 V (LVCMOS)Jumbo frame support up to 16 kilobytes with programmable synchronization FIFOsAdditional internal FIFO located on ingress side enables support for EtherCAT ® applications Best-in-Class Power ConsumptionEcoEthernet™ 2.0 green energy efficiency with ActiPHY™, PerfectReach™, and IEEE3az EEEClause 45 registers to support IEEE 802.3az EEE and IEEE 802.3bfFully optimized power consumption for all link speeds10BASE-Te mode support enables even lower power consumption than 10BASE-T Key SpecificationsCompliant with IEEE 802.3 (10BASE-T, 10BASE-Te, 100BASE-TX, and 1000BASE-T)Supports RGMII (version 1.3) and RMII  (version 1.2) at 1.5 V,1.8 V, 2.5 V, and 3.3 V LVCMOSRGMII version 2.0 timing compliantSupports clocking from 25 MHz crystal or 25/50/125 MHz oscillatorMicrocontroller-free configurability through hardware strappingOptionally reports if a link partner is requesting inline Power over Ethernet (PoE and PoE+)Optional stand-alone capability supports even the most cost- sensitive Ethernet enabled designsDevices support operating temperatures of –40 °C ambient to 125 °C junction or 0 °C ambient to 125 °C junctionAvailable in 6 mm x 6 mm, 48-pin single-row QFN package Related ProductsVisit www.microsemi.com for information about these related products:VSC8541/VSC8541-03: Single Port Gigabit Ethernet Copper PHY  with  GMII /RGMII/RMII/MII InterfaceVSC8540-03: Single Port Fast Ethernet Copper PHY with Synchronous Ethernet, RGMII/MII/RMII InterfaceVSC8530-03: Single Port Industrial Grade Fast Ethernet Copper PHY with RGMII/RMII Interface VSC8531XMW DatasheetYou can download the datasheet from the link given below:VSC8531XMW Datasheet VSC8531XMW ManufacturerMicrochip Technology Inc. is a publicly-listed American corporation that manufactures microcontroller, mixed-signal, analog and Flash-IP integrated circuits. Its products include microcontrollers (PIC, dsPIC,  AVR  and SAM), Serial EEPROM devices, Serial SRAM devices, embedded security devices, radio frequency (RF) devices, thermal, power and battery management analog devices, as well as linear, interface and wireless products. VSC8531XMW FAQWhat is RGMII interface?The RGMII interface is the physical connection between the Ethernet PHY and the Ethernet MAC. The RGMII interface is a dual data rate (DDR) interface that consists of a transmit path, from FPGA to PHY, and a receive path, from PHY to FPGA. Both paths have an independent clock, 4 data signals and a control signal. What is PHY interface?A PHY, an abbreviation for "physical layer", is an electronic circuit, usually implemented as an integrated circuit, required to implement physical layer functions of the OSI model in a network interface controller. What is the difference between MII and RMII?RMII requires a 50 MHz clock where MII requires a 25 MHz clock and data is clocked out two bits at a time vs 4 bits at a time for MII or 1 bit at a time for SNI (10 Mbit/s only). Why is Ethernet PHY needed?An Ethernet PHY is designed to provide error-free transmission over a variety of media to reach distances that exceed 100m. The Ethernet PHY is connected to a media access controller (MAC). The MAC is usually integrated into a processor, FPGA or ASIC and controls the data-link-layer portion of the OSI model. What is difference between RGMII and SGMII?The pin count for all three interfaces are different. GMII and RGMII operate at 125 megahertz and SGMII operates at 625 megahertz. The important difference between RGMII and GMII is the pin count. Although RGMII has half the pins of GMII, it can still operate at gigabit speeds using the same clock frequency. 

CatalogUSB2517I-JZX DescriptionUSB2517I-JZX Related Video InstructionUSB2517I-JZX CAD ModelsUSB2517I-JZX Pin ConfigurationUSB2517I-JZX Block DiagramUSB2517I-JZX FeaturesUSB2517I-JZX ApplicationsUSB2517I-JZX DatasheetUSB2517I-JZX SpecificationsUSB2517I-JZX ManufacturerUsing WarningUSB2517I-JZX FAQUSB2517I-JZX DescriptionThe SMSC 7-Port Hub is a low power, OEM configurable, MTT (multi transaction translator) hub controller IC with 7 downstream ports for embedded USB solutions. The 7-port hub is fully compliant with the USB 2.0 Specification and will attach to an upstream port as a Full-Speed Hub or as a Full-/Hi-Speed Hub.The 7-Port Hub supports Low-Speed, Full-Speed, and Hi-Speed (if operating as a Hi-Speed Hub) downstream devices on all of the enabled downstream ports. USB2517I-JZX Related Video InstructionVideo:Microchip Introduces World's First Programmable USB2 Controller HubsUSB2517I-JZX Video Description:Microchip Technology Introduces World's First Programmable USB2 Controller Hubs; Adds Simultaneous Support for USB2 and HSIC, Low-Power Modes USB2517I-JZX CAD Models Figure: PCB Symbol  Figure: Footprint  Figure: 3D Model USB2517I-JZX Pin Configuration Figure: Pin Configuration USB2517I-JZX Block Diagram Figure: Block Diagram USB2517I-JZX FeaturesGeneral Features Hub Controller IC with 7 downstream ports High-performance multiple transaction translator MultiTRAK Technology provides one transaction translator per port Enhanced OEM configuration options available through either a single serial I2CTM EEPROM, or SMBus Slave Port 64-Pin (9x9 mm) QFN lead-free, RoHS compliant package Hardware Features Low power operationFull Power Management with individual or ganged power control of each downstream portOn-chip Power On Reset (POR)Internal 1.8V Voltage RegulatorFully integrated USB termination and Pull-up/Pulldown resistorsOn Board 24MHz Crystal Driver, Resonator, or External 24MHz clock inputUSB host/device speed indicator. Per-port 3-color LED drivers indicate the speed of USB host and device connection - hi-speed (480 Mbps), full-speed (12 Mbps), low-speed (1.5 Mbps)Enhanced EMI rejection and ESD protection performance OEM Selectable FeaturesCustomizable Vendor ID, Product ID, and Device IDSelect whether the hub is part of a compound device (When any downstream port is permanently hardwired to a USB peripheral device, the hub is part of a compound device.)Flexible port mapping and disable sequence. Ports can be disabled/reordered in any order to support multiple product SKUs. Hub will automatically reorder the remaining ports to match the Host controller's numbering scheme.Programmable USB differential-pair pin location      — Eases PCB layout by aligning USB signal lines directly to connectorsProgrammable USB signal drive strength. Recover USB signal integrity due to compromised system environments using 4-level driving strength resolutionSelect the presence of a permanently hardwired USB peripheral device on a port by port basisConfigure the delay time for filtering the over-current sense inputsConfigure the delay time for turning on downstream port powerIndicate the maximum current that the 7-port hub consumes from the USB upstream portIndicate the maximum current required for the hub controllerSupport Custom String Descriptor up to 31 characters in length for:      – Product String       – Manufacturer String       – Serial Number StringPin Selectable Options for Default Configuration      — Select Downstream Ports as Non-Removable Ports      — Select Downstream Ports as Disabled Ports      — Select Downstream Port Power Control and OverCurrent Detection on a Ganged or Individual Basis      — Select USB Signal Drive Strength      — Select USB Differential Pair Pin location USB2517I-JZX ApplicationsLCD monitors and TVsMulti-function USB peripheralsPC mother boardsSet-top boxes, DVD players, DVR/PVRPrinters and scannersPC media drive bayPortable hub boxesMobile PC dockingEmbedded systems DUSB2517I-JZX DatasheetYou can download the datasheet from the link given below:USB2517I-JZX-Datasheet USB2517I-JZX SpecificationsProduct Category:USB Interface ICProduct:USB HubsType:Hub ControllerMounting Style:SMD/SMTPackage / Case:QFN-64Standard:USB 2.0Speed:High Speed (HS)Data Rate:480 Mb/sSupply Voltage - Min:1.62 VSupply Voltage - Max:3.6 VOperating Supply Current:240 mAMinimum Operating Temperature:- 40 ℃Maximum Operating Temperature:+ 85 ℃Packaging:TrayManufacturer:MicrochipBrand:Microchip TechnologyMoisture Sensitive:YesNumber of Ports:7 PortOperating Supply Voltage:3.3 VProduct Type:USB Interface ICFactory Pack Quantity:260Subcategory:Interface ICsUnit Weight:0.007277 oz USB2517I-JZX ManufacturerMicrochip Technology Inc. is a publicly-listed American corporation that manufactures microcontroller, mixed-signal, analog and Flash-IP integrated circuits. Its products include microcontrollers (PIC, dsPIC, AVR and SAM), Serial EEPROM devices, Serial SRAM devices, embedded security devices, radio frequency (RF) devices, thermal, power and battery management analog devices, as well as linear, interface and wireless products. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. USB2517I-JZX FAQWhat does a Hub Controller do?The device replaces your existing thermostat or wall-mounted controller, linking a touchscreen input with an app on your phone that gives you control as long as you have a decent internet connection. It's designed to be installed in minutes, and even comes with its own tools in the box so you can do it yourself. What is a USB hub controller?A USB hub is a device that expands a single Universal Serial Bus (USB) port into several so that there are more ports available to connect devices to a host system, similar to a power strip. ... USB hubs are often built into equipment such as computer cases, keyboards, monitors, or printers. Does a USB hub slow down devices?A powered USB hub wont affect the performance of the devices connected to it (ie. it wont make them transfer any faster). 

Product OverviewThe ATMEGA328P is a low-power CMOS 8-bit microcontroller based on the AVR® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATMEGA328P achieves through puts approaching 1MIPS per MHz allowing the system designer to optimize power consumption  versus processing speed  . The high-performance picoPower 8bit AVR RISC-based microcontroller combines 32KB ISP flash memory with read-while-write capabilities, 1024B EEPROM, 2KB SRAM, 23 general purpose I/O lines, 32 general purpose working registers, three flexible timer/counters with compare modes, internal and external interrupts, serial programmable USART, a byte-oriented 2-wire serial interface, SPI serial port, a 6-channel 10-bit A/D converter (8-channels in TQFP and QFN/MLF packages), programmable watchdog timer with internal oscillator, and five software selectable power saving modes. The device operates between 1.8-5.5 volts. This blog will introduce ATMEGA328P-AU systematically from its features, pinout to its specifications, applications, also including ATMEGA328P-AU datasheet and so much more.CatalogProduct OverviewRelated Video IntroductionATMEGA328P-AU FeaturesATMEGA328P-AU PinoutATMEGA328P-AU CAD ModelsATMEGA328P-AU Block DiagramATMEGA328P-AU PackageATMEGA328P-AU SpecificationATMEGA328P-AU ManufacturerATMEGA328P-AU DatasheetUsing WarningsATMEGA328P-AU FAQ Related Video Introduction Video: Bootloader and upload to Atmega328P-AU ATMEGA328P-AU Video Description: Quickly burn a bootloader to Atmega328 TQFP 32 pin chip using a USBASP programmer without needing to use an Arduino as ISP. This is an easy tutorial to use the Arduino IDE alone to program and upload your sketch on the fly while the SMD chip is still in your breadboard. ATMEGA328P-AU FeaturesHigh-performance, Low-power Atmel AVR 8-bit MicrocontrollerAdvanced RISC Architecture   - 131 powerful instructions – most single clock cycle execution   - 32 × 8 General Purpose Working Registers + Peripheral Control Registers   - Fully Static Operation   - Up to 16MIPS Throughput at 16MHz   - On-chip 2-cycle MultiplierHigh Endurance Non-volatile Memory segments   - 32K bytes of in-system self-programmable flash program memory   - 1Kbytes EEPROM   - 2Kbytes internal SRAM   - Write/erase cycles: 10,000 flash/100,000 EEPROM   - Data retention: 20 years at 85°C/100 years at 25°C(1)   - Optional Boot Code Section with Independent Lock BitsIn-System Programming by On-chip Boot ProgramTrue Read-While-Write Operation   -  Programming Lock for Software SecurityPeripheral Features    – Two 8-bit Timer /Counters with separate prescaler  and compare mode    – One 16-bit Timer/Counter with separate prescaler  , compare mode, and capture mode    – Real Time Counter with Separate Oscillator    – Six PWM channels    – 8-channel 10-bit ADC in TQFP and QFN/MLF package            – Temperature measurement    – Programmable serial USART     – Master/Slave SPI Serial Interface    – Programmable Watchdog Timer with On-chip Oscillator    – On-chip Analog Comparator    – Byte Oriented 2-wire Serial Interface    – Interrupt and Wake-up on Pin ChangeSpecial Microcontroller Features   – Power-on Reset and Programmable Brown-out Detection   – Internal Calibrated RC Oscillator   – External and Internal Interrupt Sources   – Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and  Extended Standby 'I/O and Packages    ̶  23 programmable I/O lines     ̶  32-lead TQFP, and 32-pad QFN/MLFOperating voltage   – -40°C to 85°C IndustrialSpeed Grades   – 0 to 8MHz at 2.7 to 5.5V (automotive temperature range: –40°C to +125°C)   – 0 to 16MHz at 4.5 to 5.5V (automotive temperature range: –40°C to +125°C)Low power consumption        ̶  Active mode: 1.5mA at 3V - 4MHz     ̶  Power-down mode: 1µA at 3V ATMEGA328P-AU PinoutThe following figure is the diagram of ATMEGA328P-AU pinout. ATMEGA328P-AU Pinout ATMEGA328P-AU CAD ModelsThe followings are ATMEGA328P-AU Symbol, Footprint, and 3D Model . ATMEGA328P-AU Symbol ATMEGA328P-AU Footprint ATMEGA328P-AU 3D Model ATMEGA328P-AU Block DiagramThe following figure shows the block diagram of ATMEGA328P-AU. ATMEGA328P-AU Block Diagram ATMEGA328P-AU PackageThe following diagram shows the ATMEGA328P-AU package. ATMEGA328P-AU Package ATMEGA328P-AU SpecificationProduct AttributeAttribute ValueManufacturer:MicrochipProduct Category:8-bit Microcontrollers - MCUSeries:ATmega328PMounting Style:SMD/SMTPackage / Case:TQFP-32Core:AVRProgram Memory Size:32 kBData Bus Width:8 bitADC Resolution:10 bitMaximum Clock Frequency:20 MHzNumber of I/Os:23 I/OOperating Supply Voltage:1.8 V to 5.5 VMinimum Operating Temperature:- 40 CMaximum Operating Temperature:+ 85 CPackaging:TrayData RAM Type:SRAMData ROM Size:1 kBData ROM Type:EEPROMHeight:1 mmInterface Type:I2C, SPI, USARTLength:7 mmMoisture Sensitive:YesNumber of ADC Channels:8 ChannelNumber of Timers/Counters:3 TimerProcessor Series:megaAVRProduct:MCUProduct Type:8-bit Microcontrollers - MCUProgram Memory Type:FlashFactory Pack Quantity:250Supply Voltage - Max:5.5 VSupply Voltage - Min:1.8 V ATMEGA328P-AU ManufacturerAtmel Corporation is a global leader in designing, manufacturing and marketing advanced semiconductors including microcontroller (MCU), programmable logic, and nonvolatile memory. By combining these core technologies, Atmel meets the evolving and growing needs of today's electronic system design engineer through the production of general purpose and application specific system level integrated chips. Atmel's world class expertise and wealth of experience in system-level integration enable all of Atmel's products to be developed from their constituent blocks with minimum delay and risk. ATMEGA328P-AU DatasheetYou can download ATMEGA328P-AU datasheet from the link given below:ATMEGA328P-AU Datasheet Using WarningsNote: Please check their parameters and pin configuration before replacing them in your circuit. ATMEGA328P-AU FAQWhat is difference between 8bit and 16bit microcontroller?The main difference between 8 bit and 16 bit microcontrollers is the width of the data pipe. As you may have already deduced, an 8 bit microcontroller has an 8 bit data pipe while a 16 bit microcontroller has a 16 bit data pipe. A 16 bit number gives you a lot more precision than 8 bit numbers. What is an 8 bit MCU?An 8 bit microcontroller processes 8-bits of data at any particular time. They have 32-bit arithmetic logic units, registers, and bus width. In general, this means that a 32-bit can handle quadruple the amount of data, making it technically more data efficient. What is a microcontroller used for?Microcontroller is a compressed micro computer manufactured to control the functions of embedded systems in office machines, robots, home appliances, motor vehicles, and a number of other gadgets. A microcontroller is comprises components like - memory, peripherals and most importantly a processor. What is microcontroller and how it works?Microcontrollers are embedded inside devices to control the actions and features of a product. Hence, they can also be referred to as embedded controllers. Microcontrollers can take inputs from the device they controlling and retain control by sending the device signals to different parts of the device. What are microcontrollers made of?A microcontroller contains one or more CPUs (processor cores) along with memory and programmable input/output peripherals. Program memory in the form of ferroelectric RAM, NOR flash or OTP ROM is also often included on chip, as well as a small amount of RAM.

CatalogProduct OverviewMSP430F5310IPTR Related Video IntroductionMSP430F5310IPTR CAD ModelsMSP430F5310IPTR Pin ConfigurationMSP430F5310IPTR Block DiagramMSP430F5310IPTR FeaturesMSP430F5310IPTR ApplicationsMSP430F5310IPTR DatasheetMSP430F5310IPTR SpecificationsMSP430F5310IPTR ManufacturerUsing WarningMSP430F5310IPTR FAQ Product OverviewThe TI MSP family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in less than 5 µs. The MSP430F5310, MSP430F5309, and MSP430F5308 devices are microcontroller configurations with a 3.3-V LDO, four 16-bit timers, a high-performance 10-bit ADC, two USCIs (1), a hardware multiplier, DMA, an RTC module with alarm capabilities, and 31 or 47 I/O pins. The MSP430F5304 device is a configuration with a 3.3-VLDO, four 16-bit timers, a high-performance 10-bit ADC, one USCI, a hardware multiplier, DMA, an RTC module with alarm capabilities, and 31 I/O pins. MSP430F5310IPTR Related Video IntroductionMSP430F5310IPTR Video Description: In this video, we'll see how to configure digital I/O in MSP430 by using Port Registers. We'll use Code Composer Studio to program the microcontroller for blinking LEDs (Digital Output) and reading pin values (Digital Input). MSP430F5310IPTR CAD ModelsFigure: MSP430F5310IPTR PCB Symbol   Figure: MSP430F5310IPTR Footprint   Figure: MSP430F5310IPTR 3D Models MSP430F5310IPTR Pin ConfigurationFigure: MSP430F5310IPTR Pin Configuration MSP430F5310IPTR Block DiagramFigure: MSP430F5310IPTR Block Diagram MSP430F5310IPTR FeaturesLow Supply-Voltage Range:3.6 V Down to 1.8 VUltra-Low Power Consumption– Active Mode (AM) All System Clocks Active– 195 µA/MHz (Typical) at 8 MHz, 3 V, Flash Program Execution– 115 µA/MHz (Typical) at 8 MHz, 3 V, RAM Program Execution– Standby Mode (LPM3)– Real-Time Clock (RTC) With Crystal, Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wakeup: 1.9 µA (Typical) at 2.2 V, 2.1 µA (Typical) at 3 V– Low-Power Oscillator (VLO), General Purpose Counter, Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wakeup: 1.4 µA (Typical) at 3 V– Off Mode (LPM4) Full RAM Retention, Supply Supervisor Operational, Fast Wakeup: 1.1 µA at 3 V (Typical)– Shutdown Mode (LPM4.5) 0.18 µA at 3 V (Typical)Wake up From Standby Mode in Less Than 5 µs16-Bit RISC Architecture, Extended Memory, up to25-MHz System ClockFlexible Power-Management System– Fully Integrated LDO With Programmable Regulated Core Supply Voltage– Supply Voltage Supervision, Monitoring, and BrownoutUnified Clock System (UCS)– FLL Control Loop for Frequency Stabilization– Low-Power Low-Frequency Internal Clock Source (VLO)– Low-Frequency Trimmed Internal Reference Source (REFO)– 32-kHz Watch Crystals (XT1)– High-Frequency Crystals up to 32 MHz (XT2)16-Bit Timer TA0, Timer_A With FiveCapture/Compare Registers16-Bit Timer TA1, Timer_A With ThreeCapture/Compare Registers16-Bit Timer TA2, Timer_A With ThreeCapture/Compare Registers16-Bit Timer TB0, Timer_B With SevenCapture/Compare Shadow RegistersTwo Universal Serial Communication Interfaces(USCIs)– USCI_A0 and USCI_A1– Enhanced UART Supports Automatic BaudRate Detection– IrDA Encoder and Decoder– Synchronous SPI– USCI_B0 and USCI_B1– I2C– Synchronous SPIIntegrated 3.3-V Power System10-Bit Analog-to-Digital Converter (ADC) WithWindowComparatorComparatorHardware Multiplier Supports 32-Bit OperationsSerial Onboard Programming, No ExternalProgramming Voltage Needed3-Channel Internal DMABasic Timer With RTC FeatureDevice Comparison Summarizes the AvailableFamily Members MSP430F5310IPTR ApplicationsAnalog and Digital Sensor SystemsDigital Motor ControlRemote ControlsThermostatsDigital TimersHand-Held Meters MSP430F5310IPTR DatasheetYou can download the datasheet from the link given below:MSP430F5310IPTR Datasheet MSP430F5310IPTR SpecificationsProduct AttributeAttribute ValueManufacturer:Texas InstrumentsProduct Category:16-bit Microcontrollers - MCUSeries:MSP430F5310Mounting Style:SMD/SMTPackage / Case:LQFP-48Core:MSP430Program Memory Size:32 kBData Bus Width:16 bitADC Resolution:10 bitMaximum Clock Frequency:25 MHzNumber of I/Os:31 I/OData RAM Size:6 kBOperating Supply Voltage:1.8 V to 3.6 VOperating Temperature:-40°C ~ 85°C (TA)Brand:Texas InstrumentsData RAM Type:SRAMHeight:1.45 mmInterface Type:I2C, IrDA, SPI, UARTLength:7.2 mmMoisture Sensitive:YesNumber of ADC Channels:8 ChannelNumber of Timers/Counters:4 TimerProcessor Series:Series 5Product:MCUProduct Type:16-bit Microcontrollers - MCUProgram Memory Type:FlashFactory Pack Quantity:1000Subcategory:Microcontrollers - MCUTradename:MSP430Watchdog Timers:No Watchdog TimerWidth:7.2 mmUnit Weight:0.006409 oz MSP430F5310IPTR ManufacturerTexas Instruments Incorporated (TI) is an American technology company headquartered in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. It is one of the top 10 semiconductor companies worldwide based on sales volume.The company's focus is on developing analog chips and embedded processors, which account for more than 80% of its revenue.TI also produces TI digital light processing technology and education technology products including calculators, microcontrollers and multi-core processors. The company holds 45,000 patents worldwide as of 2016. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. MSP430F5310IPTR FAQWhat are Mixed-Signal Microcontrollers?Mixed-signal MCUs feature a digital crossbar that functions like a programmable switch-fabric, allowing designers to route digital peripherals to available I/O pins. This technology greatly simplifies system design efforts and allows resources to be multiplexed (even on the same I/O pin). What are analog and digital ICS?Analog integrated circuits work on continuous varying (with respect to time) signals. Digital circuits are non-linear because they work on binary or discontinuous signals. The input and output voltages of digital circuits have two possible values (binary high or low) there are no intermediate levels. What is a mixed signal processor?Mixed-signal ICs are chips that contain both digital and analog circuitry on the same chip. This category of chip has grown in volumes dramatically specifically with the increased use of 3G, 4G, 5G etc. cell phones and other portable technologies as well as increase of sensors and electronics in automotives. 

CatalogFeaturesMarking DiagramAbsolute Maximum RatingsThermal CharacteristicsElectrical CharacteristicsOrdering InformationTypical Performance CharacteristicsMechanical Case OutlineFSV20150V DatasheetFSV20150V ManufacturerFSV20150V FAQFeaturesUltra−Low Forward Voltage DropLow Thermal ResistanceVery Low Profile: Typical Height of 1.1 mmTrench Schottky TechnologyGreen Molding Compound as per IEC61249 StandardNon−DAP Option OnlyThese Devices are Pb−Free, Halogen Free and areRoHS Compliant Marking Diagram$Y = ON Semiconductor Logo&Z = Assembly Plant Code&3 = Date Code (Year & Week)FSV20150V = Specific Device Code Absolute Maximum Ratings (TA = 25℃ unless otherwise noted)SymbolParameterValueUnitVRRMPeak Repetitive Reverse Voltage150VVRWMWorking Peak Reverse Voltage150VVRMSRMS Reverse Voltage106VVRDC Blocking Voltage150VIF(AV)Average Rectified Peak Forward Surge Current20AIFSMNon−Repetitive Peak Forward Surge Current270ATJOperating Junction Temperature Range−55 to +150°CTSTGStorage Temperature Range−55 to +150°C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Thermal Characteristics(TA = 25℃ unless otherwise noted)SymbolParameterMinimum Land PatternMaximum Land PatternUnitRθJAJunction−to−Ambient Thermal Resistance10040℃/WΨJLJunction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode1512℃/WJunction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode65 The thermal resistances (RθJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. Figure 1. Minimum Land Pattern of 2 oz Copper   Figure 2. Maximum Land Pattern of 2 oz Copper Electrical Characteristics (TA = 25℃ unless otherwise noted)SymbolParameterConditionsMinMaxUnitBVRBreakdown VoltageIR = 0.5 mA150−VVFForward Voltage DropIF = 20 A−0.84VIRReverse CurrentVR = 150 V−30µA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Ordering InformationPart NumberTop MarkPackageShipping†FSV20150VFSV20150VTO−277 3L                        (Pb−Free/Halogen Free)5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Typical Performance CharacteristicsFigure 3. Typical Forward Characteristics  Figure 4. Typical Reverse Characteristics  Figure 5. Typical Junction Capacitance  Figure 6. Forward Current Derating Curve Mechanical Case Outline FSV20150V DatasheetFSV20150V Datasheet FSV20150V ManufacturerOnsemi is driving energy efficient innovations, empowering customers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help design engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. onsemi operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. FSV20150V FAQWhat are FSV Ultra-Low VF Schottky Rectifiers?onsemi / Fairchild FSV Ultra-Low VF Schottky Rectifiers are ultra-low forward voltage drop rectifiers with low thermal resistance. They feature a low profile with a typical height of 1.1mm and are RoHS compliant. The onsemi / Fairchild FSV Rectifiers are Green Molding Compounds as per the IEC61249 Standard, lead-free in compliance with EU RoHS 2011/65/EU Directive, and qualified per AEC-Q101 Rev. C Standard. What is a Schottky rectifier used for?Schottky diodes are used for their low turn-on voltage, fast recovery time and low-loss energy at higher frequencies. These characteristics make Schottky diodes capable of rectifying a current by facilitating a quick transition from conducting to blocking state. Which metal is used in Schottky diode?A metal-semiconductor junction is formed between a metal and a semiconductor, creating a Schottky barrier instead of a semiconductor-semiconductor junction as in conventional diodes. The semiconductor would typically be N-type silicon and typical metals used are molybdenum, platinum, chromium or tungsten.