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  • Contents

Catalog

Features

Marking Diagram

Absolute Maximum Ratings

Thermal Characteristics

Electrical Characteristics

Ordering Information

Typical Performance Characteristics

Mechanical Case Outline

FSV20150V Datasheet

FSV20150V Manufacturer

FSV20150V FAQ

Features

  • Ultra−Low Forward Voltage Drop
  • Low Thermal Resistance
  • Very Low Profile: Typical Height of 1.1 mm
  • Trench Schottky Technology
  • Green Molding Compound as per IEC61249 Standard
  • Non−DAP Option Only
  • These Devices are Pb−Free, Halogen Free and areRoHS Compliant

 

Marking Diagram

FSV20150V Marking Diagram

$Y = ON Semiconductor Logo

&Z = Assembly Plant Code

&3 = Date Code (Year & Week)

FSV20150V = Specific Device Code

 

Absolute Maximum Ratings 

(TA = 25℃ unless otherwise noted)

Symbol Parameter Value Unit
VRRM Peak Repetitive Reverse Voltage 150 V
VRWM Working Peak Reverse Voltage 150 V
VRMS RMS Reverse Voltage 106 V
VR DC Blocking Voltage 150 V
IF(AV) Average Rectified Peak Forward Surge Current 20 A
IFSM Non−Repetitive Peak Forward Surge Current 270 A
TJ Operating Junction Temperature Range −55 to +150 °C
TSTG Storage Temperature Range −55 to +150 °C

 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

 

Thermal Characteristics

(TA = 25℃ unless otherwise noted)

Symbol Parameter Minimum Land Pattern Maximum Land Pattern Unit
RθJA Junction−to−Ambient Thermal Resistance 100 40 /W
ΨJL Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode 15 12 /W
Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode 6 5

 

The thermal resistances (RθJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

 

Figure 1. Minimum Land Pattern of 2 oz Copper

Figure 1. Minimum Land Pattern of 2 oz Copper

 

 

Figure 2. Maximum Land Pattern of 2 oz Copper

 Figure 2. Maximum Land Pattern of 2 oz Copper

 

Electrical Characteristics 

(TA = 25℃ unless otherwise noted)

Symbol Parameter Conditions Min Max Unit
BVR Breakdown Voltage IR = 0.5 mA 150 V
VF Forward Voltage Drop IF = 20 A 0.84 V
IR Reverse Current VR = 150 V 30 µA

 

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

 

Ordering Information

Part Number Top Mark Package Shipping†
FSV20150V FSV20150V TO−277 3L                        (Pb−Free/Halogen Free) 5000 / Tape & Reel

 

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

 

Typical Performance Characteristics

Figure 3. Typical Forward Characteristics

Figure 3. Typical Forward Characteristics

 

 

Figure 4. Typical Reverse Characteristics

Figure 4. Typical Reverse Characteristics

 

 

Figure 5. Typical Junction Capacitance

Figure 5. Typical Junction Capacitance

 

 

Figure 6. Forward Current Derating Curve

Figure 6. Forward Current Derating Curve

 

Mechanical Case Outline

FSV20150V Mechanical Case Outline

 

FSV20150V Datasheet

FSV20150V Datasheet

 

FSV20150V Manufacturer

Onsemi is driving energy efficient innovations, empowering customers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help design engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. onsemi operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions.

 

FSV20150V FAQ

What are FSV Ultra-Low VF Schottky Rectifiers?

onsemi / Fairchild FSV Ultra-Low VF Schottky Rectifiers are ultra-low forward voltage drop rectifiers with low thermal resistance. They feature a low profile with a typical height of 1.1mm and are RoHS compliant. The onsemi / Fairchild FSV Rectifiers are Green Molding Compounds as per the IEC61249 Standard, lead-free in compliance with EU RoHS 2011/65/EU Directive, and qualified per AEC-Q101 Rev. C Standard.

 

What is a Schottky rectifier used for?

Schottky diodes are used for their low turn-on voltage, fast recovery time and low-loss energy at higher frequencies. These characteristics make Schottky diodes capable of rectifying a current by facilitating a quick transition from conducting to blocking state.

 

Which metal is used in Schottky diode?

A metal-semiconductor junction is formed between a metal and a semiconductor, creating a Schottky barrier instead of a semiconductor-semiconductor junction as in conventional diodes. The semiconductor would typically be N-type silicon and typical metals used are molybdenum, platinum, chromium or tungsten.

 

FSV20150V Documents & Media

Download datasheets and manufacturer documentation for ON Semiconductor FSV20150V.
Datasheets
datasheet
Environmental Information
PCN Design/Specification

FSV20150V PCB Symbol, Footprint & 3D Model

ON Semiconductor FSV20150V

ON Semiconductor

DIODE SCHOTTKY 150V 20A TO277-3

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