The Kynix Components

BSS138 is a N-Channel Logic Level MOSFET.BSS138 adopts SOT-23 package, the maximum Id is 220mA, the maximum voltage is 50V, and the power consumption is 360mW.This blog provides you with a basic overview of the BSS138 MOSFET, including its pin descriptions, functions and specifications, equivalent products, etc., to help you quickly understand what BSS138 is.We will be glad to find that this blog can be useful for people loving electronic components :)CatalogBSS138 MOSFET PinoutBSS138 MOSFET FeaturesBSS138 MOSFET AlternativeBSS138 MOSFET EquivalentOther N-Channel MOSFETsBSS138 MOSFET OverviewBSS138 MOSFET ApplicationsBSS138 MOSFET PackageComponent DatasheetFAQBSS138 MOSFET PinoutPin Number Pin Name Description1SourceCurrent flows out through Source2GateControls the biasing of the MOSFET3DrainCurrent flows in through DrainBSS138 MOSFET FeaturesLogic Level N-Channel MOSFET with low on-state resistanceContinuous Drain Current (ID) is 200mADrain Source Voltage (VDS) is 50VOn-state Resistance is 3.5ΩMinimum Gate threshold voltage (VGS-th) is 0.5VMaximum Gate threshold voltage (VGS-th) is 1.5VTurn ON and Turn off time is 20ns eachAvailable in SOT23 SMD packageNote: The complete technical information can be found at the BSS138 datasheet given at the end of this page.BSS138 MOSFET AlternativeFDC558, FDC666, BS170, 2N7000, NTR4003, 2N7002,BSS138 MOSFET EquivalentFDN358P, BSS84Other N-Channel MOSFETsBS170N, IRF3205, IRF540N, 2N7000, IRF1010E,BSS138 MOSFET OverviewBSS138 MOSFETThe BSS138 is a compact N-Channel Mosfet Logic Level. The mosfet has a very low threshold voltage of 0.5V and can therefore be used with any low voltage application circuit and for level shifting applications. Adding to this, the Mosfet also has low on-state resistance and low input capability, which makes it efficient in switching circuits. Due to the compact nature of the mosfet, it is widely used in portable applications such as cell phones and other power management circuits.The BSS138 is slightly expensive for its specification, so if you're looking for a cheap alternative, check 2N7002. However, with the on-state resistance and the Mosfet threshold voltage, you have to compensate slightly. This mosfet comes in an SMD package and can therefore be used for compact applications. A significant disadvantage of the mosfet is its low drain current; it can provide a continuous current of 200mA and peak currents of up to 1A at maximum threshold voltage. Anything more than that is going to damage the mosfet.BSS138 MOSFET ApplicationsLow current and Low Voltage switching applicationsLogic Level ShiftersDC-DC convertseMobility applicationsApplication where low on-state resistance is required.Power management applicationsBSS138 MOSFET PackageThe Mosfet is available in the SOT23 and TO-92 packages, the dimensions of the SOT23 package are shown below. Please refer to the BSS138 data sheet below for additional dimensions.That’s all for our introduction to BSS138. If you find this blog useful, please bookmark our website Apogeeweb, we will provide you with electronic component blogs, industry news, tools, etc. that you are interested in. Stay tuned for our next blog...Component DatasheetBSS138 DatasheetFAQWhat is BSS138?The BSS138 is an SMD Package Logic Level N-Channel MOSFET with low on-state resistance (3.5Ω) and low input capacitance (40 pF). What is N-channel Mosfet?N-Channel MOSFET is a type of metal oxide semiconductor field-effect transistor that is categorized under the field-effect transistors (FET). What is a logic level Mosfet?A logic level mosfet means that it is designed to turn on fully from the logic level of a microprocessor. The standard mosfet (IRF series etc) is designed to run from 10V.

The Cortex®‐M0 Core STM32F0 series addresses cost-sensitive designs originally served by 8-bit or 16-bit microcontrollers. The offer "STM32 at 32 cents" is a clear illustration of this capability.Intro To ARM Programming The STM32F0 DiscoveryCatalogSTM32F0 Series OverviewSTM32F0x0 Value LineSTM32F0x1 Access LineSTM32F0x2 USB LineSTM32F0x8 Low‑voltage lineSTM32F0 Series DocumentFAQSTM32F0 Series OverviewDevices in the ST Arm® Cortex®-M0-based STM32F0 Series deliver 32-bit performance with the essentials of the STM32 family and are particularly suited for cost-sensitive applications. The STM32F0 MCUs combine real-time performance, low-power operation, and advanced architecture and peripherals for the STM32 platform.The STM32F0x0 Value line is highly competitive in traditional 8-bit and 16-bit markets, eliminating the need to manage different architectures and the associated development overhead. If your device needs a USB device, the STM32F070 Value Line MCU can now be ordered.The STM32F0x1 line provides high functional integration and covers a wide range of memory sizes and packages, providing flexibility for cost-sensitive applications.The STM32F0x2 line provides rich connectivity with crystal-less USB 2.0 and a CAN bus interface, making it the ideal choice for communication gateways, smart-energy devices or game terminals.The STM32F0x8 line operating at 1.8V ±8% is well suited for use in portable consumer applications such as smartphones, accessories and media devices.STM32F0x0 Value LineThe STM32F0x0 microcontrollers have the Arm® Cortex®-M0 core and run at speeds of up to 48 MHz. While achieving the lowest ever price point of the STM32F0x0 line, the STM32F0x0 line includes a full set of powerful peripherals, such as fast 12-bit ADCs, advanced and flexible timers, RTC calendars and communication devices such as I², USART and SPI, and recently added crystal-less USB.This combination easily outperforms existing 8-bit architectures and allows all application designers to benefit from the simplicity and efficiency of the state-of-the-art 32-bit coreThe STM32F0x0 Value line covers many memory and pin count combinations with only a few competitive devices and further improves the overall cost-effectiveness of your projects.Application designers starting with the STM32F030 benefit from the ability to upgrade to any of the devices in the powerful STM32 portfolio at any time with an exceptional degree of reusability of tools and application software.STM32F0x1 Access LineSTM32F0x1 provides better user experience with high integration.The STM32F0x1 microcontrollers are designed for 8-and 16-bit applications where 32-bit performance is required, such as home entertainment products, appliances and industrial equipment. The portfolio includes 16 to 256 Kbytes of on-chip Flash memory, up to 32 Kbytes of SRAM, and several communication interfaces including USART, SPI, I2C, HMDI CEC and 16-bit PWM engine control timer. The package offer ranges from 20-to 100-pin packages.The latest addition to the STM32 F0x1 series, the STM32F091, includes up to eight USARTs of versatile 48-to 100-pin packages, including low-thickness WLCSP and BGA variants. Its 256Kbytes on-chip Flash memory and 32 Kbytes SRAM allow Java stack implementation, and CAN 2.0a/b provides additional communication capabilities for industrial or in-car audio applications.STM32F0x2 USB LineSTM32F0x2 Crystalless USB 2.0 FS adds up to 128 Kbytes of Flash and 16 Kbytes of SRAM to the STM32 F0 series.These new STM32 F0 devices offer a crystal-less USB 2.0 FS interface with LPM (Link Power Management) capability and comply with Battery Charger Detection (BCD) specification 1.2, thus eliminating the need for an external crystal oscillator to generate the precision clock required by the USB protocol. Together with support from CAN, USART, I2C, SPI (I2S) and HDMI CEC, the new STM32 F0 devices enable product developers to increase system integration, reduce costs and exceed the traditional price/performance limitations imposed by older, proprietary 8-bit or 16-bit microcontrollers for USB device or USB controller applications.The STM32F072 series provides 64 to 128 Kbytes of Flash memory for 48-, 64-, or 100-pin packages. The STM32F042 series consists of 16 to 32 Kbytes of Flash memory and 20-, 28-, 32-and 48-pin package options.STM32F0x8 Low‑voltage LineThe STM32F0x8 microcontrollers operate at 1.8V +/-8%. They are well suited to use in portable consumer applications such as smartphones, accessories and media devices, and allow designers to take advantage of the same features as the STM32F0 series with no compromise or degradation in processing performance when operating at lower voltage.The microcontrollers STM32F0x8 operate at +/-8 percent to 1.8V. They are well suited for use in portable consumer applications such as smartphones, accessories and media devices, and enable designers to take advantage of the same features as the STM32F0 series without compromising or degrading processing performance when operating at low voltage.The combination of 1.8V digital supply voltage, separate I/O supply rail and an independent analog domain is an advantage in heterogeneous system architectures, resulting in simplified system design and cost savings. The STM32F0x8 devices are ideal low-voltage companion microcontrollers to maintain a wide analog dynamic range or to connect USB devices directly.STM32F0 Series DocumentSTM32F0 Series PDFFAQWhat is STM32F4?STM32 is a family of 32-bit microcontroller integrated circuits by STMicroelectronics. ... Internally, each microcontroller consists of the processor core, static RAM, flash memory, debugging interface, and various peripherals.What is STM Board?STM32 is a family of 32-bit microcontroller integrated circuits by STMicroelectronics. ... Internally, each microcontroller consists of the processor core, static RAM, flash memory, debugging interface, and various peripherals.Why is SMT32 So Popular?The STM32 series of microcontrollers from ST Microelectronics is a popular, and very large, family of ARM-based 32-bit microcontrollers. ... While the STM32 microcontrollers are quite versatile and highly configurable, it is this very fact that makes them hard to initialize.Where is STM32 Used?There are various types and varieties of STM32 Microcontrollers available and they belong to the ARM-architecture family of Microcontrollers. These microcontrollers are used in a variety of applications, from simple printers to complex circuit boards in vehicles.How Do I Start Learning STM32?Step 1: Pre-requisites. Install the main tools to program STM32 and run a first example: ...Step 2: Blink LED example on the NUCLEO-L476RG board using STM32CubeMX and HAL. ...Step 3: UART and new board introduction. ...Step 4: Sensors usage with B-L475E-IOT01A. ...Step 5: Build an IOT system.How Do You Program a STM32F407?Step 1: Go to mbed.org and login/signup.Step 2: Select Platform Seeed Arch Max.Step 3: Edit, Compile and Download Code.Pins shared with on board hardware.Update 1: DAC works on PA4 and PA5.Update 2: 20x4 LCD support.Caveats.

Product OverviewThe PT4115 is a continuous conduction mode inductive step-down converter, designed for driving single or multiple series connected LED efficiently from a voltage source higher than the total LED chain voltage. The device operates from an input supply between 8V and 30V a and provides an externally adjustable output current of up to 1.2A. Depending upon the supply voltage and external components, the PT4115 can provide more than 30 watts of output power. This blog will introduce PT4115 systematically from its features, pinout to its specifications, applications, also including PT4115 datasheet and so much more. CatalogProduct OverviewPT4115 FeaturesPT4115 PinoutPT4115 Pin ConfigurationPT4115 ApplicationsPT4115 Circuit DiagramPT4115 Block DiagramPT4115 PackagePT4115 SpecificationPT4115 ManufacturerPT4115 DatasheetUsing WarningsPT4115 FAQ PT4115 FeaturesSimple low parts countWide input voltage range: 8V to 30VUp to 1.2A output currentSingle pin on/off and brightness control using DCvoltage or PWMUp to 1MHz switching frequencyTypical 5% output current accuracyInherent open-circuit LED protectionHigh efficiency (up to 97%)High- Side Current SenseHysteretic Control: No CompensatioAdjustable Constant LED CurrentESOP8 package for large output power application PT4115 PinoutThe following figure is the diagram of PT4115 pinout. PT4115 Pinout PT4115 Pin ConfigurationPIN No.PIN NAMESDESCRIPTION1SWSwitch Output. SW is the drain of the internal N-Ch MOSFET switch.2GNDSignal and power ground. Connect directly to ground plane.3DIMLogic level dimming input. Drive DIM low to turn off the current regulator.Drive DIM high to enable the current regulator.4CSNCurrent sense input5VINInput Supply Pin. Must be locally bypassed.-Exposed PADInternally connected to GND. Mount on board for lower thermal resistance.ESOP8 4,5NCNo connection PT4115 ApplicationsLow voltage halogen replacement LEDsAutomotive lightingLow voltage industrial lightingLED back-up lightingIluminated signsSELV lightingLCD TV backlighting PT4115 Circuit DiagramThe following is the circuit diagram of PT4115. PT4115 Circuit Diagram PT4115 Block DiagramThe following figure shows the block diagram of PT4115. PT4115 Block Diagram PT4115 PackageThe following diagram shows the PT4115 package. PT4115 Package PT4115 SpecificationSYMBOLITEMSVALUEUNITVINSupply Voltage-0.3~45VSWDrain of the internal power switch-0.3~45VCSNCurrent sense input (Respect to VIN)+0.3~(-6.0)VDIMLogic level dimming input-0.3~6VISWSwitch output current1.5APDMAXPower Dissipation (Note 2)1.5WPTRThermal Resistance, SOT89-5 θJA45oC /WPTRThermal Resistance, ESOP8 θJA40oC /WTJOperation Junction Temperature Range-40 to 150oCTSTGStorage Temperature-55 to 150oC ESD Susceptibility (Note 3)2kV PT4115 ManufacturerPowerTECH has always concentrated on developing, producing and promoting semiconductor final packaged test equipment, to satisfy and serve customer in various fields, we have developed QT-3000, QT-4000, QT-6000 series semiconductor discrete device testing system and QT-8000 IC testing system. PT4115 DatasheetYou can download PT4115 datasheet from the link given below:PT4115 Datasheet Using WarningsNote: Please check their parameters and pin configuration before replacing them in your circuit. PT4115 FAQIs LED driver necessary?Because LEDs require a constant DC of 12v or 24v, LED drivers are required in all LED systems (except those which are specifically developed to be controlled by mains voltage power supplies such as mains voltage tape or LED bulbs). What is a LED downlight driver?An LED driver is an electrical product that converts the incoming mains voltage of 230V AC into DC and drops the voltage. Some LED lights require a constant current supply which is usually 350ma or 700ma. Is an LED driver the same as a transformer?A transformer converts AC to AC; e.g., 240V AC to 12V AC. An LED driver typically supplies a constant current (e.g, 150mA DC) to a fairly-low voltage load (e.g., 36V DC; 12x 3V series LEDs, probably paralleled), while being powered by a high-voltage (e.g., 240V AC) input.

CatalogProduct DescriptionTypical Uncured Physical PropertiesFeaturesTypical Cured Physical PropertiesTypical Cured Electrical PropertiesTypical Cured Thermal PropertiesTypical Cured Outgassing PropertiesHandling/Curing InformationApplication and Equipment SuggestionsSurface PreparationTypical Adhesive Performance CharacteristicsStorageShelf LifeTechnical InformationProduct UseEC2216 DatasheetEC2216 FAQ Product Description3M™ Scotch-Weld™ Epoxy Adhesive EC-2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld EC-2216 Adhesive has been tested and certified for aircraft and aerospace application. Typical Uncured Physical PropertiesNote: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.Product3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A TranslucentBaseAcceleratorBaseAcceleratorColor:WhiteGrayTranslucentAmberBase:Modified EpoxyModified AmineModified EpoxyModified AmineNet Wt.: (lb/gal)11.1-11.610.5-11.09.4-9.88.0-8.5Viscosity: (cps) (Approx.) Brookfield RVF #7 sp. @ 20 rpm75,000 - 15000040,000 - 8000011,000 - 150005,000 - 9000Mix Ratio: (by weight)5 parts7 parts1 part1 partMix Ratio: (by volume)2 parts3 parts1 part1 partWork Life: 100 g Mass @ 75°F (24°C)90 minutes90 minutes120 minutes120 minutes Features Excellent for bonding many metals, woods, plastics, rubbers, and masonry products.Base and Accelerator are contrasting colors.Good retention of strength after environmental aging.Resistant to extreme shock, vibration, and flexing.Excellent for cryogenic bonding applications.The translucent can be injected.Meets DOD-A-82720. Typical Cured Physical PropertiesProduct 3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A TranslucentShore D Hardness ASTM D 224050-6535-50Time to Handling Strength8-12 hrs.12-16 hrs. Typical Cured Electrical PropertiesProduct 3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A TranslucentArc Resistance130 seconds—Dielectric Strength408 volts/mil630 volts/milDielectric Constant @ 73°F (23°C)5.51–Measured @ 1.00 KHz6.3 @ 1 KHzDielectric Constant @ 140°F (60°C)14.17–Measured @ 1.00 KHz—Dissipation Factor 73°F (23°C)0.112 Measured @ 1.00 KHz0.119 @ 1 KHzDissipation Factor 140°F (60°C)0.422–Measured @ 1.00 KHz—Surface Resistivity @ 73°F (23°C)5.5 x 1016 ohm–@ 500 volts DC—Volume Resistivity @ 73°F (23°C)1.9 x 1012 ohm-cm– @ 500 volts DC3.0 x 1012 ohm-cm @ 500 volts DC—No value present. Typical Cured Thermal PropertiesProduct 3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A TranslucentThermal Conductivity0.228 Btu-ft/ ft2 h°F0.114 Btu-ft/ ft2 h°FCoefficient of Thermal Expansion  102 x 10-6 in/in/°C between 0-40°C81 x 10-6 in/in/°C between -50-0°C134 x 10-6 in/in/°C between 40-80°C207 x 10-6 in/in/°C between 60-150°C Typical Cured Outgassing PropertiesOutgassing DataNASA 1124 Revision 4 3M™ Scotch-Weld™ Epoxy Adhesive EC-2216 B/A Gray % TML% CVCM% Wtr.77.04.23 Cured in air for 7 days @ 77°F (25°C). Handling/Curing InformationDirections for Use1.For high strength structural bonds, paint, oxide films, oils,dust, mold release agentsand all other surface contaminants must be completely removed. However, the amount of surface preparation directly depends on the required bond strength and the environmental aging resistance desired by user. For suggested surface preparations of common substrates, see the following section on surface preparation. 2.These products consist of two parts. Mix thoroughly by weight or volume in theproportions specified on the product label and in the uncured properties section. Mix approximately 15 seconds after a uniform color is  3.For maximum bond strength, apply product evenly toboth surfaces to be joined. 4.Application to the substrates should be made within 90minutes. Larger quantitiesand/or higher temperatures will reduce this working time. 5.Join the adhesive coated surfaces and allow to cure at60°F (16°C) or above untilfirm. Heat, up to 200°F (93°C), will speed curing. 6.The following times and temperatures will result in a full cure:Product 3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A TranslucentCure TemperatureTimeTime75°F (24°C)7 days30 days150°F (66°C)120 minutes240 minutes200°F (93°C)30 minutes60 minutes 7.Keep parts from moving until handling strength isreached. Contact pressure isnecessary. Maximum shear strength is obtained with a 3-5 mil bond line. Maximum peel strength is obtained with a 17-25 mil bond line. 8.Excess uncured adhesive can be cleaned up withketone type solvents.* Adhesive Coverage: A 0.005 in. thick bondline will typically yield a coverage of 320 sq. ft/gallon Application and Equipment SuggestionsThese products may be applied by spatula, trowel or flow equipment. Two-part mixing/proportioning/dispensing equipment is available for intermittent or production line use. These systems are ideal because of their variable shot size and flow rate characteristics and are adaptable to many applications. Surface Preparation For high strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be completely removed. However, the amount of surface preparation directly depends on the required bond strength and the environmental aging resistance desired by user. The following cleaning methods are suggested for common surfaces. Steel or Aluminum (Mechanical Abrasion)1.Wipe free of dust with oil-free solvent such as acetone or alcohol solvents.* 2.Sandblast or abrade using clean fine grit abrasives (180 grit or finer). 3.Wipe again with solvents to remove loose particles. 4.If a primer is used, it should be applied within 4 hours after surface preparation. If 3M™ Scotch-Weld™ Structural Adhesive Primer EC-1945 B/A is used, apply a thin coating (0.0005") on the metal surfaces to be bonded, air dry for 10 minutes, then cure for 30 minutes at 180°F (82°C) prior to bonding. *When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use. Use solvents in accordance with local regulations. Aluminum (Chemical Etch)Aluminum alloys may be chemically cleaned and etched as per ASTM D 2651. This procedure states to: 1.Alkaline Degrease – Oakite® Aluminum Cleaner 164 solution (9-11 oz/gal of water) at 190°F ± 10°F (88°C ± 5°C) for 10-20 minutes. Rinse immediately in large quantities of cold running water. 2.Optimized FPL Etch Solution (1 liter):Material                            AmountDistilled Water                  700 ml plus balance of liter (see below)Sodium Dichromate          28 to 67.3 gramsSulfuric Acid                     287.9 to 310.0 gramsAluminum Chips              1.5 grams/liter of mixed solution To prepare 1 liter of this solution, dissolve sodium dichromate in 700 ml of distilled water. Add sulfuric acid and mix well. Add additional distilled water to fill to 1 liter. Heat mixed solution to 66 to 71°C (150 to 160°F). Dissolve 1.5 grams of 2024 bare aluminum chips per liter of mixed solution. Gentle agitation will help aluminum dissolve in about 24 hours. To etch aluminum panels, place them in FPL etch solution heated to 66 to 71°C (150 to 160°F). Panels should soak for 12 to 15 minutes. 3.Rinse: Rinse panels in clear running tap water. 4.Dry: Air dry 15 minutes; force dry 10 minutes (minimum) at 140°F (60°C) maximum. 5.If primer is to be used, it should be applied within 4 hours after surface preparation. Plastics/Rubber1.Wipe with isopropyl alcohol.*2.Abrade using fine grit abrasives (180 grit or finer).3.Wipe with isopropyl alcohol.* Glass 1.Solvent wipe surface using acetone or Methyl Ethyl Ketone(MEK).* 2.Apply a thin coating (0.0001 in. or less) of 3M™Scotch-Weld™ StructuralAdhesive Primer EC-3901 to the glass surfaces to be bonded and allow the primer to dry a minimum of 30 minutes @ 75°F (24°C) before bonding. *When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use. Use solvents in accordance with local regulations. Typical Adhesive Performance CharacteristicsA.Typical Shear Properties on Etched AluminumASTM D 1002Cure: 2 hours @ 150 ± 5°F (66°C ± 2°C), 2 psi pressure   Test Temperature  Overlap Shear (psi)3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A Translucent-423°F (-253°C)2440—-320°F (-196°C)2740—-100°F (-73°C)3000—-67°F (-53°C)3000300075°F (24°C)32001700180°F (82°C)400140 —No value present. Test TemperatureShear Modulus (Torsion Pendulum Method)-148°F (-100°C)398,000 psi (2745 MPa)-76°F (-60°C)318,855 psi (2199 MPa)-40°F (-40°C)282,315 psi (1947 MPa)32°F (0°C)218,805 psi (1500 MPa)75°F (24°C)49,580 psi (342 MPa) B.Typical T-Peel StrengthASTM D 1876  Test Temperature  T-Peel Strength (piw) @ 75°F (24°C)3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayEC-2216 B/A Translucent75°F (24°C)2525 C.Overlap Shear Strength After Environmental Aging-Etched Aluminum   Environment      Time  Overlap Shear (psi) 75°F (24°C)3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/AGrayEC-2216 B/ATranslucent100% Relative Humidity @ 120°F (49°C) 14 days2950 psi—30 days1985 psi1390 psi90 days1505 psi—*Salt Spray @ 75°F (24°C)  14 days2300 psi—30 days500 psi1260 psi60 days300 psi—Tap Water @ 75°F (24°C)  14 days3120 psi—30 days2942 psi1950 psi90 days2075 psi—Air @ 160°F (71°C)35 days4650 psi—Air @ 300°F (149°C)40 days4930 psi3500 psiAnti-icing Fluid @ 75°F (24°C)7 days3300 psi2500 psiHydraulic Oil @ 75°F (24°C)30 days2500 psi2500 psiJP-4 Fuel30 days2500 psi2500 psiHydrocarbon Fluid7 days3300 psi3000 psi *Substrate corrosion resulted in adhesive failure.—No value present. D.Heat Aging of 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A Gray(Cured for 7 days @ 75°F [24°C]) Overlap Shear (psi)Time aged @ 300°F (149°C)Test Temperature0 days12 days40 days51 days-67°F (-53°C)220033103120286075°F (24°C)3100515049304740180°F (82°C)50010007601120350°F (177°C)420440560— —No value present. E.Overlap Shear Strength on Abraded Metals, Plastics, and Rubbers.Overlap shear strengths were measured on 1" x 1/2" overlap specimens. These bonds were made individually using 1" by 4" pieces of substrate (Tested per ASTM D 1002). The thickness of the substrates were: cold rolled, galvanized and stainless steel – 0.056-0.062", copper – 0.032", brass – 0.036", rubbers – 0.125", plastics – 0.125". All surfaces were prepared by solvent wiping/ abrading/ solvent wiping. The free crosshead speed used for testing was 0.1 in/min for metals, 2 in/min for plastics, and 20 in/min for rubbers.  Substrate  Overlap Shear (psi) @ 75°F (24°C)3M™ Scotch-Weld™ Epoxy AdhesiveEC-2216 B/A GrayAluminum/Aluminum1850Cold Rolled Steel/Cold Rolled Steel1700Stainless Steel/Stainless Steel1900Galvanized Steel/Galvanized Steel1800Copper/Copper1050Brass/Brass850Styrene Butadiene Rubber/Steel200*Neoprene Rubber/Steel220*ABS/ABS Plastic990*PVC/PVC, Rigid940*Polycarbonate/Polycarbonate1170*Acrylic/Acrylic1100*Fiber Reinforced Polyester/ Reinforced Polyester1660*Polyphenylene Oxide/PPO610PC/ABS Alloy / PC/ABS Alloy1290 *The substrate failed during the test. Storage Store products at 60-80°F (16-27°C) for maximum storage life. Shelf LifeWhen stored at the recommended temperatures in the original, unopened containers, the shelf life is two years from date of shipment from 3M or an authorized 3M Aerospace Distributor. Technical InformationThe technical information, recommendations and other statements contained in this document are based upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed. Product UseMany factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use and performance of a 3M product in a particular application. Given the variety of factors that can affect the use and performance of a 3M product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and suitable for user’s method of application. EC2216 DatasheetYou can download the datasheet of EC2216 from the link given below:EC2216 Datasheet EC2216 FAQWhat is EC2216 Scotch-WeldTM Epoxy Adhesive?3M Scotch-Weld EC 2216 Epoxy Adhesive Gray is a two component, room temperature curing epoxy. It is certified for use in aircraft and aerospace application. It also features resistance to extreme shock, vibration, and flexing, and good retention of strength after environmental aging. What is Scotch Weld?3M Scotch-Weld Epoxy Adhesive DP100 Plus is a very flexible, fast-setting, two-part epoxy adhesive that cures clear and stays clear even when cured in larger masses. When using a Duo-Pak (DP) size adhesive, rely on 3M dispensing equipment for convenient and accurate metering, mixing and dispensing. How long does 3M Scotch Weld take to dry?3M™ Scotch-Weld™ Epoxy Adhesive DP420 reaches handling strength in approximately two hours and is fully cured in 24 hours (at 72°F/22°C.) The mix ratio is 2:1 and provides a 20 minute work life, providing time to adjust for desired fit prior to curing. How do you get rid of Scotch welding?Fully open the valve. Spray the 3M™ Scotch- Weld™ Adhesive Remover through the system into a pail or some other form of waste material. When finished, turn the valve on the cylinder to the closed position and purge the hose and applicator until nothing more comes out. What is 3M Scotch Weld used for?3M™ Scotch-Weld™ Epoxy Adhesive 1751 is an aluminum-filled, two-part epoxy adhesive that provides high strength rigid bonds to metal. We formulated this epoxy adhesive to be ideal for repairing holes, dents and cracks in metal. 

The 2N3055G is a 60V Silicon NPN Bipolar Complementary Power Transistor designed for general purpose switching and amplifier applications.2N3055 Power Transistor TestCatalogProduct Overview2N3055G FeaturesCAD ModelsPackage Dimensions2N3055G Product Attributes2N3055G ApplicationsAlternate PartsUsing Warnings2N3055G vs 2N3055Product OverviewThe Bipolar Power Transistor is designed for high power audio, stepping motor and other linear applications. It can also be used in power switching circuits such as relay or solenoid drivers, dc-to-dc converters, inverters or for inductive loads requiring higher safe operating area than the 2N3055. In addition, the 2N3055G (NPN) and MJ2955 (PNP) are complementary power transistors. They come in a TO-204AA metal package.2N3055G Features• High Current-Gain - Bandwidth• Safe Operating Area• These Devices are Pb−Free and are RoHS Compliant• DC Current gain(hFE = 20 to 70 at Ic = 4ADC)• Collector-emitter saturation voltage(Vce (sat) = 1.1VDC maximum at Ic = 4ADC)CAD Models2N3055G Symbol 2N3055G FootprintPackage DimensionsPackage Dimensions2N3055G Product AttributesCase/Package:TO-204-3Number of Pins:2Collector Base Voltage (VCBO):100 VCollector Emitter Breakdown Voltage:60 VCollector Emitter Saturation Voltage:3 VCollector Emitter Voltage (VCEO):60 VCurrent Rating:15 AElement Configuration:SingleEmitter Base Voltage (VEBO):7 VFrequency:2.5 MHzGain Bandwidth Product:2.5 MHzhFE Min:20Max Collector Current:15 AMax Frequency:2.5 MHzMax Junction Temperature (Tj):200 °CMax Operating Temperature:200 °CMax Power Dissipation:115 WMin Operating Temperature:-65 °CNumber of Elements:1Polarity:NPNPower Dissipation:115 WTransition Frequency:2.5 MHzVoltage Rating (DC):60 VHeight:8.51 mmLength:39.37 mmWidth:26.67 mmLead Free:Lead FreeRadiation Hardening:NoREACH SVHC:No SVHCRoHS:CompliantCountry Of Origin:MexicoECCN:EAR99HTSN:8541290095SCHEDULE B:85412900802N3055G ApplicationsIndustrialAlternate Parts2N3055, JANTX2N3055, JAN2N3055, 2N3055AR1, 2N3055R1, BDX10R1, 2N3055A, BDX10C, 2N3055E3Using WarningsMarket demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.2N3055G vs 2N3055Specifications2N3055G2N3055Pbfree Code Yes*Part Life Cycle CodeActiveContact ManufacturerIhs ManufacturerON SEMICONDUCTORHI-TRON SEMICONDUCTOR CORPPart Package CodeTO-3TO-204AAPackage DescriptionFLANGE MOUNT, O-MBFM-P2FLANGE MOUNT, O-MBFM-P2Pin Count22Manufacturer Package Code1-07*Reach Compliance Codenot_compliantunknownECCN CodeEAR99EAR99HTS Code8541.29.00.95*Factory Lead Time1 Week*Case ConnectionCOLLECTOR*Collector Current-Max (IC)15 A15 ACollector-Emitter Voltage-Max60 V60 VConfigurationSINGLESingleDC Current Gain-Min (hFE)520JEDEC-95 CodeTO-204AATO-3JESD-30 CodeO-MBFM-P2O-MBFM-P2JESD-609 Codee3e0Number of Elements11Number of Terminals22Operating Temperature-Max200 °C200 °COperating Temperature-Min-65 °C*Package Body MaterialMETALMETALPackage ShapeROUNDROUNDPackage StyleFLANGE MOUNTFLANGE MOUNTPeak Reflow Temperature (Cel)260*Polarity/Channel TypeNPNNPNPower Dissipation-Max (Abs)115 W115 WQualification StatusNot QualifiedNot QualifiedSurface MountNONOTerminal FinishTin (Sn)Tin/Lead (Sn/Pb)Terminal FormPIN/PEGPIN/PEGTerminal PositionBOTTOMBOTTOMTime@Peak Reflow Temperature-Max (s)40*Transistor ApplicationSWITCHING*Transistor Element MaterialSILICONSILICONTransition Frequency-Nom (fT)2.5 MHz0.8 MHzBase Number Matches11Rohs Code*NoPbfree Code Yes*FAQWhat is the Transistor Mounting of 2N3055G?Through Hole What is the Max Operating Temperature of 2N3055G?200°C What is the Maximum Collector Emitter Voltage of 2N3055G? 60 V What is the Maximum Collector Base Voltage of 2N3055G? 100 V What is the Maximum Power Dissipation of 2N3055G? 115000 mW

BAT54A is a Schottky Barrier Diode only available in SMD (Surface Mount Device) package which offers low turn ON voltage drop and fast switching capability. The device is designed with PN Junction Guard Ring for transient and ESD protection and is also RoHS compliant ‘Green’ device. BAT54 SMD Diodes in Breadboarded Octave Pedal Experiment (Demo at 6:12) CatalogBAT54A OverviewBAT54A Pinout2D ModelPin ConfigurationParametricsSpecificationsBAT54A Features and Electrical characteristicsApplicationsHow to use BAT54A Schottky Diode?Component DatasheetFAQBAT54A OverviewBAT54A is basically used in low voltage rectifier and protection circuits. The device being designed to have low voltage drop during conduction will become necessary in low voltage circuits where conduction voltage drop cannot be afforded.BAT54A is used in circuits where power efficiency is important. The device being capable of carrying sizable currents while having low drop will lead to high efficiency which is a necessity in battery operated systems.BAT54A is designed to be capable of recovering (from forward conduction to blocking reverse voltage) taking only 5nS so that it can be operated high frequency applications. BAT54A Pinout bat54a pinout 2D Model 2D Model Pin ConfigurationPinNameFunction3AnodeCommon Anode for the two schottky diodes in the device. The current flows in to the device from this pin.2Cathode 2Cathode for second schottky diode in the device. The current flows out from the device through this pin.1Cathode 1Cathode for first schottky diode in the device. The current flows out from the device through this pin.  ParametricsParametricsBAT54CT   max10.0 pFConfiguration1 IndependentIF   max200.0 mAMountingSMTVF   max800.0 mVVR   max30.0 V SpecificationsManufacturer (Brand)STMICROELECTRONICSCaseSOD323Diode TypeschottkyDiode ConfigurationindependentForward Voltage (Max)<0,90V / 0,1AMounting TypeSMDVRRM40 VAverage Rectified Current per Diode0,3 AReverse Leakage Current1uA / 30VReverse Recovery Time (Max)5 nsNote-SeriesBAT5RoHSYes BAT54A Features and Electrical characteristicsLow forward voltage dropVery small conduction lossesExtremely fast switching speedHigh efficiencyTotally lead-free and RoHS complaint deviceMaximum forward continuous current: 200mAMaximum forward surge current: 600mAMaximum reverse voltage: 30VOperating temperature range: -65ºC to 150ºCMaximum power dissipation: 200mW ApplicationsVoltage regulatorsAC-DC filtersSwitching applicationsProtection circuitsLine detectorsDevice protection How to use BAT54A Schottky Diode?BAT54A can be operated like any other rectifier diode and can be installed in rectifier and protection circuits. With that the characteristics of BAT54A can be given as:Conducts in forward bias direction (Anode connected to positive voltage and Cathode connected to ground)Only leakage current up to 0.1mA flows in the reverse direction (Cathode connected to positive voltage and Anode connected to ground)During forward bias a maximum of 1V appears across the device and during reverse bias total supply voltage appears across the device. Component DatasheetBAT54ADatasheetMaterial Content Sheet FAQ1.What is a BAT54 diode?Product Overview. The BAT54 from Diodes Inc is surface mount fast switching planar schottky barrier diode in SOT-23 package. These diode is single configured featured with PN junction guard ring for transient and ESD protection. 2.How does a barrier diode work?In a Schottky diode, a semiconductor–metal junction is formed between a semiconductor and a metal, thus creating a Schottky barrier. The N-type semiconductor acts as the cathode and the metal side acts as the anode of the diode. This Schottky barrier results in both a low forward voltage drop and very fast switching. 3.Why is Schottky diode used?Schottky diodes are used for their low turn-on voltage, fast recovery time and low-loss energy at higher frequencies. These characteristics make Schottky diodes capable of rectifying a current by facilitating a quick transition from conducting to blocking state. 4.What is the Max Reverse Voltage (DC) of BAT54A?30 V 5.What is the Mount of BAT54A?Surface Mount 6.What is the Max Forward Surge Current (Ifsm) of BAT54A?600 mA 7.What is the Element Configuration of BAT54A?Common Anode