The Kynix Blog

IntroductionWhat is the IC package? To put it simply, chip packaging is the process of placing a bare integrated circuit chip produced in a foundry on a load-bearing substrate, leading the pins out, and then fixing the package as a whole. It is analogous to the chip's shell, which can wrap, fix, and seal the chip to protect it from external forces such as water, air, moisture, chemicals, and so on.With the continuous improvement of IC packaging, there are more and more types of IC packaging. Various IC packaging packages types, names, logos, etc. can sometimes be confusing. This blog will give you a brief introduction to IC packaging related content, which mainly includes the following three parts: common IC brand identification, IC package terminology, classification of IC packaging, and hope to help you further effectively distinguish and understand IC packaging. Catalog IntroductionEvolution of IC Packaging TypeIC Packaging Types10 Common IC Brand Identification71 kinds of IC package terminology   explainedFAQ Evolution of IC Packaging TypeIn the early stage of the development of chip packaging, there are mainly two types: 1. Through-hole package2. Surface mount packageThrough hole package mainly includes Dual In-line Package (DIP), Transistor Outline (TO), Pin Grid Array (PGA) and so on. Through-hole packageSurface mount package includes TO-252 (D-PAK), Small-Outline Transistor (SOT), Small Outline Package (SOP), Plastic Quad Flat Package (QFP), Plastic Leaded Chip Carrier (PLCC) and so on.Surface mount packageDue to the increasing demand of the surface mount market, the earlier through-hole TO packaging has also begun to develop to the surface mount mode. For example, DPAK packaging, which is easy for many people to confuse, actually refers to TO-252, D2PAK refers to TO-263 and D3PAK refers to TO-268.In the middle and later stage, chip packaging began to enter the era of area array packaging. During this period, packaging types such as Ball Grid Array Package (BGA), Chip Scale Package (CSP), Quad Flat No-lead Package (QFN) and Multi-Chip Module (MCM) began to become popular.With the further development of packaging technology, some chips have begun to adopt the latest three-dimensional stacking packaging technology. IIC Packaging TypesAccording to the different port direction, the common IC packages can be divided into four categories: unilateral, bilateral, four-sided and matrix and several types can be subdivided from the above four categories according to different packaging forms and port shapes. Please refer to the following table for details. IC packaging types In addition, according to the material medium, IC packaging can also be divided into metal, ceramic, plastic and other types, generally distinguished by prefix. For example, "C" refers to ceramic package, "H" refers to package with heat sink and "P" refers to plastic package. 10 Common IC Brand IdentificationMany integrated circuit models’ prefix is often the abbreviation of the manufacturer's name. If you see the following prefix model, you might as well check the corresponding brand first. Of course, this method is not entirely feasible. So you still have to refer to the PDF file of the specific product according to the actual situation.1. AMDThose prefixed with AM are all AMD products, and there are also some confusion between the prefix PAL, CYPRESS and TI. The specific situation should be determined by checking the information.2. ATMELThose prefixed with AT are ATMEL products.3. CYPRESSThose prefixed with CY are all CYPRESS products, and some of them are confused with prefix PALC, PALCE and TI.4. NSCThose prefixed with DM, LF, LM, DS, etc., are basically NSC products. NSC has many product series with other prefix, but the specific situation should be determined by checking the information.5. AD：Those prefixed with AD, OP are AD brand. AD has many other series, such as prefix: DAC, ADG, ADSP and many other series.6. INTERSIL：Those prefixed with HI1, HI2, HI3, HI4, HA1, HA2, HA3, HA4, CA, ICL, ICM, ID, IS, etc., are INTERSIL products. There is also some confusion between prefix MD and INTEL.7. IDT：The prefix for IDT products is almost the prefix IDT.8. MAXThe prefix for MAX products is almost the prefix MAX.9. AGILENTCommon prefixes are HCPL, HDSP, HSSR, and so on.10. ALTERAThe prefix for ALTERA products is almost the prefix for EPM. IC package Figure (105 kinds in total)71 kinds of IC package terminology explainedStill not sure what some IC packaging terms mean exactly? Here is a list of 71 common IC packaging terms for you.1. BGA (Ball Grid Array)BGA is one of the surface mount packages. Spherical bumps are made on the back of the printed substrate to replace pins. LSI chips are assembled on the front of the printed substrate, and then sealed by molding resin or filling method. It is also known as Pad Array Carrier (PAC) and the number of pins can exceed 200. It is a kind of package for multi-pin LSI.The package was developed by Motorola and was first used in portable phones and other devices. 2. BQFP (Quad Flat Package with Bumper)BQFP is one of the QFP packages that is provided with protrusions (cushions) at the four corners of the package body to prevent bending deformation of the pins during transportation. American semiconductor manufacturers mainly use this package in microprocessors and Asic circuits. The center distance of the pin is 0.635 mm, and the number of pins ranges from 84 to 196. (see QFP). 3. Butt Joint PGA (Butt Joint Pin Grid Array)Butt Joint PGA is an alias for surface mount PGA (see Surface Mount PGA) 4. C- (Ceramic)C- is a mark that represents a ceramic package and is often used in practice. For example, CDIP represents Ceramic DIP. 5. CerdipThe Ceramic Dual In-line Package sealed with glass is for circuits such as ECL RAM, DSP (Digital Signal Processor). Cerdip with glass window is used for ultraviolet erasing EPROM and microcomputer circuit with EPROM. The center distance of the pin is 2.54 mm, and the number of pins ranges from 8 to 42. In Japan, this package is represented as DIP-G (G means glass seal). 6. CerquadOne of the surface mount packages, that is, the lower sealed Ceramic QFP, is used to package logic LSI circuits such as DSP. Cerquad with windows is used to package EPROM circuits. The heat dissipation is better than that of Plastic QFP, and power ranges from 1.5 to 2W can be allowed under natural air cooling conditions. But the cost of packaging is 3 to 5 times higher than that of Plastic QFP. Pin center distance has 1.27 mm, 0.8 mm, 0.65 mm, 0.5 mm, 0.4 mm and other specifications. The number of pins ranges from 32 to 368. 7. CLCC (Ceramic Leaded Chip Carrier)Ceramic Leaded Chip Carrier is one of the surface mount packages, and the pins are drawn from the four sides of the package in T-shaped. Those with windows are used for packaging ultraviolet erasing EPROM and microcomputer circuit with EPROM, etc. This packaging is also known as QFJ and QFJ-G (see QFJ). 8. COB (Chip on Board)Chip on Board package is one of the bare chip mounting technologies. The semiconductor chip is connected and mounted on the printed circuit board, the electrical connection between the chip and the substrate is realized by the lead stitching method. Next, cover it with resin to ensure its reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far lower than that of TAB and reverse chip welding technology. 9. DFP (Dual Flat Package)Dual Flat Package is another name for SOP (see SOP). This was once called in the past, but now it is basically out of use.10. DIC (Dual In-line Ceramic Package)This is another name for Ceramic DIP (including glass seal) (see DIP). 11. DIL (Dual In-Line)DIL is an alias for DIP (see DIP). European semiconductor manufacturers often use this name. 12. DIP (Dual In-line Package)Dual In-line Package is one of the through hole packages. The pins are drawn from both sides of the package, and the packaging materials are plastic and ceramic. DIP is the most popular through-hole package, including standard logic IC, memory LSI, microcomputer circuit and so on. The center distance of the pin is 2.54 mm, and the number of pins ranges from 6 to 64. The packaging width is usually 15.2 mm. Some refer to packages with widths of 7.52 mm and 10.16 mm as skinny DIP and slim DIP (narrow DIP, respectively). In most cases, however, it is indistinguishable and is simply collectively referred to as DIP. In addition, Ceramic DIP sealed with low melting point glass is also known as Cerdip (see Cerdip). 13. DSO (Dual Small Out-lint)DSO is the alias for SOP (see SOP). Some semiconductor manufacturers use this name. 14. DICP (Dual Tape Carrier Package)DICP is one of the TCP (loaded packages). The pins are made on the insulation tape and drawn from both sides of the package. Due to the use of TAB (Tape Automated Bonding) technology, the package shape is very thin. It is commonly used in liquid crystal display drive LSI, but most of them are customized products. In addition, the 0.5 mm thick memory LSI thin package is in the development stage. In Japan, DICP is named DTP according to the standard of EIAJ (Japanese Electronic Machinery Industry). 15. DIP (Dual Tape Carrier Package)As we mentioned above, it is the name of DTCP in the standard of the Japanese Electronic Machinery Industry Association. (see DTCP). 16. FP (Flat Package)FP is one of the surface mount packages and it is another name of QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.17. Flip-chipFlip-chip is one of the bare chip packaging technologies. The metal bump is made in the electrode region of the LSI chip, and then the metal bump is connected to the electrode area on the printed substrate by pressure welding. The occupied area of packaging is basically the same as the size of the chip, which is the smallest and thinnest of all packaging technologies. 18. FQFP (fine pitch quad flat package)FQFP usually refers to the QFP which the center distance of the pin is less than 0.65 mm (see QFP). Some conductor manufacturers use this name.19. CPAC (Globe Top PAD Array Carrier)CPAC is another name for BGA by Motorola in the United States. 20. CQFP (Quad Fiat Package with Guard Ring)CQFP is one of the plastic QFP. The pins are masked with a resin protective ring to prevent bending deformation. Before assembling the LSI on the printed substrate, we need to cut off the pin from the protective ring and make it become L-shaped. This package has been mass produced by Motorola in the United States. The center distance of the pin is 0.5 mm, and the maximum number of pins is about 208.21. H- (with heat sink)H- represents a mark with a heat sink. For example, HSOP represents a SOP with a heat sink.22. Pin Grid Array (surface mount type)PGA is usually a through-hole package with a pin length of about 3.4 mm. The surface mount PGA has display–shaped pins on the bottom of the package, ranging in length from 1.5 mm to 2.0 mm. Mounting uses the method of butt joint with the printed substrate, so it is also known as butt joint PGA. Because the center distance of the pin is only 1.27 mm, which is half smaller than the through-hole PGA, the package body cannot be made very large, and the number of pins is more than the through-hole type (ranges from 250 to 528). It is a package for large-scale logical LSI. The packaging substrate has a multi-layer ceramic substrate and a glass epoxy resin printing base. Packaging based on multi-layer ceramic substrate has been practical. 23. JLCC (J-Leaded Chip Carrier)JLCC refers to the alias for windowed CLCC and windowed Ceramic QFJ (see CLCC and QFJ). The name used by some semiconductor manufacturers. 24. LCC (Leadless chip carrier)LCC refers to a surface mount package with only electrode contact and no pin on the four sides of the ceramic substrate. It is a high-speed and high-frequency IC package, also known as Ceramic QFN or QFN-C (see QFN). 25. LGA (Land Grid Array)LGA , that is, an array state flat electrode contact package made on the bottom surface. All we need to do is to insert the socket when assembling. Ceramic LGA, with 227 contacts (1.27 mm center distance) and 447 contacts (2.54 mm center distance) has been used in high speed logic LSI circuits. LGA can accommodate more input and output pins in a smaller package than QFP. In addition, because of the small impedance of the lead, it is very suitable for high-speed LSI. However, due to the complexity of socket production and high cost, it is basically not used much now. But the demand for it is expected to increase in the future. 26. LOC (Lead on Chip)LOC is one of the LSI packaging technologies. The front end of the lead frame is located at the top of the chip. A convex solder joint is made near the center of the chip, and the lead is stitched for electrical connection. Compared with the original structure in which the lead frame is arranged near the side of the chip, the chip contained in the package of the same size is up to about 1 mm wide. 27. LQFP (Low Profile Quad Flat Package)LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. 28. L-QUADL-QUAD is one of the Ceramic QFP. The thermal conductivity of aluminum nitride for packaging substrate is 7 to 8 times higher than that of alumina and has good heat dissipation. The frame of the package is sealed with alumina and the chip is sealed by filling method, thus the cost is suppressed. It is a package developed for logical LSI that allows 3 w power under natural air cooling conditions. LSI logic packages with 208 pins (0.5 mm center distance) and 160 pins (0.65 mm center distance) have been developed and put into mass production in October 1993. 29. MCM (Multi-Chip Module)MCM is a package that assembles multiple bare semiconductor chips on a wiring substrate. According to the substrate materials, it can be divided into MCM-L, MCM-C and MCM-D. MCM-L is a module that uses the usual glass epoxy resin multi-layer printed substrate. The wiring density is not that high and the cost is low. MCM-C is a module which uses thick film technology to form multi-layer wiring and uses ceramics (alumina or glass-ceramic) as substrate, which is similar to mixing IC with thick film of multi-layer ceramic substrate. There is no significant difference between them, and the wiring density was higher than that of MCM-L.MCM-D is a module which uses thin film technology to form multi-layer wiring and uses ceramics (alumina or aluminum nitride) or Si and Al as substrate. The wiring density is the highest of the three modules, but the cost is also high. 30. MFP (Mini Flat Package)MFP is another name for plastic SOP or SSOP (see SOP and SSOP) and it is used by some semiconductor manufacturers. 31. MQFP (Metric Quad Flat Package)MQFP is a classification of QFP according to the JEDEC standard. It refers to standard QFP with a pin center distance of 0.65 mm and a body thickness of 3.8 mm~2.0 mm (see QFP). 32. MQUAD (Metal Quad)MQUAD is a kind of QFP package developed by Olin Company in the United States. The substrate and cover are made of aluminum and sealed with adhesive. The power of 2.5 w~2.8 w can be allowed under the condition of natural air cooling. SHINKO ELECTRIC INDUSTRIES CO., LTD. was licensed to start production in 1993. 33. MSP (Mini Square Package)MSP is another name for QFI (see QFI) and is often called in the early days of development. QFI is the name specified by the Electronic Machinery Industry Association of Japan. 34. OPMAC (Over Molded Pad Array Carrier)OPMAC is the name used by Motorola for molded resin seal BGA (see BGA). 35. P- (plastic)P- is the mark that represents a plastic package. For example, PDIP represents Plastic DIP. 36. PAC (Pad Array Carrier)PAC is an alias for BGA (see BGA). 37. PCLP (Printed Circuit Board Leadless Package)Fujitsu of Japan uses the name for Plastic QFN (Plastic LCC) (see QFN). The center distance of the pin can be divided into two specifications: 0.55 mm and 0.4 mm. It is currently in the development phase. 38. PFPF (Plastic Flat Package)PFPF is an alias for Plastic QFP (see QFP) and it is used by some LSI manufacturers. 39. PGA (Pin Grid Array)PGA is one of the through-hole packages, and the vertical pins on the bottom are arranged in the form of display. The packaging substrate is basically multi-layer ceramic substrate. In the case of not specifically indicating the name of the material, most of the Ceramic PGA, are used in high-speed and large-scale logic LSI circuits. The cost is high. The center distance of the pin is usually 2.54 mm, and the number of pins ranges from 64 to 447. In order to reduce the cost, the packaging substrate can be replaced by glass epoxy resin printing substrate. There is also Plastic PGA with 64 to 256 pins. In addition, there is a short pin surface mount PGA (Butt Joint PGA) with a pin center distance of 1.27 mm. (see Surface Mount PGA). 40. Piggy BackIt refers to a ceramic package with sockets and its shape is similar to that of DIP, QFP and QFN. It is used to confirm operation on the evaluation program when developing a device with a microcomputer. For example, plug the EPROM into the socket for debugging. This kind of package is basically custom-made, and there is little circulation on the market. 41. PLCC (Plastic Leaded Chip Carrier)PLCC is one of the surface mount packages. The pin is drawn from the four sides of the package in the shape of T and is made of plastic. Texas Instruments was first used in 64k-bit DRAM and 256k-bit DRAM, and now it has been widely used in logic LSI, DLD (or logic device) and other circuits. The center distance of the pin is 1.27 mm, and the number of pins ranges from 18 to 84. The J-shaped pin is not easy to deform and is easier to operate than QFP, but the appearance inspection after welding is more difficult.PLCC is similar to LCC (also known as QFN). In the past, the only difference between the two was that the former used plastic and the latter used ceramics. But now there are J-shaped pin packages made of ceramics and pin-free packages made of plastic. (marked as plastic LCC, PC LP, P-LCC, etc.) Thus they have been unable to distinguish.To this end, the Japanese Electronics and Machinery Industry decided in 1988 to refer to packages with J-shaped pins on four sides as QFJ, and packages with electrode bumps on four sides as QFN (see QFJ and QFN). 42. P-LCC (Plastic Leadless Chip Carrier)Sometimes it is another name for Plastic QFJ, sometimes it is another name for QFN (Plastic LCC) (see QFJ and QFN). Some LSI manufacturers use PLCC for lead package and P-LCC for lead-free package to show the difference. 43. QFH (Quad Flat High Package)QFH is a kind of Plastic QFP. In order to prevent the package body from breaking, the QFP body is made thicker (see QFP). This is the name used by some semiconductor manufacturers. 44. QFI (Quad Flat I-leaded Package)QFI is one of the surface mount packages. The pin is drawn from the four sides of the package in I-shaped. It is also known as MSP (see MSP). The mount is connected with the printed substrate by butt joint. Because there is no protruding part of the pin, the occupied area of the mount is smaller than that of QFP. Hitachi has developed and used this package for video analog IC. In addition, this package is also used by PLL IC of Motorola, a Japanese company. The center distance of the pin is 1.27 mm, and the number of pins is from 18 to 68.45. QFJ (Quad Flat J-leaded Package)QFJ is one of the surface mount packages. The pin is drawn from the four sides of the package in the shape of J. It is the name stipulated by the Japan Electronic Machinery Industry Association. The center distance of the pin is 1.27 mm. There are two kinds of materials: plastic and ceramics. Plastic QFJ is mostly called PLCC (see PLCC), and it is for microcomputers, gate displays, DRAM, ASSP, OTP, etc. The number of pins ranges from 18 to 84. Ceramic QFJ is also known as CLCC and JLCC (see CLCC). The windowed package is used for ultraviolet erasing EPROM and microcomputer chip circuits with EPROM. The number of pins ranges from 32 to 84.46. QFN (Quad Flat Non-leaded Package)QFN is one of the surface mount packages and it is often called LCC now. QFN is the name specified by the Electronic Machinery Industry Association of Japan. The four sides of the package are equipped with electrode contacts. Because there are no pins, the mounting area is smaller than QFP, and the height is lower than QFP. However, when there is a stress between the printed substrate and the package, it cannot be alleviated at the electrode contact. Therefore, it is difficult for electrode contacts to make as many pins as QFP. The number of pins is generally ranges from 14 to 100.There are two kinds of materials: ceramic and plastic. When marked with LCC, they are basically Ceramic QFN. The center of the electrode contact is 1.27 mm.Plastic QFN is a low-cost package for printing substrate with glass epoxy resin. In addition to 1.27 mm, there are two kinds of electrode contact center distance: 0.65 mm and 0.5 mm. This package is also known as Plastic LCC, PCLC, P-LCC and so on.47. QFP (Quad Flat Package)QFP is one of the surface mount packages, with pins drawn from four sides in L-shaped. There are three kinds of substrate: ceramic, metal and plastic. In terms of quantity, plastic packaging accounts for the vast majority. When the material is not specifically indicated, most of the cases are Plastic QFP. Plastic QFP is the most popular multi-pin LSI package. It is not only used in microprocessor, gate display and other digital logic LSI circuits, but also in VTR signal processing, audio signal processing and other analog LSI circuits. The center distance of pin has 1.0 mm, 0.8 mm, 0.65 mm, 0.5 mm, 0.4 mm, 0.3 mm and other specifications. The maximum number of pins in the 0.65 mm center distance specification is 304.In Japan, QFP with a pin center distance less than 0.65 mm is called QFP (FP). But now the Japanese Electronics and Machinery Industry will re-evaluate the shape of the QFP. There is no difference in the center distance of the pin. But according to the thickness of the package body, it can be divided into three types: QFP (2.0 mm~3.6 mm thickness), LQFP (1.4 mm thickness) and TQFP (1.0 mm thickness).In addition, some LSI manufacturers specifically refer to the QFP with the pin center distance as 0.5 mm as shrink QFP or SQFP, VQFP.However, some manufacturers also call the QFP with pin center distance of 0.65 mm and 0.4 mm SQFP, which makes the name a little confused. The disadvantage of QFP is that when the center distance of the pin is less than 0.65 mm, the pin is easy to bend. In order to prevent pin deformation, several improved QFP varieties have emerged such as BQFP with tree finger buffer pads on the four corners of the package (see BQFP); GQFP with a resin protection ring which covers the front of the pin (see GQFP) and TPQFP (see TPQFP)，which is set test bumps in the package body and can be tested in a special fixture to prevent pin deformation.In the aspect of logical LSI, many development products and highly reliable products are packaged in multi-layer ceramic QFP. Products with a minimum pin center distance of 0.4 mm and a maximum number of pins of 348 have also been introduced. In addition, there are glass-sealed ceramic QFP.48. QFP (FP) (QFP fine pitch)This is the name specified in the standard of the Japan Electronic Machinery Industry Association. The pin center distance is 0.55 mm, 0.4 mm, 0.3 mm and so on, which is smaller than that of 0.65 mm (see QFP).49. QIC (Quad In-line Ceramic Package)QIC is another name for Ceramic QFP and it is used by some semiconductor manufacturers (see QFP, Cerquad).50. QIP (Quad In-line Plastic Package)QIP is another name for Ceramic QFP and is used by some semiconductor manufacturers (see QFP, Cerquad).51. QTCP (Quad Tape Carrier Package)QTCP is one of the TCP packages that forms pins on the insulation tape and leads out from the four sides of the package. It is a thin package using TAB technology (see TAB, TCP).52. QTP (Quad Tape Carrier Package)QTP is the name used by the Japanese Electronic Machinery Industry for the shape specifications developed by QTCP in April 1993 (see TCP).53. QUIL (Quad In-Line)QUIL is an alias for QUIP (see QUIP).54. QUIP (Quad In-line Package)The pin is drawn from both sides of the package and bends down into four columns at every other pin. The pin center distance is 1.27 mm. When inserted into the printed substrate, the insertion center distance becomes 2.5 mm. Therefore, it can be used for standard printed circuit boards.It is smaller package than the standard DIP. Nippon Electric has adopted this kind of package in microcomputer chips for desktop computers and household appliances. There are two kinds of materials: ceramics and plastics. The number of pins is 64. 55. SDIP (Shrink Dual In-line Package)SDIP is one of the through-hole packages with the same shape as the DIP. Its pin center distance (1.778 mm) is less than DIP (2.54 mm) so it gets this name. The number of pins ranges from 14 to 90. It is also known as SH-DIP. There are two kinds of materials: ceramics and plastics.56. SH-DIP (Shrink Dual In-line Package)SH-DIP is the same as SDIP and it is used by some semiconductor manufacturers. 57. SIL (Single In-Line)SIL is an alias for SIP (see SIP). European semiconductor manufacturers often use this name. 58. SIMM (Single In-line Memory Module)A memory module provided with electrodes only near one side of the printed substrate. It usually refers to a module inserted into a socket. The standard SIMM has two specifications: 30 electrodes with center distance of 2.54 mm and 72 electrodes with center distance of 1.27 mm. The SIMM with 1 megabit and 4 megabit DRAM packaged with SOJ on one or both sides of the printed substrate has been widely used in personal computers, workstations and other devices. There are at least 30 to 40 percent of DRAM is installed in SIMM. 59. SIP (Single In-line Package)The pins are drawn from one side of the package and arranged in a straight line. The package is laterally mounted on the printed substrate. The center distance of the pin is usually 2.54 mm, and the number of pins ranges from 2 to 23, most of which are customized products. Packages come in different shapes. Sometimes packages with the same shape as ZIP are called SIP.60. SK-DIP (Skinny Dual In-line Package)SK-DIP is a kind of DIP which has a narrow body with a width of 7.62 mm and a pin center distance of 2.54 mm. It is often collectively referred to as DIP (see DIP).61. SL-DIP (Slim Dual In-line Package)SL-DIP is a kind of DIP which has a narrow body with a width of 10.16 mm and a pin center distance of 2.54 mm. It is commonly referred to as DIP. 62. SMD (Surface Mount Devices)Occasionally, some semiconductor manufacturers classify SOP as SMD (see SOP).63. SO (Small Out-line)SO is another name for SOP and is used by many semiconductor manufacturers in the world. (see SOP).64. SOI (Small Out-line I-leaded Package)SOI is one of the surface mount packages. The pin is drawn down from both sides of the package in I-shaped, with a center distance from 1.27 mm and 26 pins. The occupied area of mounting is smaller than that of SOP. Hitachi uses this package in analog IC (IC for motor drive).65. SOIC (Small Out-line Integrated Circuit)SOIC is an alias for SOP (see SOP). Many semiconductor manufacturers abroad use this name.66. SOJ (Small Out-Line J-Leaded Package)SOJ is one of the surface mount packages. The pin is J-shaped from both sides of the package, so it gets its name. They are usually plastic products and are used in memory LSI circuits such as DRAM and SRAM. But most of them are used in DRAM.Many of the DRAM devices packaged in SOJ are mounted on SIMM. The center distance of the pin is 1.27 mm, and the number of pins ranges from 20 to 40 (see SIMM).67. SOL (Small Out-Line L-leaded Package)The name used for SOP in accordance with the JEDEC standard (see SOP).68. SONF (Small Out-Line Non-Fin)SONF is the SOP without heat sink. As the same as the usual SOP, the NF (non-fin) mark is intentionally added In order to show that there is no heat sink in the power IC package. The name is used by some semiconductor manufacturers (see SOP).69. SOF (Small Out-Line Package)SOF is one of the surface mount packages with pins drawn from both sides of the package in L-shaped. There are two kinds of materials: plastic and ceramics. And it is also known as SOL and DFP.SOP is not only used for memory LSI, but also widely used in small-scale ASSP and other circuits. SOP is the most popular surface mount package in areas where the input and output terminals do not exceed 10 to 40. The center distance of the pin is 1.27 mm, and the number of pins is from 8 to 44.In addition, a SOP with a pin center distance less than 1.27 mm is also known as a SSOP. A SOP with assembly height less than 1.27 mm is called TSOP (see SSOP, TSOP). There is also a SOP with a heat sink. 70. SOW [Small Outline Package(Wide-Type)]SOW refers to wide body SOP and this name is used by some semiconductor manufacturers.71. COG (Chip on Glass)COG (Chip on Glass) packaging technology, which has great influence on the development of Liquid Crystal Display (LCD) technology, is becoming more and more practical in the world.FAQ 1. What is package in IC?The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.2. What are the different types of IC packages?What is IC packaging?DIP (Double In-line Package)SOP/SOIC/SO (Small Outline Package)QFP (Quad Flat Package)QFN/LCC (Quad Flat Non-leaded Package)BGA (Ball Grid Array Package)CSP (Chip Scale Package)3. What is IC and how it works?An integrated circuit, or IC, is small chip that can function as an amplifier, oscillator, timer, microprocessor, or even computer memory. An IC is a small wafer, usually made of silicon, that can hold anywhere from hundreds to millions of transistors, resistors, and capacitors.4. What are the types of ICs?Below is the classification of different types of ICs basis on their chip size.SSI: Small scale integration. 3 – 30 gates per chip.MSI: Medium scale integration. 30 – 300 gates per chip.LSI: Large scale integration. 300 – 3,000 gates per chip.VLSI: Very large scale integration. More than 3,000 gates per chip.5. How do I know my IC type?How to Identify Integrated Circuit ChipsIdentify the manufacturer first. ...Look up data sheets in the manufacturer's printed catalog. ...Look up a part number in an electronic retailer's catalog. ...Use the technical specifications for a piece of equipment to find part numbers and alternates.6. What is the most common type of digital IC package?DIP (Dual in-line packages)DIP, short for dual in-line package, is the most common through-hole IC package you'll encounter. These little chips have two parallel rows of pins extending perpendicularly out of a rectangular, black, plastic housing.7. What are the advantages of IC?The advantages of ICs : (i) Extremely small in size, (ii) Low power consumption, (iii) Reliability, (iv) Reduced cost, (v) Very small weight and (vi) Easy replacement. 8. What is the IC package?What Is the Package in IC? IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and allow mounting of the electrical contacts connecting it to the printed circuit board (PCB). 9.Why IC packaging is important?IC packaging is the ability to provide more and more I/O interconnections to a die (bare chip) that is increasingly shrinking in size is an ever-present problem.10. What are the three basic types of linear IC packages?IC packages can be grouped into three general categories; Dual In-line Packages, Chip Carriers and Grid Arrays. All the packages, regardless of the category has a body style that scales with pin count.

Nanotechnology, a technology on a microscopic scale that is indiscernible to the human eye, is gradually having a huge impact on human electronic information, manufacturing, energy, environment and medical care. Mobile phones, computers, cosmetics, sunglasses, tennis rackets, bicycles ...... many of your daily necessities are or have been used in nanotechnology.Want to learn more about what is nanotechnology? Click on the video below or scroll down to see more content!What is Nanotechnology? CatalogI. What is nanotechnology?II. Nano products in consumer marketIII. Small, energy-efficient, bendable screen   digital productsIV. Energy saving and environmental   protectionV. Cancer diagnosis and treatmentVI. Nanotechnology risk alertFAQI. What is nanotechnology?Nanoscience is the science that studies the interactions, composition, properties and fabrication methods of matter at the nanoscale (between atomic and molecular to submicron scales). At such small scales, the physical, chemical and biological properties of materials are vastly different compared to those of macroscale objects.A research report prepared by Springer Nature, the National Center for Nanoscience and the Documentation and Information Center of the Chinese Academy of Sciences shows that nanotechnology promotes multidisciplinary cross-fertilization and breeds numerous opportunities for scientific and technological breakthroughs and original innovations. At the same time, nanotechnology will have a huge impact on people's production and life with the birth of high technology.II. Nano products in consumer marketDue to their ideal mechanical, chemical, electrical, thermal or optical properties, new nanomaterials are used in daily necessities and industrial manufacturing.It is estimated that there are more than 1,600 nanotechnology-based consumer products on the market, including lightweight and rigid tennis rackets, bicycles, luggage, auto parts and rechargeable batteries.Ordinary hair dryers or hair straighteners may use nanomaterials to reduce weight or extend service life. Sunscreens have used sunscreen ingredients such as nano-titanium dioxide or zinc oxide that are invisible on the skin surface. Nano-engineered fibers are used to make anti-wrinkle and anti-staining clothes, which are not only light in weight but also prevent the growth of bacteria.In the manufacturing industry, nanostructured materials are used in surface coatings or lubricants for machine parts to reduce wear and extend the service life of the machine. Alloys with nanostructures are ideal high-performance materials for the manufacture of aircraft and aerospace parts due to their high strength, durability and light weight. They are used in the manufacture of airframes, filter materials and other parts to bring stronger corrosion resistance, earthquake resistance and fire resistance.Nano particles of metals, oxides, carbon and other compounds are also good catalysts, and have important industrial applications in petroleum refining, biofuels and other fields.III. Small, energy-efficient, bendable screen digital productsNanotechnology, a key driver for the information technology and digital electronics industry, has further enhanced the performance of many electronic products, such as computers, cell phones and TVs, the study says.Due to the advancement of nanotechnology, integrated chips and transistors have become smaller and smaller, but the calculation speed has increased day by day. In 2016, the world's first 1-nanometer transistor was born. The transistor is made of carbon nanotubes and molybdenum disulfide instead of silicon, demonstrating the potential to further reduce the size of electronic devices.Scientists’ in-depth understanding of the physical properties of nanomaterials has promoted the development of quantum devices, achieved high-speed data transmission with lower energy consumption, and improved the performance and security of information systems.Zhu Xing, chief scientist of the National Nanoscience Center, said that one application area of quantum dots or inorganic semiconductor nanocrystals is the display screen industry. Based on nanotechnology, the display screens of TVs, computers and mobile devices can achieve ultra-high definition, energy saving, and even bendable, and produce more realistic images. People use carbon nanotubes or silver nanowires when designing new transparent conductive materials, which opens the door to the development of various electronic devices that use flexible screens.IV. Energy saving and environmental protectionAccording to experts, nanotechnology can promote the development of alternative energy sources, improve energy efficiency, and provide new solutions for environmental governance.Based on nanotechnology or new catalysts, oil and natural gas extraction and fuel combustion have become more efficient, which reduces pollution and energy consumption of power plants, vehicles and other heavy equipment.Scientists use nano-engineering to improve the performance of solar photovoltaic power generation equipment and reduce costs. Nanomaterials can also be used for waste heat conversion, such as converting car exhaust into useful energy.For another example, scientists have developed nano-particles that can convert carbon dioxide into clean fuel methane, and nano-photocatalysts that can increase the production capacity of hydrogen, which provide the prospect of developing new renewable energy sources.Nano-structured electrode materials can be used to increase the capacity and performance of rechargeable batteries, reduce battery weight, and thereby improve the efficiency and endurance of electric vehicles.In addition, nanotechnology can also be used for water treatment and pollutant cleaning. For example, nanomaterials such as molybdenum disulfide film can promote the desalination of salt water with more efficient filterability, while porous nanomaterials can absorb heavy metals and slicks in water like a sponge to absorb toxic substances such as heavy metals and slick oil.In addition, nanofibers can absorb tiny particles in the air, so they can be used as a filter to purify the air.The application of nanotechnology in environmental governance also includes the detection of pollutants in air, water and soil. Due to their unique chemical and physical properties, nanoparticles are more sensitive to chemical or biological reagents, so they can be used in sensors to identify toxic substances, which is simpler and faster than traditional methods, and can even remove pollutants while detecting.V. Cancer diagnosis and treatmentAccording to experts, nanotechnology has an increasingly significant impact on the medical and health industries, and has been steadily developed in medical applications such as drug delivery, biomaterials, imaging, diagnosis, and active implants.According to the research report, perhaps the most eye-catching application of nanotechnology in biomedicine is the emergence of the so-called nanopore gene sequencing technology. Its working principle is to use an electric field to drive each single DNA strand through a nano-sized hole in the film, that is, a nanopore.When a single strand of DNA passes through the nanopore, the current change generated on the hole is recorded, thereby identifying the gene coding sequence on the single strand. This technology is expected to significantly reduce the cost of gene sequencing and increase the speed of sequencing.Another promising medical application of nanotechnology is drug delivery. Nanotechnology allows drugs to break through chemical, anatomical, and physiological barriers to reach diseased tissues, increasing the amount of drug accumulation at focal sites and reducing damage to healthy tissue.For example, carefully designed nanomedicines can penetrate cancerous tissues via vascular leakage points and accumulate at the target location, thereby increasing the precision of targeted cancer therapy.In medical imaging, nanoparticles, due to their tiny size and special chemical properties, can form aggregates in specific tissues and tumor locations, thus enabling easier and more accurate diagnosis and improving treatment outcomes.Nanotechnology can also be applied to biological tissue engineering. Nanomaterials such as graphene, nanotubes, and molybdenum disulfide can be used to make scaffolds to help repair or reshape damaged tissues. Nanostructured scaffolds can mimic the unique micro-environment of tissues, promote cell attachment, reproduction and growth, and induce normal cell functions and tissue growth.VI. Nanotechnology risk alertNew technology is like a double-edged sword, bringing benefits and risks, and nanotechnology is no exception. The research report pointed out that while praising its rapid development, people should also be careful of its environmental, health and social impacts.The biggest concern of people at present is the threat of nanoparticles to health, because nanoparticles can easily enter the human body through the lungs or skin. For example, it has been found that metal pollutants in carbon nanotubes and nanoparticles of diesel fuel have adverse effects on health. Workers exposed to nano-pollutants in production operations have a higher health risk.In addition, industrial emissions generated during the manufacturing process of nanomaterials will also pose a risk of environmental pollution. Nanoparticles have high activity and small size, which may adversely affect the ecosystem and pose a threat to the survival of animals and plants.Although nanomedicine has a bright future, it is still unclear whether it is involved in metabolism in the human body and how it is metabolized, so it may also bring unexpected consequences. The long-term effect of nanomedicine is still unclear.FAQ 1. What is nanotechnology used for?Nanotechnology also lowers costs, produces stronger and lighter wind turbines, improves fuel efficiency and, thanks to the thermal insulation of some nanocomponents, can save energy. The properties of some nanomaterials make them ideal for improving early diagnosis and treatment of neurodegenerative diseases or cancer. 2. What exactly is nanotechnology?Nanotechnology is science and engineering at the scale of atoms and molecules. It is the manipulation and use of materials and devices so tiny that nothing can be built any smaller. 3. How is nanotechnology used in everyday life?The average person already encounters nanotechnology in a range of everyday consumer products – nanoparticles of silver are used to deliver antimicrobial properties in hand washes, bandages, and socks, and zinc or titanium nanoparticles are the active UV-protective elements in modern sunscreens. 4. Is Nanotechnology good or bad?Nanoparticles do hold out much environmental promise. The same reactivity that makes them harmful in the body also means they can break down dangerous chemicals in toxic waste – or anywhere, for that matter. And their use in electronics drastically reduces power demand, which could cut greenhouse gases. 5. Is nanotechnology safe for humans?Out of three human studies, only one showed a passage of inhaled nanoparticles into the bloodstream. Materials which by themselves are not very harmful could be toxic if they are inhaled in the form of nanoparticles. The effects of inhaled nanoparticles in the body may include lung inflammation and heart problems. 6. What diseases can nanotechnology cure?Nanomedicine — the application of nanomaterials and devices for addressing medical problems — has demonstrated great potential for enabling improved diagnosis, treatment, and monitoring of many serious illnesses, including cancer, cardiovascular and neurological disorders, HIV/AIDS, and diabetes, as well as many types ...7. What is nanotechnology and why is it important?Why is nanotechnology important? Nanotechnology improves existing industrial processes, materials and applications by scaling them down to the nanoscale in order to ultimately fully exploit the unique quantum and surface phenomena that matter exhibits at the nanoscale. 8. What is so special about nanotechnology?Nanotechnology is not simply working at ever smaller dimensions; rather, working at the nanoscale enables scientists to utilize the unique physical, chemical, mechanical, and optical properties of materials that naturally occur at that scale.9. What are the advantages and disadvantages of nanotechnology?Nanotechnology offers the potential for new and faster kinds of computers, more efficient power sources and life-saving medical treatments. Potential disadvantages include economic disruption and possible threats to security, privacy, health and the environment.10. Why Is nanotechnology dangerous?Nanoparticles are likely to be dangerous for three main reasons: Nanoparticles may damage the lungs. ... Nanoparticles can get into the body through the skin, lungs and digestive system. This may help create 'free radicals' which can cause cell damage and damage to the DNA.

RFID is the abbreviation of Radio Frequency Identification.Its principle is the contactless data communication between the reader and the tag to achieve the purpose of identifying the target. RFID has a wide range of applications, typical applications include animal chip, car chip immobilizer, access control, parking control, production line automation, and material management.What is RFID? How RFID works? RFID Explained in DetailCatalogI Overview of RFIDII Working principle of RFIDIII How RFID system is composed?3.1 About the reader3.2 About electronic tagsIV Features4.1 Applicability4.2 High efficiency4.3 Uniqueness4.4 SimplicityFAQI Overview of RFIDRadio frequency identification, or radio frequency identification technology, is a type of automatic identification technology that uses wireless radio frequency for non-contact two-way data communication. It uses radio frequency to read and write recording media (electronic tags or radio frequency cards) to achieve the purpose of identification and data exchange. It is considered to be one of the most promising information technologies in the 21st century.Radio frequency identification technology uses radio waves without contact with fast information exchange and storage technology, combines wireless communication with data access technology, and then connects to the database system to achieve non-contact two-way communication. In this way, the purpose of identification is achieved, and it can be used for data exchange, connecting an extremely complex system in series.In the identification system, the reading and writing and communication of electronic tags are realized through electromagnetic waves. According to the communication distance, it can be divided into near-field and far-field. For this reason, the data exchange mode between the read/write device and the electronic tag is correspondingly divided into load modulation and backscatter modulation.  II Working principle of RFIDThe basic working principle of RFID technology is not complicated: After the tag enters the reader, it receives the radio frequency signal from the reader, and uses the energy obtained by the induced current to send out the product information stored in the chip (Passive Tag, passive tag or passive tag). ), or the tag actively sends a signal of a certain frequency (Active Tag, active tag or active tag). After the reader reads and decodes the information, it is sent to the central information system for relevant data processing.A complete RFID system is composed of three parts: a reader, an electronic tag, a so-called transponder, and an application software system. Its working principle is that the reader emits radio wave energy of a specific frequency to drive the circuit to send out the internal data. At this time, the Reader receives the interpretation data in order and sends it to the application program for corresponding processing.From the perspective of the communication and energy sensing methods between the RFID card reader and the electronic tag, it can be roughly divided into two types: inductive coupling and backscatter coupling. Generally, low-frequency RFID mostly adopts the first method, and high-frequency RFID mostly adopts the second method.The reader can be a read or read/write device depending on the structure and technology used, and it is the information control and processing center of the RFID system. The reader usually consists of a coupling module, a transceiver module, a control module and an interface unit.The reader and the tag generally adopt a half-duplex communication mode for information exchange, and the reader provides energy and timing to the passive tag through coupling. In practical applications, management functions such as the collection, processing and remote transmission of object identification information can be further realized through Ethernet or WLAN. III How RFID system is composed?The complete RFID system consists of three parts: Reader, Tag and data management system. 3.1 About the readerThe reader is a device that reads the information in the tag or writes the information that the tag needs to store into the tag. Depending on the structure and technology used, the reader can be a read/write device, which is the information control and processing center of the RFID system. When the RFID system is working, the reader sends radio frequency energy in an area to form an electromagnetic field, and the size of the area depends on the transmit power.The tag in the coverage area of the reader is triggered to send the data stored in it, or modify the data stored in it according to the instructions of the reader, and can communicate with the computer network through the interface. The basic composition of the reader usually includes: transceiver antenna, frequency generator, phase-locked loop, modulation circuit, microprocessor, memory, demodulation circuit and peripheral interface composition.(1) Transceiver antenna: Send radio frequency signals to the tag, and receive the response signal and tag information returned by the tag.(2) Frequency generator: Generates the operating frequency of the system.(3) Phase-locked loop: Generate the required carrier signal.(4) Modulation circuit: Load the signal sent to the tag to the carrier wave and send it out by the radio frequency circuit.(5) Microprocessor: Generates the signal to be sent to the label, decodes the signal returned by the label, and sends the decoded data back to the application program. If it is an encrypted system, a decryption operation is also required.(6) Memory: store user programs and data.(7) Demodulation circuit: demodulate the signal returned by the tag and deliver it to the microprocessor for processing.(8) Peripheral interface: to communicate with the computer.3.2 About electronic tagsThe electronic tag consists of a transceiver antenna, AC/DC circuit, demodulation circuit, logic control circuit, memory and modulation circuit.(1) Transceiver antenna: Receive the signal from the reader and send the required data back to the reader.(2) AC/DC circuit: Utilize the electromagnetic field energy emitted by the reader, output by the voltage regulator circuit to provide a stable power supply for other circuits.(3) Demodulation circuit: Remove the carrier from the received signal and demodulate the original signal.(4) Logic control circuit: decode the signal from the reader, and send back the signal according to the requirements of the reader.(5) Memory: As a location for system operation and storage of identification data.(6) Modulation circuit: The data sent by the logic control circuit is loaded to the antenna and sent to the reader after the modulation circuit.IV FeaturesGenerally speaking, the radio frequency identification technology has the following characteristics.  4.1 ApplicabilityRFID technology relies on electromagnetic waves and does not require physical contact between the connecting parties. This makes it possible to establish connections without regard to dust, fog, plastic, paper, wood and various obstacles, and to complete communications directly. 4.2 High efficiencyRFID system read and write speed is extremely fast, a typical RFID transmission process is usually less than 100 milliseconds. RFID readers in the high frequency band can even identify and read the contents of multiple tags simultaneously, greatly improving the efficiency of information transmission.  4.3 Uniquenesseach RFID tag is unique, through the RFID tag and product one-to-one correspondence, you can clearly track the subsequent circulation of each product. 4.4 SimplicityRFID tag structure is simple, high recognition rate, the required reading equipment is simple. Especially with the gradual popularization of NFC technology on smart phones, each user's cell phone will become the simplest RFID reader.FAQ 1. What is RFID used for?Radio Frequency Identification (RFID) is the wireless non-contact use of radio frequency waves to transfer data. Tagging items with RFID tags allows users to automatically and uniquely identify and track inventory and assets.2. What is RFID and how it works?RFID is a method of data collection that involves automatically identifying objects through low-power radio waves. Data is sent and received with a system consisting of RFID tags, an antenna, an RFID reader, and a transceiver.3. What RFID means?Radio Frequency Identification (RFID) refers to a wireless system comprised of two components: tags and readers. The reader is a device that has one or more antennas that emit radio waves and receive signals back from the RFID tag.4. Is RFID harmful to human?It is a non-ionizing type of radiation, but some researches show that it could have a negative impact on the human body in a long-term period [11, 12]. So, for the safety reasons, manufacturers of the RFID systems have limited the range of the RFID antennas used in their systems.5. Is RFID tag and FASTag same?FASTag is a device that employs Radio Frequency Identification (RFID) technology for making toll payments directly while the vehicle is in motion. FASTag (RFID Tag) is affixed on the windscreen of the vehicle and enables a customer to make the toll payments directly from the account which is linked to FASTag.6.What is RFID and its advantages?RFID technology automates data collection and vastly reduces human effort and error. RFID supports tag reading with no line-of-sight or item-by-item scans required. RFID readers can read multiple RFID tags simultaneously, offering increases in efficiency.7. Why is RFID bad?Some negative effects are that its deadly, if RFID tags combine with static electricity you can die. Another negative effect is that the government is slowly taking away surviving resources and giving ultimatums, such as if you don't get the RFID tracking chip your public assistance will be terminated.8.What are the disadvantages of RFID?a. Materials like metal & liquid can impact signal.b. Sometimes not as accurate or reliable as barcode scanners.c. Cost – RFID readers can be 10x more expensive than barcode readers.d. Implementation can be difficult & time consuming.9.How do I charge my RFID FASTag?In order to recharge your FASTag sticker, just hit the Add Money option in your Paytm app. FASTag will automatically reserve some amount from your wallet, which can be used at toll plazas later. Do note that FASTag can be used only after 20 mins of adding money to the Paytm Wallet.10. Can I use existing RFID for FASTag?If a vehicle already has an RFID tag, it might already be activated. When you buy the vehicle, RFID tag payment was also done. It might also have a minimum balance of INR 100 or 200 as is required by the bank. You can recharge it with your Customer ID or Wallet ID of FASTag.11. How does RFID work without power?Passive RFID tags have no power of their own and are powered by the radio frequency energy transmitted from RFID readers/antennas. The signal sent by the reader and antenna is used to power on the tag and reflect the energy back to the reader.12. What are the types of RFID tags?RFID tags can be grouped into three categories based on the range of frequencies they use to communicate data: low frequency (LF), high frequency (HF) and ultra-high frequency (UHF). Generally speaking, the lower the frequency of the RFID system, the shorter the read range and slower the data read rate.13.How do I know if I have an RFID chip?The best way to check for an implant would be to have an X-ray performed. RFID transponders have metal antennas that would show up in an X-ray. You could also look for a scar on the skin. Because the needle used to inject the transponder under the skin would be quite large, it would leave a small but noticeable scar.14. Does RFID require power?Active RFID tags possess their own power source – an internal battery that enables them to have extremely long read ranges as well as large memory banks. Typically, active RFID tags are powered by a battery that will last between 3 - 5 years, but when the battery fails, the active tag will need to be replaced.15. What is the difference between a QR code and RFID?QR codes must always be “read-only”, whereas RFID tags can be “read-write”, depending on the radio frequency that's being used. ... So, not only are RFID tags futuristic and have more uses than QR tags, they also have many more applications. The read range is far superior for an RFID tag. 

FPGA (Field-Programmable Gate Array), it is the product of further development on the basis of PAL, GAL, CPLD and other programmable devices. It appears as a kind of semi-custom circuit in the field of application specific integrated circuit (ASIC). It not only solves the shortage of custom circuit, but also overcomes the shortcoming of limited number of gates in the original programmable devices.What is an FPGA, and how does it compare to a microcontroller?CatalogI. What is FPGA?II. Principles of FPGAs III. FPGA Pros & ConsIV. FPGA Chip StructureV. FPGA FeaturesFAQI. What is FPGA?FPGA (Field Programmable Gate Array) is a product of further development on the basis of programmable devices such as PAL and GAL. It emerged as a semi-custom circuit in the field of application-specific integrated circuits (ASIC), which not only solves the deficiencies of custom circuits, but also overcomes the shortcomings of the limited number of gate circuits of the original programmable devices.II. Principles of FPGAs FPGA adopts the concept of Logic Cell Array (LCA), which consists of Configurable Logic Block (CLB), Input Output Block (IOB) and Internal Interconnect. Three parts. FPGAs are programmable devices with a different structure than traditional logic circuits and gate arrays (such as PAL, GAL and CPLD devices). The logic of the FPGA is implemented by loading programmed data into the internal static memory cell, and the values stored in the memory cell determine the logic function of the logic cell and the connection between the modules or between the modules and the I/O. The value stored in the memory cell determines the logical function of the logic unit and the way the modules are linked to each other or to the I/O, and ultimately determines the functions that the FPGA can achieve.III. FPGA Pros & Cons - The Pros of FPGAs:(1) FPGAs consist of hardware resources such as logic cells, RAM, multipliers, etc. By organizing these hardware resources rationally, hardware circuits such as multipliers, registers, address generators, etc. can be implemented.(2) FPGAs can be designed by using block diagrams or Verilog HDL, from simple gate circuits to FIR or FFT circuits.(3) FPGAs can be infinitely reprogrammed, loading a new design solution in a few hundred milliseconds, reducing hardware overhead with reconfiguration.(4) The operating frequency of the FPGA is determined by the FPGA chip as well as the design, and can be modified by modifying the design or replacing it with a faster chip to meet certain demanding requirements (of course, the operating frequency is not unlimited and can be increased, but is governed by current IC processes and other factors).  - The Cons of FPGAs:(1) All functions of FPGAs rely on hardware implementation and cannot implement operations such as branching conditional jumping.(2) FPGAs can only implement fixed-point operations.To conclude: FPGAs rely on hardware to implement all functions and can be compared to dedicated chips in terms of speed, but there is a big gap in design flexibility compared to general purpose processors.IV. FPGA Chip StructureMainstream FPGA is still based on look up table technology, has far exceeded the basic performance of previous versions, and integrates common features (such as RAM, clock management and DSP). FPGA chips have seven main parts: programmable input/ output unit, basic programmable logic unit, complete clock management, embedded block RAM, rich wiring resources, embedded bottom functional unit and embedded special hardware module.The functions of FPGA chip structure are as follows:1. Programmable Input and Output BlockThe programmable input/ output block is referred to as I/ O port. It is the interface part between the chip and the external circuit, which can drive and match the input/ output signals under different electrical characteristics. I/ O in FPGA is classified by group, and each group can support different I/ O standards independently. With the flexible configuration of the software, different electrical standards and I/ O physical characteristics can be met, the drive current can be adjusted, and the frequency of I/ O port of the and pull-up resistor and pull-down resistor can be changed, so that the frequency of the I/ O port can be higher and higher. Some high-end FPGA can support data rate up to 2Gbps through DDR register.Fig 1. IOB Internal Structure DiagramThe external input signal can be read into the FPGA through the memory cell of the IOB module, or directly written into the inside of the FPGA. When the external input signal passes through the memory cell of the IOB module read into the inside of the FPGA, the requirement of hold time  can be reduced, which usually the windows default is 0.In order to facilitate management and adapt to a variety of electrical standards, FPGA's IOB is divided into several banks, each bank interface standard is determined by its interface voltage VCCO, in addition, a bank can only have one VCCO, but each bank VCCO can be different. Only ports with the same electrical standard can be connected together, and the same VCCO voltage is the basic requirement of the interface standard.2. Configurable Logic Block (CLB)CLB is the basic logical unit within the FPGA. The actual number and characteristics of CLBs vary depending on the device, but each CLB contains a configurable switch matrix that consists of 4 or 6 inputs, some lectotype circuits (multiplexers, etc.) and flip-flops. The switch matrix is highly flexible and can be configured to work with combinational logic, shift registers, or RAM. In Xilinx's FPGA device, the CLB consists of multiple (usually 4 or 2) identical Slices and additional logic. Each CLB module be used to realize combinational logic and sequential logic, and it can also be configured as distributed RAM and distributed ROM.Fig 2. CLB Structure DiagramSlice is a basic logical unit defined by Xilinx. A Slice consists of two 4-input functions, carry logic, arithmetic logic, storage logic and function multiplexer. Arithmetic logic includes a  XORG and a MULTAND. XORG enables a Slice to implement the full operation of 2bit, and MULTAND improves the efficiency of multipliers. Carry logic consists of a dedicated carry signal and a function multiplexer for fast arithmetic addition and subtraction operations; 4-input functions generator is used to implement the 4-input LUT, distributed RAM or 16-bit shift register. Carry logic includes two fast carry chains to improve the processing speed of the CLB module.Fig 3. Inputting Slice Structure Diagram3. Digital Clock Management (DCM)Most of the industry's FPGA offer digital clock management. FPGA offers digital clock management and phase loop locking. Phase loop locking can provide accurate clock synthesis, reduce jitter and achieve filtering.4. Block Random Access Memory (BRAM)Most FPGAs have embedded block RAM, which greatly extends the applications and flexibility of the FPGA. The block RAM may be configured as a single-port RAM, a dual-port RAM, a content address memory (CAM), and a common storage structure such as a FIFO. CAM memory has a comparison logic in each of its internal memory cells, the data written into the CAM will be compared with each of the data in the interior, and the address of all data that is the same as the port data, so that there is a wide range of address switches in the route application. In addition to the block RAM, the LUT in the FPGA can be flexibly configured as a RAM, a ROM, and a FIFO. In practical application, that number of block RAM in the internal block of the chip is also an important factor in the chip selection.The capacity of the monolithic RAM is 18k bits, that is, the bit width is 18 bits and the depth is 1024. It can change the bit width and depth according to the need, but two principles must be satisfied: firstly, the modified capacity (bit width depth) cannot be greater than 18k bits; Second, the maximum bit width cannot exceed 36 bits. Of course, it is possible to concatenate multiple blocks of RAM to form a larger RAM, which is limited only by the number of RAM blocks in the chip and is no longer constrained by the above two principles.5. Wiring SourceAll the parts are connected with wiring resources in the FPGA, and the length and process of the connection determine the driving ability and the transmission speed of the signal on the wire. There are abundant wiring resources in the FPGA chip, according to the process and length, width and distribution position, which are divided into 4 different categories. First is the global routing resource, which is used for the internal global clock and the global reset/ position routing. Second is the long line resource, which is used to complete the wiring of the high-speed signal and the second global clock signal between chip banks. Third is short-line resources, which are used to perform logical interconnection and cabling between basic logical units. Fourth is a distributed wiring resource, which is used as control signal lines for a proprietary clock or a reset.In practice, the designer does not need to select the routing resources directly, and the layout scheduler can automatically select the better routing resources according to the topology of the input logical grid table and constraint conditions to connect each module unit. In essence, the use of routing resource types has a close and direct relationship with the results of the design.6. Underlying Built-in Function The underlying built-in function mainly refers to a DLL (Delay Locked Loop), a PLL (Phase Locked Loop), a DSP, and a CPU, which belong to core softcore. The more and more built-in functional units make the single-chip FPGA a system-level design tool, so that it has the capability of joint design of hardware and software, and gradually turn to the SOC platform.DLL and PLL have similar functions, such as high-precision clock and low jitter frequency doubling and frequency division, duty cycle adjustment and phase shift, etc. Xilinx integrated the DLL, Altera made the PLL, Lattice combined both two, which can be easily managed and configured through IP core-generated tools on Lattice's new chip. Fig 4. Typical DLL module schematics7. Special Built-in Hard CoreThe embedded special hard core is relative to the soft core embedded in the bottom, which means that the hard core with strong processing ability of FPGA is equivalent to the ASIC. To improve FPGA performance, chip manufacturers integrate some dedicated hard cores on the chip. For example, to improve the multiplication speed of FPGA, special multipliers are integrated in the mainstream FPGA, and in order to match the communication bus and interface standard, a lot of high-end FPGA are integrated SERDES, which can achieve the receiving and dispatching speed of  Gbps. V. FPGA Features1) The ASIC circuit is designed by adopting the FPGA, and the user does not need to put the chip into production, so that a shared chip can be obtained.2) FPGA can be used as a trial sample of other fully customized or semi-custom ASIC circuits.3) There are rich flip-flops and I/ O pins within the FPGA.4) FPGA is one of the devices with the shortest design cycle, the lowest development cost and the least risk among ASIC circuits.5) FPGA adopts high-speed CMOS process, low power consumption, and can be compatible with CMOS and TTL.It can be said that FPGA chip is one of the best choices for small batch system to improve system integration and reliability.The working state of FPGA is set by the program stored in the on-chip RAM, so it is necessary to program the on-chip RAM when working. Users can use different programming methods according to different configuration modes.When the power is on, the FPGA chip reads the data from the EPROM into the on-chip programming RAM. After the configuration is completed, the FPGA enters the working state. After power off, FPGA internal logic disappears. Therefore, FPGA can be programmed repeatedly. And the programming of FPGA does not require a special programmer, a general-purpose EPROM or PROM programmer can meet the requirement. When you need to modify the FPGA functionality, just replace a piece of EPROM. In this way, the same piece of FPGA, with different programming data, can produce different circuit functions. Therefore, the use of FPGA is very flexible.FAQ 1. What is FPGA and why it is used?FPGA Basics: Architecture, Applications and Uses. The field-programmable gate array (FPGA) is an integrated circuit that consists of internal hardware blocks with user-programmable interconnects to customize operation for a specific application.2. Is FPGA faster than CPU?They also found that using custom FPGAs to implement the Rowhammer exploit would cause far more of the "bit flips" that they wanted to see. A FPGA can hit the data cell faster and more often than a CPU can do it meaning the FPGA causes more results to occur during an attack. It all goes faster when an FPGA is used.3. Are FPGAs dead?Yes, it's a dead end. If you enjoy creating hardware, RTL design targeting FPGAs is still a good choice (although there is a huge amount of effort here to make it more like creating software than hardware).4. What are FPGAs good for?FPGAs are particularly useful for prototyping application-specific integrated circuits (ASICs) or processors. An FPGA can be reprogrammed until the ASIC or processor design is final and bug-free and the actual manufacturing of the final ASIC begins. Intel itself uses FPGAs to prototype new chips.5. Is FPGA a microprocessor?Microprocessors are more complex than FPGAs. Microprocessors have fixed instructions while FPGAs don't. FPGAs and microprocessors are often mixed into a single package.6. What are the advantages of FPGA?FPGA advantages:Long-term availability.Updating and adaptation at the customer.Very short time-to-market.Fast and efficient systems.Acceleration of software.Real-time applications.Massively parallel data processing.7. Why is FPGA slow?FPGAs tend to get faster in max speed, but the limit actually has to do with process variation affecting static timing. The chips have to have a soultion that works on all of them. So you lose performance of the device to make sure any device will work with it. And as your design gets bigger it runs slower.8. What are the disadvantages of FPGA?Drawbacks or disadvantages of FPGA:The programming is not as simple as C programming used in processor based hardware. Moreover engineers need to learn use of simulation tools. ➨The power consumption is more and programmers do not have any control on power optimization in FPGA. No such issues in ASIC.9. Can FPGA replace CPU?There will always be a need for a general purpose CPU to run most things, and while you can implement a CPU on an FPGA, that gives you the worst of both worlds - no improvement from specialised hardware design, and you still need to pay the “FPGA tax”. So no, FPGAs will never replace CPUs.10. Why use an FPGA vs microcontroller?A FPGA can be used if the design requires complex logic and requires high processing ability and if the cost is comparable to the performance achieved. In case of a design that requires limited hardware, and is set to perform only some specific functions, then Microcontroller is preferred.

This blog is about GPS and inertial sensors for driverless cars. GPS is an essential technology for today's driving locations. However, due to the error, multi-path, and low update frequency of GPS, we cannot rely on it for positioning. Inertial sensors have a high update frequency and can be used in conjunction with GPS. CatalogI Self-driving car positioning technologyII Introduction to GPSIII Introduction to inertial sensorsIV GPS and inertial sensor fusionV GPS vs inertial sensor & GPS vs   inertial sensor fusionVI ConclusionFAQI Self-driving car positioning technologyDriving location is one of the core technologies of Driverless cars. Global positioning system (GPS) also plays a very important role in driverless positioning. However, unmanned vehicles are driving in complex dynamic environments, especially in metropolitan areas, where GPS multipath reflections can be significant. This GPS positioning information is very easy to produce an error. Such errors are likely to cause traffic accidents for cars traveling at high speed over limited widths. Therefore, we must rely on other sensors to assist positioning and enhance the positioning accuracy. In addition, due to the low frequency of GPS update (10Hz), it is difficult to provide accurate real-time positioning when the vehicle is driving fast.The inertial sensor (IMU) is a high-frequency (1KHz) sensor that detects acceleration and rotational motion. After the inertial sensor data is processed, we can get the displacement and rotation information of the vehicle in time. However, the inertial sensor itself also has the effect of deviation and noise . By using Kalman filter-based sensor’s fusion technology, we can integrate GPS and inertial sensor data to achieve better positioning results. Because unmanned driving’s requirements for reliability and safety are very high, positioning based on GPS and inertial sensors is not the only way to locate. We also match LiDAR with high-precision map, or position by visual odometer, so that a variety of positioning method will be adopted to correct each other in order to achieve more accurate results.II Introduction to GPS Global Positioning System (GPS) is an indispensable technology for current driving location and plays a very important role in driverless positioning. The GPS system includes 32 GPS satellites in space, 1 master control station on the ground, 3 data injection stations and 5 monitoring stations, and a GPS receiver as a subscriber station. With at least three of these satellites, the location and altitude of the client on Earth can be quickly determined. Now civilian GPS can reach about 10 meters positioning accuracy. The GPS system uses low-frequency signals and maintains considerable signal penetration, even in poor weather. Following i will analysis GPS operating principle and technical flaws.Figure 1. GPS three-way measurement of positioning2.1 Trilateration methodAs shown in Figure 1, GPS positioning system is the use of satellite basic triangulation Principle, utilizing GPS receiver to measure the transmission time of radio signals to measure the distance. From the location of each satellite, the distance between each satellite and the receiver can be measured to calculate the coordinates of the three-dimensional space of the receiver. Users receive the device as long as the use of three satellite signals received, you can set the user's location. In practice, GPS receiving devices use more than four satellite signals to locate the location and height of the user. Triangle positioning works as follows:Assuming that we measure the distance of the first satellite to 18,000 km, we can limit the current range of possible locations to 18,000 km above the surface of the Earth from the first satellite.Next, suppose we measure a distance of 20,000 km from the second satellite, and then we can further limit the current location to an intersection of 18,000 km from the first satellite and 20,000 km from the second satellite.Then we will measure the third satellite again and locate the current position through the intersection of the three satellites. Normally, the GPS receiver uses the location of the fourth satellite to confirm the position measurements of the first three satellites for better results.2.2 Distance measurement and precise time stampingIn theory, distance measurement is a simple process, and we only need to multiply the signal propagation time by the speed of light to get the distance information. But the problem is that the measured propagation time, any error, will result in a huge distance error. There is a certain amount of error in the clock we use every day. If we use quartz clock to measure the propagation time, there is a big error in GPS-based positioning. To solve this problem, atomic satellites are installed on each satellite to achieve nanosecond-level accuracy. In order for the satellite positioning system to use a synchronous clock, we need to have atomic clocks installed on all receivers as well. But atomic clocks cost tens of thousands of dollars, making it impractical for every GPS receiver to install such an expensive thing. In order to solve this problem, atomic clocks can still be used on every satellite, but ordinary quartz clocks often need to be calibrated at the receiver. Receivers receive signals from four or more satellites and calculate their own errors to adjust their own clock to a uniform time value.2.3 Differential GPSAs mentioned above, there are problems such as errors caused by satellite clocks and delays in satellites' distance measurement. Using differential technology, we can eliminate or reduce these errors, so GPS to achieve higher accuracy. The principle of differential GPS operation is quite simple: if both GPS receivers are fairly close to each other, the signals from both will have almost the same error. If the error of the first receiver can be accurately calculated, The results of the two receivers are corrected.Figure 2. Differential GPSHow to accurately calculate the error of the first receiver? We can place the reference receiver reference station at a known and accurate location. As shown in Figure 2, the GPS receiver installed on the reference station can observe three satellites and perform three-dimensional positioning to calculate the measurement coordinate of the base station. Then we can calculate the error by comparing the measured coordinates with the known coordinates. The reference station then sends the error value to a differential GPS receiver within a radius of 100 km to correct their measurement data.Figure 3. Multipath problem2.4 Multi-path problemAs shown in Figure 3, the multipath problem refers to the error of the signal propagation time caused by the reflection and refraction of GPS signals, which leads to positioning errors. Especially in urban environments, there are many suspended media in the air that reflect and refract GPS signals, and signals that reflect and refract on the outer walls of tall buildings, all of which cause confusion in distance measurements. The current high-precision military differential GPS, in the static and "ideal" environment can indeed achieve centimeter-level accuracy. The "ideal" environment here means that there is not too much suspended medium in the atmosphere, and the GPS has a stronger received signal when measured. However, unmanned vehicles are driving in a complex and dynamic environment, especially in large cities, GPS multipath reflections will be more obvious. This GPS positioning information is very easy to have a few meters of error, is likely to lead to traffic accidents.Even with all sorts of problems, GPS is still a relatively accurate sensor, and GPS errors do not increase over time. However, one problem with GPS is the low update frequency, which is around 10Hz. Due to the speed of unmanned vehicles, we need real-time precise positioning to ensure the safety of unmanned vehicles. Therefore, we must rely on other sensors to assist positioning and enhance the positioning accuracy.III Introduction to inertial sensorsThe inertial sensor (IMU) is a sensor that detects acceleration and rotational movement. The basic inertial sensors include accelerometers and MEMS gyroscope. This article focuses on MEMS-based six-axis inertial sensors, mainly by the three-axis acceleration sensor and three-axis gyroscope components.Here is a video introducing Inertial Sensor in detail：Inertial sensor introductionMEMS inertial sensors are divided into three levels: Low-precision inertial sensors are mainly used in consumer electronics products, smart phones, such sensors priced at 50 cents to a few dollars, but the measurement error will be relatively large. Intermediate inertial sensors are mainly used in automotive electronic stability systems and GPS-assisted navigation systems, such sensors priced at hundreds to thousands of dollars, relative to the low-end inertial sensors, intermediate inertial sensors in the control chip measurement error correction, So the measurement result is more accurate. However, after a long period of operation, the cumulative error will increase. High-precision inertial sensors as a military-grade and space-grade products, requiring high-precision, temperature zone, shock and other indicators. Mainly used for communications satellite wireless, missile seeker, optical aiming system and other stable applications. Such sensors are priced in the hundreds of thousands of US dollars range, even after a long run, such as transcontinental intercontinental missiles, still can achieve the rice level accuracy.Unmanned aerial vehicles are generally low-level inertial sensors. It is characterized by high update frequency (1KHz), can provide real-time location information. But the fatal disadvantage of an inertial sensor is that its error increases over time, so we can only rely on inertial sensors for positioning in a short period of time.Figure 4. Accelerometer3.1 AccelerometerFigure 4 shows the MEMS accelerometer, which works by virtue of the inertia of the moveable part of the MEMS. Because of the large mass of the intermediate capacitor plate and its cantilever configuration, the inertial force it receives exceeds the force that holds or supports it when the speed or acceleration is large enough, at which point it moves, keeping it up and down The distance between the plates will change, the upper and lower capacitors will change accordingly. Capacitance changes with the acceleration is proportional to. Depending on the measurement range, the strength or spring constant of the cantilever structure of the intermediate capacitor plate can be designed differently. And if you want to measure the acceleration in different directions, the structure of this MEMS will be very different. Capacitor changes will be another piece of dedicated chip into a voltage signal, and sometimes the voltage signal will be amplified. The voltage signal is digitized and processed through a digital signal that is output after zero and sensitivity correction.Figure 5. MEMS gyroscope3.2 MEMS gyroscopeFigure 5 shows the MEMS gyroscope, which works on the principle of conservation of angular momentum. It is a non-rotating object whose axis of rotation does not change with the rotation of the support carrying it. Similar to the working principle of an accelerometer, the upper active metal of the gyroscope forms a capacitance with the underlying metal. As the gyroscope rotates, the distance between the gyro and the underlying capacitive plate changes, and the upper and lower capacitances change accordingly. The change in capacitance is proportional to the angular velocity, so we can measure the current angular velocity.3.3 Inertial sensor problemDue to the production process, inertial sensor measurements usually have some error. The first error is the offset error, ie, the gyroscope and accelerometer will have non-zero data output even without rotation or acceleration. To get the displacement data, we need to integrate the accelerometer's output twice. After two integrations, even a small offset error will be magnified and as time progresses, the displacement error will accumulate, ultimately resulting in no further tracking of the UAV's position. The second error is the ratio error, the ratio between the measured output and the change in the sensed input. Similar to the offset error, after two integrals, the error caused by the displacement will accumulate over time. The third kind of error is the background white noise that, if not corrected, can also prevent us from tracking the location of the UAV.In order to correct these errors, we must calibrate the inertial sensor, find the offset error, the proportional error, and then use the calibration parameters to correct the original data of the inertial sensor. But the complication is that the error of the inertial sensor will also change with the temperature. Even if we make the best adjustments, as time goes on, the displacement error will continue to accumulate, so it is very difficult for us to use inertial sensors to locate UAV alone.IV GPS and inertial sensor fusionAs mentioned above, GPS is a relatively accurate positioning sensor even with multi-path problems. However, the update frequency is low and can not meet the requirements of real-time calculation. The inertial sensor positioning error will increase with the running time, but because it is a high-frequency sensor, in a short period of time can provide stable real-time location updates. Therefore, as long as we find a way to combine the advantages of these two sensors, each director, you can get more real-time and accurate positioning. Below we discuss how to use the Kalman filter to fuse the two sensor data.4.1 Introduction to Kalman FilterKalman filter predicts the position coordinates and velocity of an object from a set of observations that contain a limited set of noise-containing object positions. It has strong robustness. Even if there is an error in the observation of the object's position, we can accurately estimate the position of the object based on the historical state of the object and the current observation of the position. The Kalman filter is mainly divided into two phases: the prediction phase predicts the current position based on the position information of the previous time point; the update phase updates the position of the object by correcting the position prediction by observing the current position of the object.To give a concrete example, suppose you have a power outage without any light and you want to walk back to the bedroom from the living room. You know the relative position of the living room to the bedroom, so you walk in the dark and try to predict the current position by counting steps. Halfway through, you touch the TV. Since you know in advance the approximate location of the television in the living room, you can correct your prediction of the current location by the location of your television set, and then continue to rely on the calculated steps based on the more accurate adjusted position estimate Several to the bedroom forward. Relying on the calculation of the number of steps and touch the object, you eventually dark from the living room back to the bedroom, the truth behind this is the core principle of Kalman filter.Figure 6. GPS and IMU sensor fusion positioning4.2 Multi-sensor fusionAs shown in Figure 6, the fusion of inertial sensors and GPS data using a Kalman filter is very similar to the example given above. Inertial sensor here is equivalent to a few steps, and GPS data equivalent to the location of the reference TV. First of all, based on the last position estimation, we use the inertial sensor to predict the current position in real time. Before getting new GPS data, we can only predict the current position by integrating the data of inertial sensors. However, the positioning error of inertial sensors increases with runtime, so we can use this GPS data to update the current position prediction as new, more accurate GPS data is received. By constantly implementing these two steps, we can take the director of both to accurately locate the unmanned vehicle in real time. Assuming that the frequency of the inertial sensor is 1 KHz and the frequency of the GPS is 10 Hz, we can use 100 inertial sensor data points for position prediction between every two GPS updates.V GPS vs inertial sensor & GPS vs inertial sensor fusionThis article describes the principle of using GPS and inertial sensors to accurately position a vehicle in an unmanned location. The system consists of three parts, a relatively accurate but low-frequency update GPS, a high-frequency update but increasingly unstable precision inertial sensors over time, and a Kalman filter-based mathematical model to fuse both Sensors, take the director, in order to achieve fast and accurate positioning effect. However, since driverless reliability and safety requirements are very high, in addition to GPS and inertial sensors, we often use positioning methods such as LiDAR and high-precision map matching, visual odometer and the like to make various positioning France correct each other in order to achieve more accurate results.VI ConclusionThis article focuses on GPS and inertial sensors for driverless applications. GPS is an indispensable technology for current driving location.But due to GPS error, multipathing and low update frequency, we can not rely on GPS for positioning. The inertial sensor has a high update frequency that can complement with GPS. Using sensor fusion technology, we can integrate GPS and inertial sensor data in order to achieve better positioning results.FAQ 1. What is GPS and its uses?The Global Positioning System (GPS) has been developed in order to allow accurate determination of geographical locations by military and civil users. It is based on the use of satellites in Earth orbit that transmit information which allow to measure the distance between the satellites and the user. 2. What GPS means?Global Positioning System. The Global Positioning System (GPS) is a U.S.-owned utility that provides users with positioning, navigation, and timing (PNT) services. 3. How does the GPS work?GPS is a system of 30+ navigation satellites circling Earth. We know where they are because they constantly send out signals. A GPS receiver in your phone listens for these signals. Once the receiver calculates its distance from four or more GPS satellites, it can figure out where you are. 4.What is importance of GPS?Why GPS is Important? GPS includes space-base satellites, computers and receivers which provide your location information in every weather conditions anywhere at any time in the world. It was originally made for the US military to locate their troops in deserted areas and forests. 5. How is GPS useful in our daily life?Using GPS tracking systems, you can manage employee transportation fleet and improve its efficiency. You can save time and fuel, thereby minimizing expenses. While travelling, the feature in the GPS could track the luggage, laptop, and important personal belongings. 6. What is an IMU sensor?An IMU is a specific type of sensor that measures angular rate, force and sometimes magnetic field. ... Technically, the term “IMU” refers to just the sensor, but IMUs are often paired with sensor fusion software which combines data from multiple sensors to provide measures of orientation and heading. 7. How does an inertial device work?How Does an IMU Work? IMUs can measure a variety of factors, including speed, direction, acceleration, specific force, angular rate, and (in the presence of a magnetometer), magnetic fields surrounding the device. IMUs combine input from several different sensor types in order to accurately output movement. 8. How do you use the IMU sensor?An IMU sensor unit working can be done by noticing linear acceleration with the help of one or additional accelerometers & rotational rate can be detected by using one or additional gyroscopes. Some also contain a magnetometer which can be used as a heading reference. 9. Why magnetometer is used in IMU?The third component of our IMU is the magnetometer. This is where I have seen people facing difficulties. It is a device capable of measuring magnetism. It is able to help us find orientation using the earth's magnetic field, similar to a compass. 10. How do I choose an IMU sensor?Some of the aspects we have to consider when we have to select an IMU are performance, underlying technology, SWaP (Size, Weight, and Power) and Cost. Besides, another important factor in UAVs is the ruggedness of the IMU. In harsh UAV applications, vibrations can reach a high level and different temperatures. 

  After 20 years, your life may be like this:The electronic skin on your pulse can monitor your heart rate and blood sugar at any time to realize intelligent pulse detection;The electronic skin on your throat can "voice" for the deaf and mute by feeling the pressure changes produced by the movement of the throat muscles;Your whole body may become a network center, and the sensors in your body will connect with the outside world...All this seems very far away, but these technologies are quietly gestating, and are very likely to become disruptors of new technologies.Flexible Electronics: The Future of TECHNow is the era of smart phones, but the current smart electronic products are still rigid electronic devices. In the future, mankind is about to enter a new era, the era of flexible electronics. Flexible electronic devices that are as soft as human skin will be the next development trend of the electronics industry, and may even subvert human life. Catalog I What is Flexible electronics?II Applications of flexible electronics2.1 Flexible electronic display2.2 Thin film solar panels2.3 RFID2.4 Electronic skinIII ConclusionFAQ  I What is Flexible electronics? The concept of flexible electronics started in the 1980s, when people tried to replace inorganic semiconductors such as silicon with organic semiconductors, so that organic electronic devices have flexible characteristics.Flexible electronic technology is a brand-new electronic technology revolution. It is an emerging electronic technology that makes organic and inorganic materials electronic devices on flexible, malleable plastic or thin metal substrates. It has a wide range of fields in information, energy, medical treatment, and national defense.  Applications of flexible electronics In addition to integrating electronic circuits, functional materials, micro-nano manufacturing and other fields of technology, flexible electronic technology also spans industries such as semiconductors, packaging, testing, materials, chemicals, printed circuits, and display panels. Not only that, it can also help the transformation and upgrading of traditional industries, such as plastics, printing, chemicals, and metal materials.By improving its performance and industrial added value, flexible electronics will frequently appear in human life, bringing revolutionary changes to the industrial structure and future life. As technology upgrades, flexible electronics materials research and development and rich application products have emerged.II Applications of flexible electronicsWith the development of flexible electronic technology, various electronic products have emerged. Just as microelectronics technology provides a technology platform for large-scale integrated circuits and computer chip technologies, flexible electronic technology provides a brand-new technological platform for the research and development of new products. 2.1 Flexible electronic displayThe flexible electronic display is a brand-new product developed on the flexible electronic technology platform. Unlike traditional flat-panel displays, such displays can be repeatedly bent and folded, thus bringing great convenience to our lives.For example, all visual materials, including books, newspapers, magazines, and video files, can be presented on this display and can be viewed anytime, anywhere. Although current popular MP4 players and personal digital assistants (PDAs) can meet such use needs, the display screen cannot be bent and folded, and can only be read and viewed in a small screen area. And video, visual effects are greatly constrained. In contrast, flexible electronic displays have unparalleled advantages. They are like newspapers. When they are needed, they are unfolded. When they are used, they are curled or even folded. This guarantees the convenience of portability while giving full consideration to the visual effects.Flexible electronic displaySamples of flexible electronic displays have been successfully developed and it is believed that it will be a long way from entering the market. It is worth mentioning that flexible electronic displays use more lightweight organic materials instead of inorganic materials, so their weight is lighter than traditional displays, and this feature helps to improve their portability. In addition, the use of high molecular organic materials offers possibilities for reducing costs. In addition, the flexible electronic display has the characteristics of a thin thickness, and its thickness can be much smaller than that of the popular liquid crystal display. Therefore, another name of the flexible electronic display is a paper-like electronic display.2.2 Thin film solar panelsThin film solar panel is another specific application of flexible electronics technology. In today's world, energy has become a topic of global concern. China not only faces energy shortages but also faces environmental pollution. As a clean energy source, solar energy can effectively alleviate the contradiction of energy shortage under the premise of zero environmental pollution.As the most common way to use solar energy, solar panels can cover a large area at the lowest cost to effectively use solar energy. At present, thin film amorphous Sili-Con solar panels have been successfully developed and marketed. Thin film solar panel Thin-film solar panels based on flexible electronic technology can meet high-power generation needs, such as the use of thin-film solar panels in solar power plants in sunny desert areas.In addition, it can also make full use of its flexible and lightweight features to integrate it into clothing. Putting on such clothes to walk or exercise in the sun, the power of small appliances (such as MP3 players and laptops) that are carried around can be supplied by the thin-film solar panels on the clothes, thus achieving the purpose of saving and environmental protection.2.3 RFIDRadio frequency identification (RFID) technology can be used to complete information input and processing, fast and convenient operation, and rapid development without manual contact, and is widely used in production, logistics, transportation, medical, food, security and other fields. RFID systems usually consist of transponders and readers.The electronic tag is one of many forms of transponder, and can be understood as a transponder with a thin film structure, which has the characteristics of convenient use, small size, thin and light, and can be embedded in the product. More and more electronic tags will be used in future RFID systems.Flexible Electronics in RFIDIn this response to Covid-19, flexible electronic technology has played a huge role in body temperature measurement.Group body temperature measurement has problems such as huge number of monitoring people, cumbersome temperature measurement work, and difficulty in continuous temperature recording. Wearable temperature measuring stickers made by introducing flexible electronic technology can record and analyze the body temperature data of the target population. In this way, potential threats can be discovered and eliminated through long-term monitoring, thereby helping management departments to achieve personnel management monitoring.2.4 Electronic skinAnother important application of flexible electronics is electronic skin. Electronic skin, also called skin-like electrons, is basically characterized in that various electronic components are integrated on a flexible substrate to form a skin-like circuit board, which has high flexibility and elasticity like skin and can be used in many other applications. electrical equipment.It can be said that the potential of flexible electronic skin is great. With the popularization of technologies such as smart medical care, virtual reality, and artificial intelligence, the demand for wearable devices has surged, and flexible electronic skin is a perfect combination of wearable devices. Think about an electronic component installed on the body and used as a skin, isn't it sci-fi?Electronic skinIII Conclusion Folding computers, folding mobile phones, and wearable digital products are in the ascendant. With the development of science and technology, flexible electronic devices have received more and more attention from the society. Such devices can still work under bending, folding, twisting, compression or stretching conditions. In the future, flexible electronic equipment will have a very broad development space in the fields of energy, medical, information and communication.Pieces of work brought by flexible electronics are interpreting the integration of innovation and tradition in the era of the Internet of Everything, and the era of science and technology connecting everything is approaching.You can boldly imagine that in 20 years, your life might be like this:In the morning, the flexible electronic skin watch on your body wakes you up and reports the quality of your sleep. Put on your glasses, and the day’s schedule has been displayed for you on the transparent screen. After washing, the robot has prepared breakfast for you and your family; After going out, the smart watch on your wrist shows that the air quality is excellent; the smart assistant called "Flying" for you and has parked outside the house, waiting for you to start your day's itinerary... FAQ 1. Why are electronics flexible?The key advantages of flexible electronics, compared with current silicon technologies, are low-cost manufacturing (e.g. ink-jet printing and roll-to-roll imprinting) and inexpensive flexible substrates (e.g. plastics). ... In principle, flexible electronics is ideal for integration. 2. Where are flexible electronics used?Consumer electronics devices make use of flexible circuits in cameras, personal entertainment devices, calculators, or exercise monitors. Flexible circuits are found in industrial and medical devices where many interconnections are required in a compact package. 3. How could Flexible Electronics benefit the consumer?Among the benefits of flexible electronics (compared to traditional, rigid alternatives) are size, weight, portability, and energy efficiency. Above all, they make previously impossible designs and technologies (such as wearable devices) possible. 4. When was flexible electronics invented?1960s. Flexible electronics have a long history. The first flexible device was made in the 1960s by thinning crystalline silicon solar cells for use in extraterrestrial satellites. Today, smart credit cards carry bendable microchips which are made using stretchable Silicon. 5. What are flexible electronics made of?Flexible Electronics: generally refers to a class of electronic devices built on conformable or stretchable substrates, usually plastic, but also metal foil, paper and flex glass. 6. What are the two major approaches of making flexible electronics?(1) Transfer and bonding of completed circuits to a flexible substrate(2) Fabrication of the circuits directly on the flexible substrate  7. What makes flexible electronic display attractive?One property of flexible electronics which deserves to be highlighted is their robustness. This makes a great difference for applications such as wearables, notebooks and other consumer electronics which traditionally feature glass-based displays or sensors. 8. How flexible electronics are made?Compared with conventional microelectronics, flexible electronics does not require extrinsic packages such as ceramics. Instead, flexible circuits and packages can be manufactured and integrated together using only plastics. ... These layers can then be stacked together to complete the flexible electronic systems. 9. Why are flexible electronics important?Among the benefits of flexible electronics (compared to traditional, rigid alternatives) are size, weight, portability, and energy efficiency. Above all, they make previously impossible designs and technologies (such as wearable devices) possible. 10. Why do we need flexible materials?Not only does flexible packaging use less material than its rigid counterparts, leading to a lower overall packaging cost, it also creates less waste. Fres-co states that flexible packaging formats create 50 percent less waste than rigid ones, while also reducing greenhouse gas emissions and BTU consumption.