The Kynix Components

CatalogProduct OverviewMMA8452QR1 CAD ModelsMMA8452QR1 Pin ConfigurationMMA8452QR1 Block DiagramMMA8452QR1 FeaturesMMA8452QR1 ApplicationsMMA8452QR1 DatasheetMMA8452QR1 SpecificationsMMA8452QR1 ManufacturerUsing WarningMMA8452QR1 FAQ Product OverviewThe MMA8452Q is a smart, low-power, three-axis, capacitive, micromachined accelerometer with 12 bits of resolution. This accelerometer is packed with embedded functions with flexible user programmable options, configurable to two interrupt pins. Embedded interrupt functions allow for overall power savings relieving the host processor from continuously polling data. The MMA8452Q has user selectable full scales of ±2 g/±4 g/±8 g with high-pass filtered data as well as non-filtered data available real-time. The device can be configured to generate inertial wakeup interrupt signals from any combination of the configurable embedded functions allowing the MMA8452Q to monitor events and remain in a low-power mode during periods of inactivity. The MMA8452Q is available in a 16-pin QFN, 3 mm x 3 mm x 1 mm package. MMA8452QR1 CAD Models Figure: MMA8452QR1 PCB Symbol   Figure: MMA8452QR1 Footprint   Figure: MMA8452QR1 3D Models MMA8452QR1 Pin Configuration Figure: MMA8452QR1 Pin Configuration MMA8452QR1 Block Diagram Figure: MMA8452QR1 Block Diagram MMA8452QR1 Features1.95 V to 3.6 V supply voltage1.6 V to 3.6 V interface voltage±2 g/±4 g/±8 g dynamically selectable full-scaleOutput data rates (ODR) from 1.56 Hz to 800 Hz99 μg/√Hz noise12-bit and 8-bit digital outputI2C digital output interfaceTwo programmable interrupt pins for six interrupt sourcesThree embedded channels of motion detection— Freefall or motion detection: one channel— Pulse detection: one channel— Transient detection: one channelOrientation (portrait/landscape) detection with set hysteresisAutomatic ODR change for auto-wake and return to sleepHigh-pass filter data available real-timeSelf-testCurrent consumption: 6 μA to 165 μA MMA8452QR1 ApplicationsE-compass applicationsStatic orientation detection (portrait/landscape, up/down, left/right, back/front position identification)Notebook, e-reader, and laptop tumble and freefall detectionReal-time orientation detection (virtual reality and gaming 3D user position feedback)Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)Motion detection for portable product power saving (auto-sleep and auto-wake for cell phone, PDA, GPS, gaming)Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)User interface (menu scrolling by orientation change, pulse detection for button replacement) MMA8452QR1 DatasheetYou can download the datasheet from the link given below:MMA8452QR1 Datasheet MMA8452QR1 SpecificationsTypeDescriptionCategorySensors, TransducersAccelerometersMfrNXP USA Inc.Product StatusObsoleteTypeDigitalAxisX, Y, ZAcceleration Range±2g, 4g, 8gSensitivity (LSB/g)1024 (±2g) ~ 256 (±8g)Bandwidth0.78Hz ~ 400HzOutput TypeI²CVoltage - Supply1.95V ~ 3.6VFeaturesAdjustable Bandwidth, Selectable Scale, Sleep ModeOperating Temperature-40°C ~ 85°C (TA)Mounting TypeSurface MountPackage / Case16-VFQFNSupplier Device Package16-QFN (3x3)Base Product NumberMMA84 MMA8452QR1 ManufacturerNXP Semiconductors is a leading supplier of embedded controllers offering a broad portfolio of MCUs with Arm-based processors and microcontrollers for a variety of industries including automotive, wireless connectivity and more. They continue to drive innovation offering a strong Power Management portfolio for industrial and automotive applications, including multiple power supplies and battery management solutions. NXP products power and connect across the globe building solutions, helping enhance the proficiency of people, organizations and the world has a whole. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. MMA8452QR1 FAQHow does a digital accelerometer work?An accelerometer uses electromagnetic sensing that measures the vibration of a structure, in our case, an aircraft. The force that is caused by the vibration causes the accelerometer to produce an electrical charge indicating how much force was exerted. What are accelerometers useful for?Accelerometers can be used to measure vibration on cars, machines, buildings, process control systems and safety installations. They can also be used to measure seismic activity, inclination, machine vibration, dynamic distance and speed with or without the influence of gravity. What devices use an accelerometer?Smartphones, cameras, video game devices, airplanes, rockets, and fall detection devices are just a few of the many different things that use these tiny little devices. The medical applications alone make accelerometers one of the most important tools in day-to-day health and automatic fall detection. 

IRF640N OverviewWhat is MOSFET?IRF640N FeaturesIRF640N ParameterIRF640N CAD ModelsIRF640N Functional Block DiagramIRF640N Application CircuitIRF640N AdvantageIRF640N EquivalentIRF640N PinoutIRF640N ManufacturerIRF640N PackageIRF640N FAQIRF640N DatasheetIRF640N Overview The IR MOSFET series of power MOSFETs uses proven silicon technologies to provide designers with a diverse device portfolio to serve a variety of applications including DC motors, inverters, SMPS, lights, load switches, and battery-powered applications. For ease of design, the devices come in a choice of surface mount and through-hole packaging with industry standard footprints.This page will go through the IRF640N in detail, from its features and pinout to its specifications and uses, as well as the IRF640N datasheet. What is MOSFET? MOSFET, in short, is a metal oxide semiconductor field-effect transistor used to switch or amplify voltages in circuits. Being part of the field-effect transistor family, it is a current-controlled device that is constructed with 3 terminals;SourceGainDrainThe purpose of a MOSFET transistor is essentially to control voltage/current flow between the source and the drain. The working principle differs based on the type of MOSFET. IRF640N Features Ultra Low On-Resistance- rDS(ON) = 0.102Ω (Typ), VGS = 10VSimulation Models- Temperature Compensated PSPICE® and SABER© Electrical Models- Spice and SABER© Thermal Impedance ModelsPeak Current vs Pulse Width CurveUIS Rateing CurveAdvanced Process TechnologyDynamic dv/dt Rating175°C Operating TemperatureFast SwitchingFully Avalanche RatedEase of ParallelingSimple Drive RequirementsLead-Free IRF640N ParameterManufacturer:InfineonMounting Style:Through HolePackage/Case:TO-220-3Transistor Polarity:N-ChannelNumber of Channels:1 ChannelVds - Drain-Source Breakdown Voltage:200 VId - Continuous Drain Current:18 ARds On - Drain-Source Resistance:150 mOhmsVgs - Gate-Source Voltage:- 20 V, + 20 VVgs th - Gate-Source Threshold Voltage:2 VQg - Gate Charge:44.7 nCMinimum Operating Temperature:- 55 CMaximum Operating Temperature:+ 175 CPd - Power Dissipation:150 WConfiguration:SingleFall Time:5.5 nsForward Transconductance - Min:6.8 SHeight:15.65 mmLength:10 mmRise Time:19 nsSubcategory:MOSFETsTransistor Type:1 N-ChannelTypical Turn-Off Delay Time:23 nsTypical Turn-On Delay Time:10 nsWidth:4.4 mmUnit Weight:2 g IRF640N CAD ModelsSymbolFootprint3D Models IRF640N Functional Block Diagram   IRF640N Application Circuit Gate Charge Test CircuitSwitching Time Test CircuitUnclamped Energy Test Circuit  IRF640N Advantage Ruggedness has been improved.Wide distribution partner availabilityIndustry standard qualificationHigh performance in low frequency applicationsStandard pin-out allows for drop-in replacementHigh current capability IRF640N Equivalent You can replace the IRF640N with the  IRFB23N20D, IRFB260N, IRFB31N20D, IRFB38N20D, IRFB4127, IRFB4227, IRFB4229, IRFB4233, IRFB42N20D, IRFB4332. IRF640N Pinout IRF640N Manufacturer Infineon Technologies AG is Germany's largest semiconductor manufacturer, founded in 1999, when the semiconductor operations of the former parent company Siemens AG were spun off.Success in the highly competitive and ever-changing microelectronics world is our constant goal. As the world's leading designer, manufacturer and supplier, Infineon has a wide range of products used in various microelectronics applications. Its product portfolio includes not only logic products, including digital, mixed-signal and analog integrated circuits, but also discrete semiconductor products. IRF640N Package TO-220AB  IRF640N FAQ: - What’s IRF640N Number of Channels?1 channel - What’s IRF640N Continuous Drain Current?Vgs = 18 V - Can IRF640N be operated in 100℃?Yes, its recommended operating temperature is between -55°C ~ 175°C . - How many pins does IRF640N have?It has 3 pins. - What’s IRF640N dimensions?Height:15.65mm/Length:10mm/Width:4.4mm IRF640N DatasheetIRF640N PDF 

CatalogProduct OverviewW9825G6KH-6 CAD ModelsW9825G6KH-6 Pin ConfigurationW9825G6KH-6 Block DiagramW9825G6KH-6 FeaturesW9825G6KH-6 DatasheetW9825G6KH-6 SpecificationsW9825G6KH-6 ManufacturerUsing WarningW9825G6KH-6 FAQ Product OverviewW9825G6KH is a high-speed synchronous dynamic random access memory (SDRAM), organized as 4M words 4 banks 16 bits. W9825G6KH delivers a data bandwidth of up to 200M words per second. To fully comply with the personal computer industrial standard, W9825G6KH is sorted into the following speed grades: -5, -5I, -6, -6I, -6J, -6L, -75, 75J and 75L. The -5/-5I grade parts are compliant to the 200MHz/CL3 specification (the -5I industrial grade which is guaranteed to support -40°C ≤ TA ≤ 85°C). The -6/-6I/-6J/-6L grade parts are compliant to the 166MHz/CL3 specification (the -6I industrial grade which is guaranteed to support -40°C ≤ TA ≤ 85°C, the -6J industrial plus grade which is guaranteed to support -40°C ≤ TA ≤ 105°C). The -75/75J/75L grade parts are compliant to the 133MHz/CL3 specification (the 75J industrial plus grade which is guaranteed to support -40°C ≤ TA ≤ 105°C). The -6L and 75L grade parts support self refresh current IDD6 max. 1.5 mA. Accesses to the SDRAM are burst oriented. Consecutive memory location in one page can be accessed at a burst length of 1, 2, 4, 8 or full page when a bank and row is selected by an ACTIVE command. Column addresses are automatically generated by the SDRAM internal counter in burst operation. Random column read is also possible by providing its address at each clock cycle. The multiple bank nature enables interleaving among internal banks to hide the precharging time. By having a programmable Mode Register, the system can change burst length, latency cycle, interleave or sequential burst to maximize its performance. W9825G6KH is ideal for main memory in high performance applications. W9825G6KH-6 CAD ModelsFigure: W9825G6KH-6 PCB Symbol   Figure: W9825G6KH-6 Footprint   Figure: W9825G6KH-6 3D Models W9825G6KH-6 Pin ConfigurationFigure: W9825G6KH-6 Pin Configuration W9825G6KH-6 Block DiagramFigure: W9825G6KH-6 Block Diagram W9825G6KH-6 Features3.3V ± 0.3V Power SupplyUp to 200 MHz Clock Frequency4,194,304 Words *4 Banks *16 Bits OrganizationSelf Refresh Mode: Standard and Low PowerCAS Latency: 2 and 3Burst Length: 1, 2, 4, 8 and Full PageBurst Read, Single Writes ModeByte Data Controlled by LDQM, UDQMPower Down ModeAuto-precharge and Controlled Precharge8K Refresh Cycles/64 mS, @ -40°C ≤ TA ≤ 85°C8K Refresh Cycles/16 mS, @ 85°C < TA ≤ 105°CInterface: LVTTLPackaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant W9825G6KH-6 DatasheetYou can download the datasheet from the link given below:W9825G6KH-6 Datasheet W9825G6KH-6 SpecificationsTypeDescriptionCategoryIntegrated Circuits (ICs)MemoryMemoryMfrWinbond ElectronicsPackageTrayProduct StatusActiveMemory TypeVolatileMemory FormatDRAMTechnologySDRAMMemory Size256MbitMemory Organization16M x 16Memory InterfaceParallelClock Frequency166 MHzAccess Time5 nsVoltage - Supply3V ~ 3.6VOperating Temperature0°C ~ 70°C (TA)Mounting TypeSurface MountPackage / Case54-TSOP (0.400", 10.16mm Width)Supplier Device Package54-TSOP IIBase Product NumberW9825G6 W9825G6KH-6 ManufacturerWinbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. W9825G6KH-6 FAQWhat is SDRAM explain?SDRAM (synchronous DRAM) is a generic name for various kinds of dynamic random access memory (DRAM) that are synchronized with the clock speed that the microprocessor is optimized for. This tends to increase the number of instructions that the processor can perform in a given time. Is SDRAM slow?SDRAM usually refers to first generation synchronous DRAM, which is slower than subsequent generations (DDR) because only one word of data is transmitted per clock cycle (single data rate). Does SDRAM need to be refreshed?A marked reduction in stored charge can result in either data loss or data corruption. In order to prevent this from happening SDRAM must be periodically refreshed by topping off the charge contained in each individual memory cell.

CatalogLM2776DBVR Product OverviewLM2776DBVR CAD ModelsLM2776DBVR Pin ConfigurationLM2776DBVR Block DiagramLM2776DBVR Typical ApplicationLM2776DBVR FeaturesLM2776DBVR ApplicationsLM2776DBVR Package DimensionsLM2776DBVR DatasheetLM2776DBVR SpecificationsLM2776DBVR ManufacturerUsing WarningLM2776DBVR FAQ LM2776DBVR Product OverviewA positive voltage between 2.7 V and 5.5 V is inverted to the appropriate negative voltage using the LM2776DBVR CMOS charge-pump voltage converter. In place of inductor-based converters, which are more expensive, larger, and more susceptible to electromagnetic interference (EMI), the LM2776DBVR uses three inexpensive capacitors to deliver 200 mA of output current. The LM2776DBVR offers the best performance for battery-powered systems needing a high power negative power supply, requiring just 100 A of running current and operating efficiency better than 90% for typical loads. To retain a compact form factor, the LM2776DBVR has been mounted in TI's 6-pin SOT-23. LM2776DBVR CAD Models  Figure: PCB Symbol  Figure: Footprint  Figure: 3D Models LM2776DBVR Pin Configuration  Figure: Pin ConfigurationPin NumberPin NameDescription1VOUTNegative voltage output.2GNDPower supply ground input.3VINPower supply positive voltage input.4ENEnable control pin, tie this pin high (EN = 1) for normal operation, and to GND (EN = 0) for shutdown.5C1+Connect this pin to the positive terminal of the charge-pump capacitor.6C1-Connect this pin to the negative terminal of the charge-pump capacitor.LM2776DBVR Block Diagram  Figure: Block Diagram LM2776DBVR Typical Application  Figure: Typical Application LM2776DBVR Features2-MHz Switching FrequencyGreater than 90% EfficiencyCurrent Limit and Thermal ProtectionNo InductorsInput Voltage: 2.7 V to 5.5 V200-mA Output CurrentInverts Input Supply VoltageLow-Current PFM Mode Operation LM2776DBVR ApplicationsData Converter SuppliesAudio Amplifier Power SuppliesPortable Electronic DevicesOperational Amplifier Power SuppliesInterface Power Supplies LM2776DBVR Package Dimensions  Figure: Package Dimensions LM2776DBVR DatasheetYou can download the datasheet from the link given below: LM2776DBVR Datasheet LM2776DBVR SpecificationsTypeDescriptionCategoryIntegrated Circuits (ICs)Power Management (PMIC)Voltage Regulators - DC DC Switching RegulatorsMfrTexas InstrumentsSeries-PackageTape & Reel (TR)Cut Tape (CT)Digi-Reel®Product StatusActiveFunctionRatiometricOutput ConfigurationNegativeTopologyCharge PumpOutput TypeFixedNumber of Outputs1Voltage - Input (Min)2.7VVoltage - Input (Max)5.5VVoltage - Output (Min/Fixed)-VinVoltage - Output (Max)-Current - Output200mAFrequency - Switching2MHzSynchronous RectifierNoOperating Temperature-40°C ~ 85°C (TA)Mounting TypeSurface MountPackage / CaseSOT-23-6Supplier Device PackageSOT-23-6Base Product NumberLM2776 LM2776DBVR ManufacturerTexas Instruments Incorporated (TI) is an American technological business with its main office in Dallas, Texas. It creates and produces integrated circuits and semiconductors, which it then sells to producers and designers of electronics around the world. According to sales volume, it is one of the top 10 semiconductor businesses in the world. The company concentrates on creating embedded CPUs and analog circuits, which provide more than 80% of its sales. Calculators, microcontrollers, and multi-core processors are among the educational technology items that TI also makes using its digital light processing technology. As of 2016, the business had 45,000 patents worldwide. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit. LM2776DBVR FAQWhat is switched-capacitor inverter?It is suggested to use a unique switched-capacitor inverter. By switching the capacitors between series and parallel connections, the suggested inverter generates an output voltage greater than the input voltage. The quantity of capacitors affects the maximum output voltage. How does a switched-capacitor converter work?A switched capacitor converter uses capacitors to convert voltage and transfer energy. During the first half of the switching cycle of a voltage inverter, the charge pump capacitor, C1, is charged to the input voltage. What are the advantages of switched-capacitor multilevel inverter?MLIs have a number of benefits over traditional two-level inverters, including better output voltage waveform generation, less electromagnetic interference, increased power handling capacity, increased efficiency, and reduced voltage stress on switches.

CatalogThe Global Chip Shortage, ExplainedWhat Is The Manufacturing Process Of An IC Chip?How Do You Solder SMD ICs?The Example Of MPXM2053GS In Technology Area.MPXM2053GS DescriptionMPXM2053GS Features and BenefitsMPXM2053GS ApplicationsMPXM2053GS FAQs The Global Chip Shortage, Explained Discover the shocking truth behind the big ic chip shortage crisis - now is the time to watch this eye-opening video!" What Is The Manufacturing Process Of An IC Chip? Microchips, also known as integrated circuits, are created through a complex process known as semiconductor fabrication, also known as "wafer fabrication." The following are the general steps involved in the manufacture of microchips:1. The first step is to create a design for the microchip using computer-aided design (CAD) software.2. Wafer preparation entails cleaning and polishing a silicon wafer to a mirror finish. A layer of photoresist is then applied to the wafer.3. Photolithography is a process that is used to transfer the design onto the wafer. A mask is used to expose the wafer to ultraviolet light, which creates a pattern on the photoresist layer.4. Etching: The wafer is then chemically etched to remove the photoresist layer portions that were not exposed to light. This results in a patterned layer of photoresist on the wafer's surface.5. Doping is the process of introducing impurities into a wafer in order to create regions with different electrical properties. This is accomplished by heating the wafer in a high-temperature furnace with a gas containing the desired impurities.6. Deposition: Using techniques such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), thin layers of metal, oxide, or other materials are deposited on the wafer.7. Planarization: Planarization is a process that removes excess material from a wafer to create a flat surface. This is accomplished through the use of chemical mechanical polishing (CMP).8. Metallization: To provide electrical connections to the circuit, metal contacts are deposited on the wafer.9. Finally, the wafer is tested to ensure that the circuits are working properly.10. After testing, the wafer is cut into individual chips, which are then packaged for use in electronic devices. How Do You Solder SMD  ICs? Soldering SMD (Surface Mount Device) ICs can be a bit tricky, but with the right tools and knowledge, it can be done correctly.  Here are the steps to solder the MPXM2053GS SMD IC: First, people should look at Figure 1, which shows the MPXM2053GS block diagram of the internal circuitry on the stand-alone pressure sensor chip. Figure1: MPXM2053GS Block Diagram1. It is important to gather the necessary tools and materials before starting. These include a soldering iron, soldering wire, flux, tweezers, and the IC itself.2. Clean the soldering iron tip and place a small amount of soldering wire onto the tip to increase heat transfer.3. Apply flux to the soldering pads on the PCB (Printed Circuit Board) where the IC will be mounted.4. Use the tweezers to pick up the IC and carefully place it onto the soldering pads. Ensure that the orientation is correct and the pins align with the pads.5. Hold the IC in place with the tweezers and apply heat to one corner pad. Hold the soldering wire against the pad until the solder melts and flows to cover the pad and pin.6. Move to the opposite corner and repeat the process.7. Once the two corners are secured, check the positioning of the IC and make any necessary adjustments before soldering the remaining pins.8. Apply heat to each pin and pad pair, then apply a small amount of solder wire to each one to complete the solder joint.9. After all pins are soldered, inspect the solder joints for any defects such as bridges or cold solder joints.10. Once complete, clean the PCB with isopropyl alcohol to remove any flux residue. Pre-requisites for soldering SMD ICs include having a clean workspace and PCB, using the correct temperature soldering iron, and having steady hands and good lighting. Practicing on a test PCB before soldering onto the product is also recommended. The Example Of MPXM2053GS In Technology Area Here are images of the MPXM2053GS ICs: The following are symbols of the MPXM2053GS ICs. Figure2: MPXM2053GS Symbol The following are the PCB footprint of the MPXM2053GS ICs. Figure3: MPXM2053GS PCB Footprint To understand more, here is the pin information of MPXM2053GS ICs. Figure 3: MPXM2053GS Case  Table 1: Pin definitions – MPXM2053GS/GST1Symbol Pin DescriptionGND1Ground+VOUT2+ Voltage outputVS3Power supply–VOUT4– Voltage output  Here is the specification of the MPXM2053GS ICs:Product AttributeAttribute ValueManufacturer:NXPProduct Category:Board Mount Pressure SensorsPressure Type:GaugeOperating Pressure:7 psiAccuracy:0.50%Output Type:AnalogMounting Style:SMD/SMTInterface Type:-Operating Supply Voltage:10 VPort Type:Single Axial BarblessResolution:-Package / Case:M-PAK-5Minimum Operating Temperature:- 40 ℃Maximum Operating Temperature:+ 125 ℃Series:MPXx2053Packaging:TubeBrand:NXP SemiconductorsOperating Supply Current:6 mAPort Size:0.117 inProduct Type:Pressure SensorsSubcategory:SensorsSupply Voltage - Max:16 VPart # Aliases:9.3531E+11Unit Weight:0.018618 oz Here is the datasheet of the MPXM2053GS ICs: You can download the MPXM2053GS ICs datasheet from the link given below: MPXM2053GS MPXM2053GS DescriptionThe MPXM2053GS and related model series devices are silicon piezoresistive pressure sensors that provide a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with a strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offsets calibration and temperature compensation.MPXM2053GS Features and Benefits• Ratiometric to Supply Voltage• Differential and Gauge Options• Temperature Compensated over 0 °C to 85 °C• Easy-to-Use Chip Carrier Package OptionsMPXM2053GS Applications• Level Indicators• Medical Diagnostics• Robotics• Pressure Switching• Pump/Motor Controllers• Non-Invasive Blood Pressure Measurement MPXM2053GS FAQs1. Why silicon chip is an integrated circuit?An integrated circuit (more commonly known as an IC, microchip, silicon chip, computer chip, or chip), for example, MPXM2053GS, is a single piece of specially prepared silicon (or another semiconductor) into which an electronic circuit is etched using photolithography. Because it combines several electronic components, such as transistors, resistors, capacitors, and diodes, onto a single piece of silicon. Photolithography is used to etch an electronic circuit. These components are linked together by thin metal wires to form an electronic circuit. 2. Who leads in chip manufacturing?Taiwan Semiconductor Manufacturing Company (TSMC) is the largest and most valuable semiconductor manufacturer in the world.3. When was IC used in computers?In 1962, Fred Heiman and Steven Hofstein at RCA built the first experimental MOS IC, a 16-transistor chip. In 1964, General Microelectronics released the first commercial MOS integrated circuit, a 120-transistor shift register designed by Robe

CatalogTPS82084SILT Product OverviewTPS82084SILT CAD ModelsTPS82084SILT Pin ConfigurationTPS82084SILT Block DiagramTPS82084SILT FeaturesTPS82084SILT ApplicationsTPS82084SILT Package OutlineTPS82084SILT DatasheetTPS82084SILT SpecificationsTPS82084SILT ManufacturerUsing Warning TPS82084SILT Product OverviewThe TPS82084SILT is a High Efficiency Step-Down Converter MicroSiP™ Modules with Integrated Inductor. The MicroSiP™ TPS82084/5 modules are 2-A/3-A step-down converters that have been enhanced for high efficiency and minimal solution size. In order to streamline design, cut down on external components, and conserve PCB space, the power module includes an inductor and synchronous step-down converter. The low profile and small solution is appropriate for automated assembly using equipment with surface mount connectors. The converter runs in PWM mode with a nominal switching frequency of 2.4MHz to maximize efficiency and switches into Power Saving Mode automatically at low load currents. The device works in Power Saving Mode with a typical 17-µA quiescent current. The device achieves precise output voltage control and outstanding load transient performance using the DCS-Control topology. A versatile system design is provided via the EN and PG pins, which permit sequencing configurations. The inrush current required from the input supply is decreased by an incorporated soft starting. A strong and dependable solution is provided by over temperature protection and Hiccup short circuit protection. TPS82084SILT CAD Models Figure: PCB Symbol  Figure: Footprint  Figure: 3D Models TPS82084SILT Pin Configuration Figure: Pin ConfigurationPin NumberPin NameDescription1ENEnable pin. Pull High to enable the device. Pull Low to disable the device. This pin has aninternal pull-down resistor of typically 400 kΩ when the device is disabled.2PGPower good open drain output pin. A pull-up resistor can be connected to any voltage lessthan 6V. Leave it open if it is not used.3,4VINInput voltage pin.5,6GNDGround pin.7FBFeedback reference pin. An external resistor divider connected to this pin programs theoutput voltage.8VOUTOutput voltage pin. ExposedThermal PadThe exposed thermal pad must be connected to the GND pin. Must be soldered to achieveappropriate power dissipation and mechanical reliability.TPS82084SILT Block Diagram Figure: Block Diagram TPS82084SILT FeaturesPower save mode for light load efficiency100% duty cycle for lowest dropoutOutput discharge functionPower good outputIntegrated soft startup, and support pre-biasedstartupOver temperature protectionCISPR11 class B compliant2.8-mm x 3.0-mm x 1.3-mm 8-Pin µSiL packageLow Profile MicroSiP™ Power ModuleDCS-control topologyUp to 95% efficiency17-µA operating quiescent current-40°C to 125°C operating temperature rangeHiccup short circuit protection2.5-V to 6-V input voltage range0.8-V to VIN adjustable output voltage TPS82084SILT ApplicationsMetro data centerAudio/video control systemRadarOptical moduleSingle board computerSolid state drive TPS82084SILT Package Outline Figure: Package Outline TPS82084SILT DatasheetYou can download the datasheet from the link given below: TPS82084SILT Datasheet TPS82084SILT SpecificationsTypeDescriptionCategoryPower Supplies - Board MountDC DC ConvertersMfrTexas InstrumentsSeriesMicroSip™PackageTape & Reel (TR)Cut Tape (CT)Digi-Reel®Product StatusActiveTypeNon-Isolated PoL ModuleNumber of Outputs1Voltage - Input (Min)2.5VVoltage - Input (Max)6VVoltage - Output 10.8 ~ 6VVoltage - Output 2-Voltage - Output 3-Voltage - Output 4-Current - Output (Max)2AApplicationsITE (Commercial)FeaturesAdjustable OutputOperating Temperature-40°ｰC ~ 125°ｰCEfficiency-Mounting TypeSurface MountPackage / Case8-LDFN Exposed PadSize / Dimension0.12" L x 0.11" W x 0.05" H (3.0mm x 2.8mm x 1.3mm)Supplier Device Package8-uSIP (3x2.8)Control Features-Approval Agency-Base Product NumberTPS82084 TPS82084SILT ManufacturerTexas Instruments Incorporated (TI) is an American technological business with its main office in Dallas, Texas. It creates and produces integrated circuits and semiconductors, which it then sells to producers and designers of electronics around the world. According to sales volume, it is one of the top 10 semiconductor businesses in the world. The company concentrates on creating embedded CPUs and analog circuits, which provide more than 80% of its sales. Calculators, microcontrollers, and multi-core processors are among the educational technology items that TI also makes using its digital light processing technology. As of 2016, the business had 45,000 patents worldwide. Using WarningNote: Please check their parameters and pin configuration before replacing them in your circuit.