The Kynix Blog

A lot has happened since the 1970s, when microcontroller (MCU) technology first emerged. Recently, numerous trends in the MCU industry have impacted how these devices are designed and work (function). Today, MCUs (essentially computers encased in an integrated circuit (IC), that can be configured (programmed) to carry out specific tasks) are the brains behind a plethora of modern electronic gadgets, ranging from automobile infotainment systems and home appliances to sophisticated medical equipment and SCADA systems used to control industrial processes. The basic microcontroller, which is just over half a century old, represents nearly all of the entire electronic-component market. Microcontrollers remain king of the semiconductor landscape for a valid reason: they are highly adaptable, versatile, and easy to implement (code). With MCUs being used in virtually all electronic devices/equipment from mobile phones and laser printers to dishwashers and air conditioners, the microcontroller shipment data offers a rational display of the state of the electronics market. Based on different applications and needs, there are various types of microcontrollers available.  Over time, MCU manufacturers have designed/developed tailored (application-specific) versions to address the needs of use cases, including motor control, cordless communication, and efficient power consumption. Arduino and STM32 are examples of microcontrollers widely used in many electronic projects. Some MCU technologies come with highly programmable A/D chucks, which draw architectural concepts from FPGAs rather than MCUs. Also, other MCU technologies are designed as general-purpose control devices, which include a variety of fixed-function modules ranging from Analog-to-Digital and Digital-to-Analog converters to serial communication devices, timers/counters, general-purpose input/output (GPIO), and cryptographic accelerators to enable a wide range of applications. MCU Market exhibits Persistent Growth According to Global Research Insights, the World microcontroller (MCU) market size was valued at USD 19.04 billion in 2022 and is expected to hit USD 26.54 billion by 2030, growing at a CAGR of 4.8 percent between 2023 and 2030. The impact of the COVID-19 pandemic and the ongoing Russia-Ukraine War were taken into account when evaluating market sizes. Key players in the global MCU market are Netherland-based semiconductor designer and manufacturer NXP Semiconductors; American corporation Microchip Technology; Japanese Renesas Electronics, Swiss STMicroelectronics, German Infineon Technologies, and others. The top five global producers control more than 55% of global market share. Asia-Pacific boasts the largest market share of more than 50%, while Europe and North America combined have around 40 of the market share. Regarding products, 32-bit Microcontrollers have the biggest segment of more than 50%. When it comes to application, the automotive industry tops the list of the sectors/fields where MCUs are highly used, while industrial, communication, and computer follow in that order. Future Trends of MCUs While the MCU market is expected to expand in the coming years, do the technical specifications and features of microcontroller technologies need to evolve to match customer demands? Are general-purpose MCUs being phased out in favor of application-specific versions? "Customers define the product requirements," states Joe Thomsen, VP of Microchip Technology's 16-bit MCU Business Unit. "One of the things we do regularly is to evaluate what our customers are putting on their boards and what else is being implemented alongside the microcontroller," he said. "Then we can determine how we can interface to those items more easily, more effectively, or [whether] we can actually integrate those features into the MCU itself," added Mr. Thomsen. Modern MCUs are often extremely practical, fully integrated chips meant to provide a one-chip solution for numerous designs. Modern and future MCUs are designed to meet evolving application use cases and contemporary customer needs. Here are features and specifications that characterize modern and future MCUs. 1. Small-sized MCUs designed for embedded technologies The increasing popularity of MCU applications in embedded technologies is a notable trend in the semiconductor industry. These microcontrollers have exceptionally low power consumption without sacrificing functionality. Manufacturers will employ a variety of techniques to reduce MCU power consumption, such as lower clock frequencies, per-device power control, clock gating, and dynamic scaling among other methods. Since these devices consume less power, this helps significantly reduce the size of the devices. A small battery can power a low-power gadget for a long period. Numerous MCU producers have been motivated by this trend to manufacture low-power-consuming, energy-efficient microcontrollers for embedded applications that are easy to configure. 2. Rugged and sturdy MCUs for industrial applications The growing popularity of microprocessors in the industrial field is a further development in the MCU market. Industrial MCUs are used for controlling a vast range of equipment and processes, such as autonomous robots, production systems, machine tools, conveyors, etc.  Industrial MCUs are usually designed to be exceedingly rugged and durable to resist extreme industrial conditions like high temperature and pressure. The widespread adoption of microcontrollers in "Industry 4.0," which describes the integration of cutting-edge technologies including, the Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML) into convoluted, automated production processes, is one instance of this trend. Manufacturing is expected to go through a revolution thanks to Industry 4.0, and microcontrollers will be critical for making such developments possible. 3. Power-efficient MCUs for edge devices/technologies, smart devices, and wearable Manufacturers, tech commentators, and users have all their attention focused on one major trend: the increasing development of f low-power MCUs being used for edge technologies, wearables, home automation, smart construction, and Internet of Things (IoT) applications. Because of their extremely low power consumption, these microcontrollers are ideal for portable electronics and other gadgets that must run continuously for long periods without a power source. Since they offer the computational (processing) power and connectivity required for data collection, analysis, and transmission, microcontrollers are a crucial part of the Internet of Things and smart home technologies. The increasing popularity of cordless connectivity options, such as Wi-Fi, Bluetooth, and Zigbee, is one development associated with MCUs for the Internet of Things and smart home applications. These contemporary technologies facilitate the integration of MCUs into products. 4. Vast application of Healthcare MCUs Another significant trend in the MCU market is the increasing application of microcontrollers in the healthcare industry. Today, microcontrollers are used in an increasing variety of medical applications, including diagnostic instruments, patient monitoring infrastructure, and other medical devices. The increasing need for improved healthcare technology is predicted to drive an enormous rise in the application of microcontrollers in the medical field in the upcoming years. Modern medical equipment can be used to gather patient data and make decisions that can enhance care, medication, and results because of increased processing capacity. A handful of these technologies are replacing physicians in tasks like examining patients' symptoms. This is a significant development in the medical industry as it lowers treatment costs while increasing the standards of medical care provided. 5. Advanced MCU security  The increasing focus on MCU security is another area of concern and a trend. The rapid growth of IoT technologies, home automation, and numerous other connected devices/technologies increases the risk of cyberattacks and security breaches. Since MCUs are potentially susceptible to hacking and various other security risks, microcontrollers could experience disastrous consequences. Manufacturers of microcontrollers have been trying to address this issue by creating increasingly secure microprocessors that are impervious to hacking, data breaches, and other types of cyberattacks. One trend in MCU security is using encrypted communication protocols, such as secure sockets layer (SSL) and transport layer security (TLS). These technological advancements guarantee the security and privacy of sensitive data and assist in preventing data breaches. Using hardware-based security features, like secure boot, Time-Based One-Time Passwords (TOTPs), and hardware-based authentication, to provide protection against unauthorized access to systems is another trend. 6. Automobile MCUs with Advanced processing power Also, as technology advances, there is a vast variety of MCU applications requiring more sophisticated processing. As a result, manufacturers have designed/developed microcontrollers with powerful CPUs and greater memory capacity. Specifically, the growing use of MCUs in automobiles has resulted in the development of customized automobile MCUs with advanced technical features and specifications. With features like voice-controlled entertainment systems, autonomous driving abilities, and advanced driver assistance systems (ADAS), contemporary automobiles are becoming increasingly "intelligent." These developments have created massive business opportunities for innovators. The processing power needed for all of these functions is substantial, and it is provided by microcontrollers with cutting-edge processing capabilities that are approved and built for rigorous automotive applications. Automobile manufacturers are optimizing fuel consumption in response to rising fuel prices and global warming by using Electronic Control Units (ECUs). ECUs are essentially microcontrollers used to monitor vehicles' energy consumption and efficiency in real time. Modern automobiles are equipped with ECUs which serve as the primary controlling unit that also monitors a variety of other vehicular activities, including infotainment, remote functionality, self-driving functions, parking assistance, and electronic driving assistance (such as park-assist functions and lane-keep assist). Therefore, in order to run interoperable software and platforms and accomplish the necessary essentials, ECUs require extremely dependable and durable hardware. Final thoughts   With the MCU technology receiving so much transformation and widespread acceptance by users and tech commentators, one would wonder when this industry will come to an end and be replaced by another technology. The justifications in favor of or against this change go beyond technical details. For design purposes, engineers and developers invest a lot of time and finances when choosing an MCU family so they will want the architecture to stay for a long period. More importantly, MCUs are generally less expensive and consume less power compared to other technologies.

A software called DesignDRIVE Fast Current Loop that makes C2000 microcontrollers (MCUs) the first devices to push current-loop performance to less than 1 microsecond, has been introduced by Texas Instruments. Together, TI's C2000 MCU portfolio and DesignDRIVE software delivers System-on-Chip (SOC) functionality which simplifies drive control system development.       The DesignDRIVE Fast Current Loop software out performs traditional microcontroller (MCU)-based current-loop solutions and can simplify designs by eliminating the Field-Programmable Gate Array (FPGA) typically used for external current-loop control. Fast Current Loop software is a free update available for C2000 controlSUITE software.   TI's DesignDRIVE technology is a unified hardware and software platform that makes it easier for engineers to develop and evaluate solutions for a variety of industrial drive and servo topologies. As a key part of DesignDRIVE solutions, the Fast Current Loop software enables developers to achieve higher control performance while saving valuable board space and simplifying thermal considerations.     Features and benefits of TI's DesignDRIVE Fast Current Loop software   · Innovative subcycle Pulse-Width Modulation (PWM) update techniques significantly improve control-loop bandwidths to potentially triple the motor torque response. · A novel cycle-scavenging C2000 MCU needs only 460 nanoseconds for field-oriented control processing. · A new complex controller replaces traditional proportional integration control and facilitates greater stability at higher speeds. · Industrial drive systems designed with Fast Current Loop software on a C2000 MCU, like the TMS320F28379, delivers SOC functionality to reduce board space, complexity and overall cost.      Ref. KY32-TMS320F28379 KY362-C2000    

 If you disassemble several electronic devices, you will discover a printed circuit board (PCB), which is a small green board with maze-like markings.So what is a PCB? These small green boards aid in the operation of electronic devices. The device would not function without them. PCBs connect all of the other components inside, allowing you to use your electronic device for its intended purpose.Despite its small size, the PCB manufacturing process is quite extensive. Whether you make your own or use a PCB manufacturer, multiple steps are required for the board's development. Because each step is critical to the overall process, let's take a closer look at the 4-layer PCB production flow. The production flow of a 4-layer PCB Catalog I Parts of printed circuit boards1.1 Features of printed circuit boards1.2 The role of printed circuit boardII PCB manufacturing processFAQ I Parts of printed circuit boards To have a thorough understanding of Printed Circuit Boards (PCBs), it is important to know the various parts that are used to make the boards.The most obvious starting point is the board itself. It is plastic, reinforced with glass. The next most obvious parts are the lines and pads that connect together. These are made of copper, and are known as ‘traces’. They conduct electricity, allowing electrical charges to be carried through the board. They are similar to wires, but are much finer, and are used to carry the electricity to the end-point (one of the various types of components within the board).  Figure 1. Essential parts of a printed circuit board Simple PCBs are single-sided, with one copper layer. These are structured with one side having all the components, while the other side had the traces. Holes are placed through the board for the circuit to be carried from the trace to the component. For many years, all boards were made in a single-sided design. By definition, double sided PCBs have traces on both sides of the board.To allow the boards to be more complex and control additional functions, multi-layer boards are used. Additional layers of board have their own set of traces and components. In developing multi-layer boards, a range of issues needed to be addressed. Firstly, it is essential that the copper connections do not cross each other, as this would compromise the path of the electrical circuit. Other factors that need to be considered are resonance and noise and capacitance.The layer set in place above the copper is called the soldermask. This is a form of insulation, ensuring that the copper traces aren’t affected by any metal that may come into contact with it. It is traditionally colored green. It is designed to have gaps that expose the copper in specific places, providing points where components can be soldered to the board. The silkscreen is a layer that is printed onto the soldermask. It is a layer where text can be printed (letters and numbers) that provide instructions for the user.A range of components can be incorporated into a PCB. Without components, the PCB is simply a conductor of electricity, with no function. Components can be grouped into two broad categories – passive (components that do not require direction) and active (components that only function when they receive current from one direction). Common components include:1. Batteries: these provide the circuit with voltage.2. Capacitators: The store electricity for later use. They are available as polarized or non-polarized.3. Diodes: allows current to pass in one direction only, blocking the other.4. Inductor: These coils store charge in a magnetic field.5. Light emitting diodes (LEDs). These light up when current flows is applied. They only allow current to flow in one direction.6. Resistors: These control the electric current as it passes through. The level of resistance provided varies based on the needs of the engineer. 7. They are made in different color codes to show the level of resistance.8. Switches: These can be open or closed, allowingor blocking current.9. Transistors: These are a form of switch that performs changes function based on the voltage passing through.10. Vias: small holes in the board that allow a signal to be passed from one side to the other 1.1 Features of printed circuit boards1. After the electronic component is encapsulated, the electrical conduction can be realized.2. It is required that there should be no current flow in the insulating part.　3. It is required that there must be current flow in the conduction part.　4. As the mechanical support for the fixation and assembly of components, it must meet the requirements of mounting components.5. There must be complete and clear recognition characters and component symbols.6. It can be fixed to the appropriate part of the machine. 1.2 The role of printed circuit boardAfter the printed circuit board is adopted in the electronic equipment, the error of manual wiring is avoided because of the consistency of the same kind of printed circuit board. And the automatic insertion or mounting, automatic soldering and automatic detection of electronic components can be realized. In a word, it ensures the quality of electronic equipment, improves the labor productivity, reduces the cost, and is convenient for maintenance.Figure 2. Printed circuit board II PCB manufacturing process Now, let's take four layers as an example to see how printed circuit boards are made.  Figure 3. Chemical clean Step 1: In order to obtain an etching pattern with good quality, it is necessary to make sure that the corrosion resistance layer is firmly combined with the substrate surface, and the substrate surface is required to be free of oxidation layer, oil pollution, dust, fingerprint and other dirt. Therefore, before coating the corrosion resistant layer, it is necessary to clean the surface of the board and make the surface of the copper foil reach a certain degree of coarsening. Core material: when you start making four layers, the inner layer (the second and the third layer) must be done first. The core material is a copper sheet composed of glass fiber and epoxy resin on the upper and lower surfaces.   Figure 4. Cut sheet →dry film lamination Step 2: In order to make the shape we need on the core material, we first paste a dry film (photoresist) on the core material. The dry film is composed of polyester film, photoinduced corrosion resistant film and polyethylene protective film. When sticking the film, the polyethylene protective film is stripped from the dry film, and then the dry film is pasted on the copper surface under the condition of heating and pressurization.  Figure 5.  Image expose→image develop Step 3: Under the irradiation of ultraviolet light, the photoinitiator absorbs the luminous energy to decompose into free groups, which in turn initiate the polymerization and crosslinking of photopolymerizable monomer. After the reaction, a high molecular structure insoluble in dilute alkali solution is formed. The polymerization reaction will continue for a period of time. In order to ensure the stability of the process, the polyester film should not be torn off immediately after exposure. It should stay for more than 15 minutes, so that the polymerization reaction can continue and the polyester film should be torn off before development. Image Develop: the active group in the unexposed part of the photosensitive film reacts with dilute alkali solution to produce a soluble substance and then it dissolves, leaving a graphic part that has been photosensitive crosslinked and solidified.  Figure 6.  Copper etch Step 4: In the production of flexible printed circuit board or printed circuit board, the copper foil is removed by chemical reaction to form the required loop pattern. The copper beneath the photoresist is preserved from etching.   Figure 7. Strip resist→post etch punch→AOI inspection→oxide Step 5: The purpose of removing the film is to remove the corrosion resistant layer retained on the surface of the etched board so that the copper foil below can be exposed. "Membrane slag" filtration and waste liquid recovery should be properly treated. If the water washing after the film removing can completely cleans the board, you can consider not doing pickling. Finally, the board should be completely dry after cleaning.   Figure 8. Lay-up with prepreg Step 6: Before entering the press machine, it is necessary to prepare the raw materials for each multilayer board for lay-up operation. In addition to the oxidized inner layer, the prepreg is also needed. The function of the lamination is to stack the boards covered with protective film in a certain order and place them between the two-layers of steel plate.  Figure 9.  Lay up with copper foil→vacuum lamination press  Step 7: Cover the current core material with a layer of copper foil on both sides, and then cool to room temperature after multi-layer pressurization, which requires temperature and pressure to be measured over a fixed period of time. And a multilayer sheet is finished.   Figure 10.  CNC drill Step 8: Under the accurate condition of inner layer, the CNC drilling machine drills according to the mode. Drilling accuracy is required to ensure that the hole is in the correct position.    Figure 11. Electroless copper Step 9: In order for the through hole to be conductive between the layers ,which means the resin and glass fiber bundles of the non-conductor part of the hole wall should be metalized), copper must be filled in the hole. The first step is to coat the hole with a thin layer of copper, which is a complete chemical reaction. The final copper plating is 1/1000000 of 50 inches thick.   Figure 12. Cut sheet→dry film lamination Step 10: Photoresist: this time we apply photoresist to the outer layer.   Figure 13. Image expose→image develop Step 11:This time we finish the outer exposure and development.   Figure 14. Copper pattern electro plating Step 12:This also becomes the secondary copper plating, the main purpose is to thicken the line copper and the through-hole copper.  Step 13:Its main purpose is to prevent etching and to protect the copper conductors covered by it from attacking during alkaline copper etching. The copper conductors include all the copper lines and the through holes interior.   Figure 15. Strip resist Step 14:We already know the purpose. All we have to do is to make the copper on the surface exposed by using chemical methods.   Figure 16.  Copper etch Step 15:We also know the purpose of etching. And the tinned part protects the copper foil below.   Figure 17. Tack dry→image expose→image develop→thermal cure solder mask Step 16:The welding resistance layer is used to expose the welding pad, that is, the green oil layer, which is actually digging holes in the green oil layer and exposing the welding pad and other places that do not need to be covered with green oil. Suitable surface features can be obtained by proper cleaning.  Figure 18. Surface finish Step 17:The process of hot air leveling solder coating (commonly known as tin spray) is to soak the printed circuit board with flux, then dip it in the molten solder. Next, pass it between the two wind knives and blow off the excess solder on the printed board with the hot compressed air in the wind knives. At the same time, the excess solder in the metal hole is eliminated, so as to obtain a bright, smooth and uniform solder coating.Gold finger (Gold Finger, or Edge Connector) is designed to use the connector insertion as an outlet for external contact with the board, so the gold finger process is required. Gold was chosen because of its superior conductivity and oxidation resistance. But because of the high cost of gold, it can only be used for gold fingers, local plating or electroless gold. FAQ 1. What is a PCB in a printer?While design of a printed circuit board (PCB) can be done internally, manufacturing is generally outsourced. This dependence often results in uncontrollable, and unexpected delays. ... It is here that desktop PCB printers are aiming to come to the rescue. 2. How much does it cost to print a PCB?In general, the cost to produce a PCB will cost between $10 and $50 per board. 3. How does a PCB printer work?A special printer called a plotted printer is used to print the design of the PCB. It produces a film that shows the details and layers of the board. When printed, there will be two ink colors used on the inside layer of the board: Clear Ink to show the non-conductive areas. 4.Why are PCB green?It is due to the solder mask, which protects the copper circuits printed on the fibre glass core to prevent short circuits, soldering errors, etc. ... The colour of the solder mask gives the board its appearance. 5. How much does custom PCB cost?At BatchPCB, a two-layer board costs $2.50 per square inch (about $0.40 per square centimeter), while a four-layer board costs $8 for the same area (about $1.24/cm2). The first step in creating a custom PCB is laying out the schematic view. 6. How do I print directly from PCB?A laser printer is used to print an image of the PCB on special “transfer paper” which is then placed on the bare copperclad board and either ironed or run through a modified laminator to transfer the image to the copper. 7. What does PCB stand for?printed circuit board. A printed circuit board, or PC board, or PCB, is a non-conductive material with conductive lines printed or etched. Electronic components are mounted on the board and the traces connect the components together to form a working circuit or assembly. 8. What is PCB made of?copper circuitry. Printed circuit boards (PCBs) are usually a flat laminated composite made from non-conductive substrate materials with layers of copper circuitry buried internally or on the external surfaces. They can be as simple as one or two layers of copper, or in high density applications they can have fifty layers or more. 9. Which type of PCB is more economical type?Aluminum-Backed PCBs. Aluminum is inexpensive, making almost 8.23% of planet's weight, and leads to most economical manufacturing process. PCBs made up of aluminum are easily recyclable and non-toxic in nature, making them as ideal source for energy conservation. 10. How do you choose a PCB material?Electrical functionality is based on PCB function, which makes it a good criterion for design-based circuit board material selection. According to function, PCBs may be classified as the following board types: High Frequency (High Speed) – These boards can accommodate frequencies in the 500MHz – 2GHz range.

Introduction Digital instruments called phasor measurement units (PMUs) detect the magnitude and phase angle of alternating voltage and current on an AC power supply. PMU analyzes the variables using sample rates. It offers an in-system measurement of electrical quantities in real-time. The internet may be used to tag and share information about magnitude and phase angle, making it possible to study the dynamics of power systems over a wide area. One of the most crucial measuring tools for power systems of the future is thought to be the PMU. Algorithms are used in this project to review the PMU specifications. These algorithms aid in computing the sinusoidal signal's magnitude and phase angle.   Materials Required: Arduino UnoCurrent Sensor ACS712DC Regulated Power SupplyLCD DisplayRelay Driver CircuitAC Bulb  220 V 100WLM393 IC   Software Required: Arduino IDELABVIEW   LABVIEW   LabVIEW (Laboratory Virtual Instrument Engineering Workbench), created by National Instruments (www.ni.com)is a graphical programming language that uses icons instead of lines of text to create applications.LabVIEW programs/codes are called Virtual Instruments, or V is for short.LabVIEW is used for Data acquisition, signal Processing (Analysis), and hardware control–a typical instrument configuration based on LabVIEW   Schematic diagram of an instrument system based on LabVIEW   Hardware:   Schematic Diagram   Working   The Entire Project was developed on Arduino Mega 2560.Arduino Mega was used a Controller to perform all the complex calculations. The Results of Arduino was shown on Serial Monitor of Arduino .Then the coding of LabVIEW was done and the entire calculation was done on LabVIEW.   In the Electrical Schematic Diagram, The Input 220V is given to Voltage Transformer and to Current Sensor in Series with Load. The Load could be Inductive of Resistive. The Output of Transformer is given to Analog Pin to Arduino i.e. A0 and Output of Current Sensor is given to A1 pin of Arduino. The LM393 Comparator is being operated by Dual DC Power Supply -9V and +9V.The Output of Comparator is given to Digital Pin of Arduino i.e.8. The Relay is used to with Digital Pin of Arduino. There was some problem while using Relay so we are not showing the Pin no. with Relay but the procedure remains same. The Output of Relay is given to Load.The Output is shown on Computer Monitor Window i.e. Serial Monitor Window and LabVIEW.   Current Sensor (ACS712)   The Allergo ACS712 current sensor is based on the 1879 discovery of Dr. Edwin Hall's Hall-effect. This concept states that when a conductor carrying a current is put in a magnetic field, a voltage is produced across its edges that is perpendicular to both the direction of the current and the direction of the magnetic field. A magnetic field (B) perpendicular to the direction of current flow is applied to a thin strip of semiconductor material (referred to as a Hall element) while it is carrying a current (I). The Hall element's current distribution is no longer uniform due to the Lorentz force, and as a result, a potential difference is formed across its edges that is perpendicular to the directions of the current and the field. Its typical value is in the range of a few microvolts, and it is known as the Hall voltage. The magnitudes of I and B have a direct relationship to the Hall voltage. Hence, the observed Hall voltage can be used to estimate the other if one of them (I and B) is known.   ACS-712 current Sensor Module AC Current Measurement Using ACS712   Two directions of current are measured by the ACS712. Because the ACS712 has a 5 s output rise time in response to step input current, if we sample quickly and extensively enough, we will undoubtedly locate the peak in one direction and the peak in the opposite direction. We obtain about 4000 samples each cycle while monitoring AC current at 50 Hz, or 20 mSec every cycle.   To determine the current, all that is needed is knowledge of the waveform's shape given the location of both peaks. We are aware that the waveform for line or mains power is a SINE wave. Understanding it enables us to use a straightforward electronic formula to produce a respectable result.   RMS Current =  root(2) * Peek Current Circuit Connection for AC Current Measurement FREQUENCY   I used Voltage Comparator LM393N. The Inverting pin is Grounded and the signal is passed through a High Pass filter (removing DC component) and applied to the Non-inverting terminal. The comparator will act as a Zero Cross detector and when the amplitude is greater than 0, it will give a High output.  A zero-crossing detector can be used for the measurement of phase angle between two voltages Zero Crossing detector   PHASE   When capacitors or inductors are involved in AC circuit, the current and voltage do not peak at the same time. This leads to positive phase for inductive circuit since. When two signals differ in phase by -90 or +90 degrees, they are said to be in phase quadrature . When two waves differ in phase by 180 degrees (-180 is technically the same as +180), the waves are said to be in phase opposition . Illustration B shows two waves that are in phase quadrature. The wave depicted by the dashed line leads the wave represented by the solid line by 90 degrees. Phase Difference between Voltage and Current   Calculation Of Phase Angle   Phase is sometimes expressed in radians rather than in degrees. One radian of phase corresponds to approximately 57.3 degrees. Engineers and technicians generally use degrees; physicists more often use radians. The time interval for one degree of phase is inversely proportional to the frequency. If the frequency of a signal (in hertz ) is given by f , then the time t deg (in seconds) corresponding to one degree of phase is: t deg = 1 / (360 f ) The time t rad (in seconds) corresponding to one radian of phase is approximately: t rad = 1 / (6.28 f )   POWER FACTOR   Power factor is a crucial factor to take into account when designing an AC circuit because any power factor below one means that more current must flow through the wiring of the circuit than would be required if there was no reactance in the system in order to supply the same amount of (true) power to the resistive load. To counteract the impacts of the load's inductive reactance, a poor power factor can be ironically addressed by adding a second load to the circuit that draws an equal and opposite quantity of reactive power. The additional load in our example circuit must be a capacitor since inductive reactance can only be cancelled by capacitive reactance. The effect of these two opposing reactance in parallel is to bring the circuit’s total impedance equal to its total resistance (to make the impedance phase angle equal, or at least closer, to zero).   COMPLETE HARDWARE   This is the Complete Hardware of our Project. We used Voltage Transformer for DC Power supply circuit and another Voltage Transformer for making 5V circuit for measurement of AC Power supply in Arduino. Another Circuit for Frequency Measurement is used to measure Frequency of AC Supply. Circuit control is performed using an Arduino Mega. Here we have shown Resistive load for testing but practically we used Inductive load so that Phase can be actually be measured .Current Sensor is used for AC Current measurement.     Software   IDE (Integrated Development Environment)   The Java programming language is used to create the Arduino IDE (Integrated Development Environment). It is primarily utilized for Arduino programming. As the Arduino IDE is open-source software, no specific licensing is necessary. The software opening interface can be shown in figure 5.1 below. The executable code is transformed by the Arduino IDE using the AVR into a text file with hexadecimal encoding, which is then loaded into the Arduino board by a loader program in the firmware of the board. The capabilities supplied in this software are comprehensive and allow for an in-depth usage of this piece of hardware, and I have utilized it extensively in this project to program the Arduino. The Digital I/Os also allow for the reading of live status.   Coding /* Measuring AC Current Using ACS712 www.circuits4you.com */ const int sensorIn = A0; int mVperAmp = 66; // use 100 for 20A Module and 66 for 30A Module   double Voltage = 0; double VRMS = 0; double AmpsRMS = 0;   int mean_value = 0;    //////////////////////////////////////////////// void setup(){  Serial.begin(9600);      pinMode(8, INPUT);           pinMode(9, INPUT);   } long previous_time = 0;  long current_time = 0;  float Time=0; float frequency; float phase; float pf;   //coding for voltage measuring on A1 void loop() {   //measuring frequncy   while(digitalRead(8)==1); while(digitalRead(8)==0); previous_time = millis(); while(digitalRead(8)==1); while(digitalRead(8)==0); current_time = millis(); Time = (current_time) - (previous_time); //Serial.print(Time); //Serial.print("        "); Time=Time*0.001; frequency=1/Time;   //*2.52;/        // measuring voltage   int sensorValue = analogRead(A1);   // Convert the analog reading (which goes from 0 - 1023) to a voltage (0 - 250V):   float voltage = sensorValue * (260.0 / 1024.0);   // measuring current    Voltage = getVPP();  VRMS = (Voltage/2.0) *0.707;  //root 2 is 0.707  AmpsRMS = (VRMS * 1000)/mVperAmp;   //display phase while(digitalRead(8)==1); while(digitalRead(8)==0); previous_time = micros(); //while(digitalRead(9)==0);  //????????????????????? current_time = micros();  //??????????????????? while(analogRead(sensorIn)<=mean_value);    //////////////////////// current_time = micros();      //////////////////////////////// Time = ((current_time) - (previous_time))/10; //Serial.print(Time); //Serial.print("Sec    "); phase = (360*frequency*Time)/100000;   pf=cos(3.142/3); Serial.print("AC Voltage: "); Serial.print(voltage); Serial.print(" Volts"); Serial.print(AmpsRMS); Serial.print("Amps RMS"); Serial.print(frequency); Serial.print("Hz      "); Serial.print(phase); Serial.print("degree   "); Serial.print("phase:"); Serial.println(pf);     delay(1000); }   float getVPP() {   float result;   int readValue;             //value read from the sensor   int maxValue = 0;          // store max value here   int minValue = 1024;          // store min value here      uint32_t start_time = millis();    while((millis()-start_time) < 1000) //sample for 1 Sec    {        readValue = analogRead(sensorIn);        // see if you have a new maxValue        if (readValue > maxValue)        {            /*record the maximum sensor value*/            maxValue = readValue;        }        if (readValue < minValue)        {            /*record the minimum sensor value*/            minValue = readValue;        }    }        // Subtract min from max    result = ((maxValue - minValue) * 5.0)/1024.0;    mean_value = (maxValue + minValue)/2;    //////////////////////    return result;  }     Conclusion   Phasor Measurement Unit is very applicable for Supply Corporation Companies. We have make it for local monitoring. By installing this system in Power System we can monitor our Phase remotely.

Overview: The development of lithium-ion batteries as a whole is greatly influenced by their charging systems. The charging technologies, the configuration of the overall charging system, and the charging sequence of electric vehicles are discussed in this article. Evolution of Electric Vehicles The use of electric and hybrid electric vehicles (EVs/HEVs) has grown significantly in recent years, resulting in reduced dependence on fossil fuels and greenhouse gas emissions. This has prompted a wide range of scientific sectors to work on EV/HEV technologies in an effort to replace high-polluting combustion engines. Most research on batteries has been focused on two things: making new chemical compounds to make high-performance batteries and recycling old batteries to avoid big problems with disposal and bad effects on the environment. In engineering equipment, batteries are a frequent source of energy storage. There are many different types of rechargeable batteries with different chemical structures, such as lead acid, nickel cadmium, lithium-ion, etc. These batteries can be chosen based on the design requirements of a storage system, such as capacity, voltage, life, and weight. Rechargeable lithium-ion batteries are used in EVs and HEVs because they have the most power, the highest energy density, and the longest life cycles. This is especially important in light-duty vehicles, where weight is important.  Charging Technologies of Lithium-ion Batteries Lithium-ion batteries are charged optimally with the aid of a battery charger. EV battery chargers are classified as on-board and off-board types based on how fast and how long it takes to charge, as well as when the process starts and ends. On-board chargers are made up of an AC-DC converter for adjusting the voltage and correcting the power factor and a DC-DC converter for regulating the current going into the battery. Because of their size and cost, these chargers only have power levels 1 and 2. Off-board chargers are used to get a high power rate and shorten the time it takes to charge. Fast charging stations use these types of chargers. They have level 3 power and are usually found in public places. A fast charger station is a three-phase grid-connected AC-DC converter. Based on the transformer position for galvanic isolation, there are two common topologies, as shown in Fig. 1. One traditional solution is a big transformer with a line frequency, which makes the charger heavier and less powerful. To solve these problems, a power electronics-based solution is used that uses an isolated DC–DC converter made up of a high-frequency isolated transformer. Most have an active front end (AFE) rectifier that can correct the power factor and an isolated DC-DC converter. A full-bridge DC-DC converter is used to get high power density, efficiency, and reliability. Fig. 1. Fast charger station topologies. Source: IET Power Electronics Most EV control schemes used in fast charge stations are based on the topology of the converter and don't take the chemical structure of the battery into account. But some studies show that charging methods based on electrochemical technologies are more efficient than traditional methods. The constant current–constant voltage (CC–CV) method is one of the most common ways to charge. In CC mode, the battery is charged with a constant current until a certain voltage is reached, at which point the mode changes to CV and stays there until the charge is done. The current drops to a certain value at the end. This method is used most of the time because it is easy to use and cheap. But its performance depends upon the magnitude of the charge current, the time it takes to switch from CC to CV, and the rise in temperature. A high-efficiency charging method that works well can be achieved if these values are properly chosen. System Configuration The power stage and the control unit make up the charger system, as shown in Fig. 2. The power stage has a three-phase AFE rectifier, a full-bridge DC-DC converter, a low-pass filter, and a battery. The control unit has a detect phase unit, an FDA, a current controller, and a modulator unit. A full bridge DC-DC converter is reliable and can control many things at once. This converter is used to charge batteries. It has an H-bridge inverter, a high-frequency transformer, and full-bridge diodes.  Fig. 2. Overall charge system configuration. Source: IET Power Electronics The switching method of a DC-DC converter is based on phase-shifting pulse width modulation. The amplitude of the output voltage is changed by changing the angle between the complementary pulses of the switches. The control unit is made up of four smaller parts: phase difference detection, frequency detection algorithm (FDA), controller, and modulator. By injecting a sinusoidal ripple current with a specific frequency, the phase difference between the current and voltage can be found. Then, the perturb and observe (P and O) algorithm is used to find the FDA unit's optimal frequency, which has the least phase difference. The next step is for the current control unit to make a control signal, which is the duty cycle of the DC-DC converter. In the last step, the modulator uses the control signal to make the right switching pulse. Sinusoidal Ripple Charging Scheme (SRC) A separator and two electrodes make up a Li-ion rechargeable battery, as indicated by the electrochemical model in Fig. 3. Li+ ions are transferred from the cathode to the anode during the charging process. Conventional battery charging schemes, like CV and CC-CV, have problems, such as taking a long time to charge. In the SRC method, an AC current with a DC offset current is used to charge the battery.  Fig. 3. Lithium-ion battery charging process. Source: IET Power Electronics Accordingly, it can cut down on the time it takes to charge a battery by figuring out the optimal ripple current frequency and making sure that the battery's ac impedance is as low as possible. The battery's dynamic model's impedance spectrum backs up this assumption. Compared to the SRC charging method, the square pulse charging method, which is a type of AC ripple current charging, is less efficient, causes the temperature to rise faster, and takes longer to charge.  Summarizing with Key Points: Some of the takeaways from the article are as follows: Rechargeable lithium-ion batteries are used in electric and hybrid electric vehicles because of their high power, high energy density, and prolonged life cycles.Electric vehicle battery chargers are categorized as on-board and off-board, depending on how quickly and how long it takes to charge a battery, as well as when the process begins and ends.On-board chargers only have up to 1 and 2 power levels and are composed of an AC-DC converter and a DC-DC converter. An off-board charger that has a three phase grid-connected AC-DC converter is the fast charging station. They are typically installed in public areas and have level 3 power.An isolated DC–DC converter constructed of an isolated high-frequency transformer solves these concerns with traditional chargers. Full-bridge DC-DC converters provide excellent power density, efficiency, and reliability.The CC–CV charging method is popular because it's cheap and straightforward to use. However, its performance depends on the charge current, time to switch from CC to CV, and temperature rise. The power stage and the control unit make up the charger system. The power stage has a three-phase AFE rectifier, a full-bridge DC-DC converter, a low-pass filter, and a battery. The control unit has a detect phase unit, an FDA, a current controller, and a modulator unit.The control unit has four smaller parts: phase difference detection, frequency detection algorithm, controller, and modulator. The phase difference between the current and voltage can be found by injecting a sinusoidal ripple current with a certain frequency. This blog post is part of a full research article from IET Power Electronics. The featured image is used courtesy of OPEN AI.

 (2017 Korea Electronic Show) From October 17th to 20th, the Korea Electronic Show(KES) will be held in Seoul,Korea. As an exhibitor of the exhibiton, Kynix Semiconductor sincerely invites you to visit this exhibition. It is believed that you can have a better understanding of our company and we can form a stabler partnership.Following are some information about the Korea Electronic Show(KES). OverviewKorea Electronics Show (KES) has always been walking along with the 51 years history of the Korean electronic industry and the most important threshold to the international markets.Having strong connections especially with Asian Pacific IT shows in Japan, Hong Kong, Taiwan, and China, the buyers from North America, Europe, and Middle East tend to schedule every October as an Asian IT show pilgrimage. Exhibit areas:Electronics Parts & Materials; 3D Convergence & 3D Printing; Software & Mobile Apps; IT ConvergenceTheme:Where the Creative Things are!Venue: COEX Hall A, Hall B,World Trade Center Seoul,Seoul, South KoreaScale:1,500 booths representing 500 companies (including 100 overseas)Visitors:70,000(4,000 foreign)Date:October 17(Tue.)-20(Fri.),2017Well-known Exhibitors:UNION SEIMITSU CO., LTD.;SILICONE VALLEY CO., LTD.;SANYO DENKI (THAILAND) CO.,LTD.;MORNSUN.etcGlobal Partners:CEAC, CCPIT, CECC, HQEW(China), TEEMA(Taiwan), JESA, JMA(Japan), HKTDC(Hong Kong), AEECC(Asia Electronics Exhibition Cooperate Conference), Messe Berlin(Germany), CEA(U.S.A), RATEK(Russia), CMAI, TEMA(India), VEIA(Vietnam)Our Booth Number:E450       Floor Plan About Kynix Kynix Semiconductor has founded for 10 years since 2008. These 10 years have witnessed our company's trials of becoming a better and better distributor and supplier in electronic components industry. In 2009, our company established the International Sales Department and became members of TBF and HKInventory. In 2010, we established cooperative relationships with accredited testing organizations like CECCLab, White Horse Lab, AAA...In 2013, we established a strategic partnership with dozens of well-known electronic components manufacturers including TI.In 2015,we reached an electronic components supply strategic partnership with Foxconn.Also ,our B2B trading platform was launched officially,whose members have exceeded 15,000 in 2017. Recently, our partners in electronics field have increased to 700. Our Advantages 1. Strong operation system2. Good warehouse management3. Cooperation with advanced international testing companies4. Cooperation with international high standard logistics companies like UPS, DHL, TNT, FedEx5. Competitive supply from SumSung / Micron / BroadCom / Freescale / Atmel / Cypress and etc...  After-sales ServicesGurantee1.Each product from Kynix has been given a  warranty period of 1 YEAR .During this period , we could provide free technical maintenance if there are any problems about our products.2.If you find quality problems about our products after receiving them , you could test them and apply for unconditional refund if it can be proved.But it's just on this premise that the product is not used and the packing is not damaged . Commitment to QualityKynix has always been laying emphasis on the quality of its products and maintaining a sound cooperative relation with electronic components manufacturers since its founding. It has been conducting quality-monitoring system following the rigid rules in terms of the quality of the product, delivery, and it's after-sales service.   It is claimed by Kynix that all products sold are 100% authentic. Each product has been tested carefully before being sent to the customer. It is our aim to be responsible for our customers and make them satisfactory. ContactIf you have any questions, please contact us through our emails! Hope the exhibition finishes perfectly! We will be there and waiting for your coming!