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CatalogⅠ IntroductionⅡ The Layout of the Car MarketⅢ The Layout in the Industrial FieldⅣ The Layout on the Internet of ThingsⅤ ConclusionⅠ IntroductionON Semiconductor: In 2021, it will focus on the automotive, industrial and cloud power, and the Internet of Things marketThe end of the year and the beginning of the year is often a time for companies to make summaries and outlook, and the semiconductor industry is no exception. Not long ago, ON Semiconductor also made a year-end review of 2020 and revealed to the media what ON Semiconductor plans to do in 2021. "The year 2020 is a year of surprises for everyone. People around the world are experiencing the worst epidemic in a century. The good news is that the epidemic has eased in some parts of the world. Looking forward to 2021, we hope to get out of the epidemic as soon as possible and have a more favorable business environment." DavidSomo, senior vice president of strategy, marketing and solution engineering at ON Semiconductor, said in his opening remarks at the press conference.Due to the epidemic, the global economic situation in 2020 is not optimistic. According to Bloomberg data, GDP growth in 2020 is expected to drop from 2.8 percent in 2019 to minus 3.7 percent. China will be the only major economy in the world with positive growth by 2020, while all other economies are expected to suffer single-digit declines. Fortunately, in the second half of 2020, the global economy began to recover. As indicated by the PMI (Purchasing Managers' Index), manufacturing activity in all major economies resumed growth in the second half of the year, with the only exception being Japan, which also showed a positive trend. DavidSomo expressed an optimistic outlook for the global economy in 2021. "We expect that the economic outlook for next year will be positive, significantly better than this year, and there is a consensus for overall GDP growth of around 5% in 2021," he said. He also stressed that, for its part, ON Semiconductor wants to be a reliable supplier of power, analog, sensor and connection solutions, enabling innovation in energy-efficient electronics. It will focus on providing comprehensive solutions to global customers in the automotive, industrial and cloud power markets, as well as the Internet of Things market. Ⅱ The Layout of the Car MarketIn the automotive sector, ON Semiconductor implements a comprehensive sensor product and solution layout, including image sensors, radar, lidar, ultrasonic sensors and other products and solutions. In additon to sensors, R&D resources continue to be invested in silicon and silicon carbide power semiconductors, as well as LED lighting and automotive power management products. Those investments have also paid off handsomely, accounting for 33% of ON Semiconductor's $5.5 billion in 2019 revenue. DavidSomo pointed out that in the future, ON Semiconductor will continue to develop new products in the automotive market and increase investment in research and development. "On the automotive side, we will push forward research and development around sensors, autonomous driving-related applications, new energy vehicles, and the electrification of vehicles." He revealed. ON Semiconductor is one of the top 10 semiconductor suppliers in the automotive industry. DavidSomo proudly states, "Since entering the automotive market in 2010, ON Semiconductor has shipped 130 billion chips to automotive customers by 2019. In 2019, there were more than 230 ON Semiconductor devices used in every vehicle produced worldwide."The company has set the industry standard for automotive image sensors, with more than 120 million of them shipped to Advanced Driver Assistance System (ADAS) applications. Over the past 13 years, more than 400 million ON Semiconductor automotive image sensors have been used in vehicles on the road. ON Semiconductor has developed a complete portfolio of product solutions and sensor modes to support L4 and L5 autonomous vehicles, including ultrasonic sensor interfaces, image sensors, solid-state LIDAR and millimeter-wave radar technologies. DavidSomo said that ON Semiconductor's MMW technology, acquired from IBM Research Group in Sea Law (IBM), has been used in communications and fiber optics, and plans to use the technology in the automotive sector. It is currently being tested with customers for prototypes but has not yet been used in commercial automotive production. In the case of LiDAR, the technology came from the acquisition of sensL to acquire technology on solid-state LiDAR. According to DavidSomo, sensL was originally designed for use in the medical market but is now being developed for use in the automotive market. "Multiple customers have incorporated our Silicon Photomultiplier (SiPM) and Single-Photon Avalanche Diode (SPAD) technologies into solid-state lidar systems, enabling commercial lidar applications in the automotive industry for L2+ and L3 level autonomous driving safety applications." He went on to point it out. On the cost side, DavidSomo says that because ON Semiconductor's lidar solution is a solid-state solution, it has been able to bring the cost of lidar down from more than $1,000 for mechanical rotation in the past to the current $500 range for solid-state solutions. In terms of image sensors, over the years, ON Semiconductor has made three acquisitions, including Aptina, Cypress's image sensor technology and TrueSense, to enrich its image sensor portfolio.Ⅲ The Layout in the Industrial FieldDavidSomo said that ON Semiconductor offers a wide range of power and automation solutions in the industrial and cloud power markets that support different application scenarios. In terms of power semiconductors, in 2018, ON Semiconductor ranked second behind Infineon with a market share of about 9 percent, according to IHS. As an example, he pointed out that powering the cloud requires several processes, including generation, power supply and power demand management. "In these processes, we have a complete silicon and silicon carbide technology portfolio that supports power generation, transmission and distribution, as well as power and demand management for data centers and 5G base stations." He points it out. In terms of energy efficiency improvement, the use of ON Semiconductor's cloud power solution increased energy efficiency by about 0.5%. In a typical VL data center, the savings over the life of the system are estimated at approximately $38 million. The energy efficiency improvement is only 0.5%, which may not sound like much, but when measured at the system-wide level of deployment, the savings over the lifetime of the system are significant. The development of energy infrastructure is also unstoppable, as a society and the government further promote the development of new energy sources and shift more from coal-fired power generation to renewable energy sources such as wind and solar power. In order to save energy and reduce emissions, reduce air pollution, from fuel vehicles to new energy vehicles, which has generated the demand for electric vehicle charging pile, and ON Semiconductor silicon and silicon carbide power discrete devices and modules, can support the construction of electric vehicle charging pile. Similarly, its power technologies, such as solar inverters used in solar panels, enable clean energy generation, and "ON Semiconductor is fortunate to partner with customers in China to develop applications in these areas." DavidSomo said. Manufacturing is also one of the biggest users of energy. In the United States, our power solutions are used in plant motor drive systems, resulting in savings of more than $350 million per year. If applied globally, the potential savings could reach approximately $5.8 billion per year, resulting in energy efficiency improvements in manufacturing motor drive systems.Ⅳ The Layout on the Internet of ThingsIn the Internet of Things (IoT) area, ON Semiconductor has a complete set of key components and modules that enable devices to be connected, intelligent, aware and actuated in their operating environment."Of course, we recognize that our semiconductor components are not sufficient to build the end-to-end connected Internet of Things (IoT) systems that our customers need, so we are investing more to accelerate development and provide our customers with a number of development tools to enable faster application development and market deployment." DavidSomo admits. While ON Semiconductor can provide many of the key building blocks, DavidSomo believes it is important to work with partners in the Internet of Things (IoT) ecosystem to build IoT solutions for secure end-to-end connectivity. As shown in the figure below, ON Semiconductor works with a number of technology partners to enhance the performance of IoT devices developed by clients, as well as with infrastructure providers such as cloud service providers to enable edge devices to connect securely and stably to the cloud. He also revealed that the company is focusing on three vertical areas in the Internet of Things, namely asset tracking and monitoring, connected lighting, and smart homes and building automation.Ⅴ ConclusionIn conclusion, DavidSomo said that in the process of semiconductor device manufacturing, ON Semiconductor also recognizes the growing need to provide its customers with complete system solutions that add value. As a result, ON Semiconductor offers modular products for power components and built-in controls, as well as reference design kits to speed up customer product development. ON Semiconductor also provides software and design tools to help customers complete designs faster and get their equipment to market faster. He also stressed that ON Semiconductor will focus on research and development, and is committed to developing innovative products and solutions including power, simulation, sensors and connectivity solutions. "Through both endogenous growth and exogenous acquistions, we are further enhancing our capabilities to support the applications our customers are developing, while also building our professional application capabilities to help them develop products better and faster to market."

IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company's latest silicon-germanium (SiGe) chip-making process is designed to enable ever-increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.Since its introduction in 1995, IBM's SiGe semiconductor technology has helped spur a revolution in radio frequency (RF) performance, enabling engineers to develop breakthrough devices such as satellite global positioning systems, WiFi radios and high speed optical links. IBM's new "9HP" SiGe technology continues to put advanced capability in the hands of engineers who design chips for LTE cellular base stations, millimeter-wave wireless communication links, and next generation short and long-haul optical communications. Outside of communications, 9HP performance will advance the state of the art in other applications such as high-performance test equipment, automotive radar and security imaging."Silicon-germanium is one of the key technologies that have enabled wireless operators to keep up with the explosive growth in data traffic generated from mobile handsets," said David Harame, IBM Fellow. "Before SiGe, the high-performance chips used in base stations and optical links were built using expensive, esoteric processes. SiGe provides the necessary performance as well as integration and cost savings via its CMOS base."Open Collaboration is Key to SuccessOver the years, a number of leading technology companies have come to rely on the benefits and advantages of SiGe, working closely with IBM to develop and refine new versions of the chip-making process. IBM believes that open collaboration among companies will drive future breakthrough innovation in semiconductors."As early adopters of IBM's SiGe technology, Semtech has consistently pushed the envelope on what can be achieved in high-speed wired and wireless communications systems and in high performance analog devices," said Charles Harper, Senior Vice President of Semtech's Systems Innovation Group. "With today's technology, Semtech is a leader in 40Gbps and 100Gbps Communications Systems and with IBM's latest SiGe technology we believe we can emerge as a leader in several new analog segments where performance, integration and power are critical requirements.""Our long collaboration with IBM on SiGe technology has enabled Tektronix to break new barriers on what can be achieved in high-fidelity, high-bandwidth oscilloscopes," said Kevin Ilcisin, chief technology officer, Tektronix. "We utilized IBM's SiGe 9HP for our patent-pending asynchronous interleaving approach, and expect to break new ground by providing customers bandwidth capabilities of 70 GHz and beyond while significantly improving our signal-to-noise ratio."Key Technology Details, Specs9HP will be the first SiGe technology in the industry featuring the density of 90nm CMOS which will enable the highest level of integration in a fully production qualified SiGe BiCMOS technology. IBM's new SiGe BiCMOS technology delivers higher performance, lower power and higher levels of integration than current 180nm or 130nm SiGe offerings.The technology maintains compatibility with IBM's 90nm low power CMOS technology platform, enabling foundry clients to port a wide range of intellectual property circuit blocks and standard cell library elements. The 90nm foundry platform also includes an RF CMOS technology option, giving IBM foundry customers a broad range of technology choices for RF and mixed-signal applications.Additional technical specifics include:90nm Lithography based SiGe BiCMOSAdvanced SiGe HBT NPNs, Ft = 300GHz, Fmax > 350GHz90nm CMOS FETs, 1.5, 2.5v/3.3vThick Dielectric Add-On Modules – Low-K, Cu, AlFull Suite of Passives-Resistors, Varactors, MOS and MIM Capacitors, High Q Inductors, mmWave elementsPIN and THz Schottky Barrier DiodesProcess Design Kits featuring precision RF device models 

IBM is telling the world about something quite ambitious: TrueNorth's neurons could revolutionize system architecture. Dharmendra S. Modha, IBM Fellow, has given us the overview of what TrueNorth is all about in his report in IBM Research.Six years ago, he said, IBM and university partners began their effort to build a brain-inspired computer.Phase 0 turned into Phase 1, Phase 2, and Phase 3— from neuroscience to super computing to a new architecture, to a new programming language to algorithms, applications, and now, new chip, which is TrueNorth.He offered some numbers, which are bit daunting for those not accustomed to the "neuromorphic" world of computer research.Modha said, "we have shrunk the neurosynaptic core by 15-fold in area and 100-fold in power, and have tiled 4,096 cores via an on- IC chip network to create TrueNorth—with one million neurons and 256 million synapses."Cade Metz, Wired senior staff writer, went beyond the numbers to describe on Monday what he saw. "Dharmendra Modha walks me to the front of the room so I can see it up close. About the size of a bathroom medicine cabinet, it rests on a table against the wall, and thanks to the translucent plastic on the outside, I can see the computer chips and the circuit boards and the multi-colored lights on the inside. It looks like a prop from a '70s sci-fi movie, but Modha describes it differently. 'You're looking at a small rodent,' he says. He means the brain of a small rodent—or, at least, the digital equivalent."(The machine at the front of the room is really 48 separate machines, each built around its own TrueNorth processors, Metz wrote.)Not surprisingly, several websites took to the rodent comparison to report that IBM had come up with a "rat brain"-like chip that might power the phones of tomorrow.Modha, meanwhile, spelled out the applications that might result. "The architecture can solve a wide class of problems from vision, audition, and multi-sensory fusion."Making smartphones, as Wired put it, "hyper-smart"? That would be one effect. Modha said, "On one hand, with portable devices: think smart phones, sensor networks, self-driving automobiles, robots, public safety, medical imaging, real-time video analysis, signal processing, olfactory detection, and digital pathology. On the other hand, with synaptic supercomputers: —think multimedia processing on the cloud."Reporter Mike Murphy in Quartz on Tuesday talked about the technology itself which is turning the corner: "While current chips are excellent at analyzing information in sequential order, the new 'neuromorphic' types of chips Modha's team are working on are better suited to finding patterns in information—like the right side of the brain."Traditional chips follow instructions, whereas IBM's new chip manages 'spikes'—rather like spikes in electrical activity in an organic brain," Murphy said.TrueNorth, with all its comparisons, is not a brain but it is a step toward a digital brain. "Let's be clear: we have not built the brain, or any brain," said Modha in the IBM Research report. "We have built a computer that is inspired by the brain. The inputs to and outputs of this computer are spikes. Functionally, it transforms a spatio-temporal stream of input spikes into a spatio-temporal stream of output spikes."Collaboration with Samsung was critical in gaining access to their advanced 28nm foundry process, he said. This allowed balancing the low active power of the architecture with matching low power of the underlying silicon technology.He added, "I am immensely grateful to our 200+ collaborators since 2008—spanning eight IBM labs and fabs, five universities, one start-up, and two Department of Energy laboratories. Finally, DARPA's mandate, metrics, and investment were absolutely vital." 

An alliance led by IBM Research today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors. The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches—transistors—on the fingernail-sized chips that power everything from smartphones to spacecraft.To achieve the higher performance, lower power and scaling benefits promised by 7nm technology, researchers had to bypass conventional semiconductor manufacturing approaches. Among the novel processes and techniques pioneered by the IBM Research alliance were a number of industry-first innovations, most notably Silicon Germanium (SiGe) channel transistors and Extreme Ultraviolet (EUV) lithography integration at multiple levels.Industry experts consider 7nm technology crucial to meeting the anticipated demands of future cloud computing and Big Data systems, cognitive computing, mobile products and other emerging technologies. Part of IBM's $3 billion, five-year investment in chip R&D (announced in 2014), this accomplishment was made possible through a unique public-private partnership with New York State and joint development alliance with GLOBALFOUNDRIES, Samsung, and equipment suppliers. The team is based at SUNY Poly's NanoTech Complex in Albany."For business and society to get the most out of tomorrow's computers and devices, scaling to 7nm and beyond is essential," said Arvind Krishna, senior vice president and director of IBM Research. "That's why IBM has remained committed to an aggressive basic research agenda that continually pushes the limits of semiconductor technology. Working with our partners, this milestone builds on decades of research that has set the pace for the microelectronics industry, and positions us to advance our leadership for years to come."Microprocessors utilizing 22nm and 14nm technology power today's servers, cloud data centers and mobile devices, and 10nm technology is well on the way to becoming a mature technology. The IBM Research-led alliance achieved close to 50 percent area scaling improvements over today's most advanced technology, introduced SiGe channel material for transistor performance enhancement at 7nm node geometries, process innovations to stack them below 30nm pitch and full integration of EUV lithography at multiple levels. These techniques and scaling could result in at least a 50 percent power/performance improvement for next generation mainframe and POWER systems that will power the Big Data, cloud and mobile era."Governor Andrew Cuomo's trailblazing public-private partnership model is catalyzing historic innovation and advancement. Today's announcement is just one example of our collaboration with IBM, which furthers New York State's global leadership in developing next generation technologies," said Dr. Michael Liehr, SUNY Poly Executive Vice President of Innovation and Technology and Vice President of Research. "Enabling the first 7nm node transistors is a significant milestone for the entire semiconductor industry as we continue to push beyond the limitations of our current capabilities."The 7nm node milestone continues IBM's legacy of historic contributions to silicon and semiconductor innovation. They include the invention or first implementation of the single cell DRAM, the Dennard Scaling Laws, chemically amplified photoresists, copper interconnect wiring, Silicon on Insulator, strained engineering, multi core microprocessors, immersion lithography, high speed SiGe, High-k gate dielectrics, embedded DRAM, 3D chip stacking and Air gap insulators.