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Fujitsu Semiconductor Europe today announced a new arrival to its FerVID family of chips for RFID tags. As with all members of the FerVID family, the MB89R112 series uses ferroelectric memory (FRAM) for fast write speeds, high-frequency rewritability, radiation tolerance and low-power operation. With industry-leading 9 KB memory, the series offers tailored solutions for factory automation and medical equipment as well as for embedded and industrial applications. Since 2004, Fujitsu has developed FRAM products as part of the FerVID family with two frequency bands, for use as chips in high-functionality RFID tags operating in the HF band (13.56 MHz) and UHF band (860 to 960 MHz). Today, its products serve a wide range of applications, including chips for data-carrier tags in the factory automation and maintenance sectors, chips capable of withstanding gamma radiation or electron beams for the medical and pharmaceutical sectors, and chips with serial interfaces for embedded applications.The new MB89R112 series includes 9 KB of FRAM, the greatest density available in an RFID chip operating in the HF band as defined in ISO/IEC 15693. Of this 9 KB, 8 KB is provided as user memory, enabling access by read/write operations to the entire 8 KB region as defined in ISO/IEC 15693. The series will be offered in two variants, with 24pF and 96pF input capacitance. Writing 8 KB of data takes approximately four seconds, a high-speed operation that is six times faster than speeds achieved by E2PROM products. The greater data volume available on RFID tags enables greater efficiency for applications such as product lifecycle traceability management – from manufacturing to logistics, use and disposal – or on-site data logging for equipment maintenance records.The market is demanding higher-capacity memory, plus RFID connectivity to sensors and microcontrollers, so as to facilitate the wireless modification of product operating parameters or the logging of environmental factors during distribution. These features would benefit production control in automotive and electronics manufacturing, as well as maintenance applications in aviation, road-building, construction and civil engineering.The MB89R112QN products enable these features by supplementing the HF RFID interface with an additional SPI serial interface for microcontroller connectivity. Since the 8 KB of user memory in FRAM can be accessed from the microcontroller via SPI, shared memory regions can be used both for data logging and as a parametric area for changing the microcontroller's operating parameters.Application examples include logging environmental readings for logistics, detecting equipment errors, modifying electronic displays, altering sensor threshold values, changing firmware settings, plus many other novel and innovative applications that were previously unworkable.
kynix On 2016-10-10
Stream video on your smartphone, or use its GPS for an hour or two, and you'll probably see the battery drain significantly. As data rates climb and smartphones adopt more power-hungry features, battery life has become a concern. Now a technology developed by MIT spinout Eta Devices could help a phone's battery last perhaps twice as long, and help to conserve energy in cell towers.The primary culprit in smartphone battery drain is an inefficient power amplifier, a component that is designed to push the radio signal out through the phones' antennas. Similar larger modules are found in wireless base stations, where they might use 10 or even 100 times the power.Prepared to send sizeable chunks of data at any given time, the amplifiers stay at maximum voltage, eating away power—more than any other smartphone component, and about 75 percent of electricity consumption in base stations—and wasting more than half of that power as heat. This means smartphone batteries lose longevity, and base stations waste energy and lose money.But Eta Devices has developed a chip (for smartphones) and a shoebox-size module (for base stations)—based on nearly a decade of MIT research—to essentially "switch gears" to adjust voltage supply to power amplifiers as needed, cutting the waste."You can look at our technology as a high-speed gearbox that, every few nanoseconds, modulates the amount of power that the power amplifier draws from the battery," explains Joel Dawson, Eta Devices' chief technology officer and a former associate professor of electrical engineering and computer science who co-invented the technology. "That turns out to be the key to keeping the efficiency very high."When trialed in a base station last year, Eta Devices' module became the first transmitter for 4G LTE networks to achieve an average efficiency greater than 70 percent, Dawson says. "The highest number we've heard before that was 45 percent—and that's probably being generous," he says.Backed by millions in funding, Eta Devices—co-founded by David Perreault, an MIT professor of electrical engineering, and former MIT Sloan fellow Mattias Astrom—has partnered with a large base-station manufacturer. The goal is to deploy the technology in live base stations by the end of 2015. The savings could be substantial, Dawson says, noting that a large carrier could save $100 million in annual electricity costs.Eta Devices has also entered conversations with major manufacturers of LTE-enabled smartphones to incorporate their chips by the end of next year. Dawson says this could potentially double current smartphone battery life.Besides battery life, Dawson adds, there are many ways the telecommunications industry can take advantage of improved efficiency. Eta Devices' approach could lead to smaller handset batteries, for example, and even smaller handsets, since there would be less dissipating heat. The technology could also drive down operating costs for base stations in the developing world, where these stations rely on expensive diesel fuel for power.And ultimately, it could impact the environment: If all midsized carrier networks were to replace current radio amplifiers with Eta Devices' technology, he says, the reduction in greenhouse gases would be equivalent to taking about 5 million cars off the road. "There are so many ways to leverage high efficiency if you have it," Dawson says.In August, the World Economic Forum named Eta Devices the 2015 Technology Pioneer, a designation awarded previously to Dropbox, Spotify, and Twitter, to name a few.In the mobile marketEta Devices' commercial success is, in part, a product of engineering ingenuity intersecting with business acumen at MIT.In 2008, Dawson and Perreault, who directs the Power Electronics Research Group, submitted an early concept of the Eta technology—then called asymmetrical multilevel outphasing (AMO)—to an Innovation Teams (i-Teams) class that brought together MIT students from across disciplines to develop commercial products.The AMO technology was a new transmitter architecture, where algorithms could choose from different voltages needed to transmit data in each power amplifier, and select the optimal choice for power conservation—and do so roughly 20 million times per second. This could be done on the transmitting and receiving end of data transfers.This caught the eye of Astrom, who had come to MIT after working in the mobile industry for 10 years, "looking for the next big thing." With help from Astrom, the professors started designing the technology for the mobile market—initially leaning toward base stations."At the time, I was suffering, as everyone else was, from my iPhone running out of battery at lunchtime," Astrom says. "The iPhone was only a year old, but you could see how much data traffic would explode."Fleshing out a business plan from an i-Teams draft, the two professors earned a Deshpande Center for Technological Innovation grant in 2009, allowing for the first demonstration of the hardware, showing a 77 percent gain in efficiency over standard systems. (A paper detailing the technology was presented at that year's IEEE Radio Frequency Integrated Circuits Symposium.)"That Deshpande Center grant was big in terms of the funding and connecting us with local venture capitalists, and really helping with being in that business mindset," Dawson says.Spinning out a company has been the best way to validate the technology—especially with novel power-electronics hardware, Dawson says. "People in our industry take ideas a lot more seriously when there's a company behind it," he says. "We had impressive performance at MIT, but now we have a team of professionals working on the technology full-time. The resulting performance numbers are jaw-dropping. Now people are going back and frantically studying the original MIT research papers."Luckily, Dawson says, several significant changes were made to those old research projects in order to develop today's ETAdvanced—so the secret ingredients of the technology are safe. "The joke I like to tell is: When I was a professor, I was going around the world trying to give the technology away," Dawson says, laughing. "If I had succeeded, then there'd be no business."Future-proofing technologyToday, Eta Devices' major advantage is that its technology is able to handle ever-increasing data bandwidths.A few major smartphone manufacturers are now using envelope tracking (ET), which adjusts voltage to power amplifiers on the fly. But by adjusting that voltage continuously, ET efficiency falls apart for 4G/LTE and 802.11ac (WiFi) wireless standards, even up to 20 MHz bandwidth. ETAdvanced, in contrast, already accommodates ultrahigh bandwidths used by newer communication standards, such as LTE Advanced (up to 80 megahertz), and the next-generation WiFi standard (up to 160 megahertz).Prepping for future communication standards is one thing that's helped the company thrive, Dawson says. "As a small company, you'll lose a fair fight with another technology—you have to have some overpowering advantage that they can't match you on," he says. "In introducing new hardware, you not only have to be better than the product of today, but also have to make compelling case for being future-proof."
kynix On 2016-10-06
IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company's latest silicon-germanium (SiGe) chip-making process is designed to enable ever-increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.Since its introduction in 1995, IBM's SiGe semiconductor technology has helped spur a revolution in radio frequency (RF) performance, enabling engineers to develop breakthrough devices such as satellite global positioning systems, WiFi radios and high speed optical links. IBM's new "9HP" SiGe technology continues to put advanced capability in the hands of engineers who design chips for LTE cellular base stations, millimeter-wave wireless communication links, and next generation short and long-haul optical communications. Outside of communications, 9HP performance will advance the state of the art in other applications such as high-performance test equipment, automotive radar and security imaging."Silicon-germanium is one of the key technologies that have enabled wireless operators to keep up with the explosive growth in data traffic generated from mobile handsets," said David Harame, IBM Fellow. "Before SiGe, the high-performance chips used in base stations and optical links were built using expensive, esoteric processes. SiGe provides the necessary performance as well as integration and cost savings via its CMOS base."Open Collaboration is Key to SuccessOver the years, a number of leading technology companies have come to rely on the benefits and advantages of SiGe, working closely with IBM to develop and refine new versions of the chip-making process. IBM believes that open collaboration among companies will drive future breakthrough innovation in semiconductors."As early adopters of IBM's SiGe technology, Semtech has consistently pushed the envelope on what can be achieved in high-speed wired and wireless communications systems and in high performance analog devices," said Charles Harper, Senior Vice President of Semtech's Systems Innovation Group. "With today's technology, Semtech is a leader in 40Gbps and 100Gbps Communications Systems and with IBM's latest SiGe technology we believe we can emerge as a leader in several new analog segments where performance, integration and power are critical requirements.""Our long collaboration with IBM on SiGe technology has enabled Tektronix to break new barriers on what can be achieved in high-fidelity, high-bandwidth oscilloscopes," said Kevin Ilcisin, chief technology officer, Tektronix. "We utilized IBM's SiGe 9HP for our patent-pending asynchronous interleaving approach, and expect to break new ground by providing customers bandwidth capabilities of 70 GHz and beyond while significantly improving our signal-to-noise ratio."Key Technology Details, Specs9HP will be the first SiGe technology in the industry featuring the density of 90nm CMOS which will enable the highest level of integration in a fully production qualified SiGe BiCMOS technology. IBM's new SiGe BiCMOS technology delivers higher performance, lower power and higher levels of integration than current 180nm or 130nm SiGe offerings.The technology maintains compatibility with IBM's 90nm low power CMOS technology platform, enabling foundry clients to port a wide range of intellectual property circuit blocks and standard cell library elements. The 90nm foundry platform also includes an RF CMOS technology option, giving IBM foundry customers a broad range of technology choices for RF and mixed-signal applications.Additional technical specifics include:90nm Lithography based SiGe BiCMOSAdvanced SiGe HBT NPNs, Ft = 300GHz, Fmax > 350GHz90nm CMOS FETs, 1.5, 2.5v/3.3vThick Dielectric Add-On Modules – Low-K, Cu, AlFull Suite of Passives-Resistors, Varactors, MOS and MIM Capacitors, High Q Inductors, mmWave elementsPIN and THz Schottky Barrier DiodesProcess Design Kits featuring precision RF device models
kynix On 2016-09-29
It's only a centimeter long, it's placed under your skin, it's powered by a patch on the surface of your skin and it communicates with your mobile phone. The new biosensor chip developed at EPFL is capable of simultaneously monitoring the concentration of a number of molecules, such as glucose and cholesterol, and certain drugs.The future of medicine lies in ever greater precision, not only when it comes to diagnosis but also drug dosage. The blood work that medical staff rely on is generally a snapshot indicative of the moment the blood is drawn before it undergoes hours - or even days - of analysis.Several EPFL laboratories are working on devices allowing constant analysis over as long a period as possible. The latest development is the biosensor chip, created by researchers in the Integrated Systems Laboratory working together with the Radio Frequency Integrated Circuit Group. Sandro Carrara is unveiling it today at the International Symposium on Circuits and Systems (ISCAS) in Lisbon.Autonomous operation"This is the world's first chip capable of measuring not just pH and temperature, but also metabolism-related molecules like glucose, lactate and cholesterol, as well as drugs," said Dr Carrara. A group of electrochemical sensors works with or without enzymes, which means the device can react to a wide range of compounds, and it can do so for several days or even weeks.This one-centimetre square device contains three main components: a circuit with six sensors, a control unit that analyses incoming signals, and a radio transmission module. It also has an induction coil that draws power from an external battery attached to the skin by a patch. "A simple plaster holds together the battery, the coil and a Bluetooth module used to send the results immediately to a mobile phone," said Dr Carrara.Contactless, in vivo monitoringThe chip was successfully tested in vivo on mice at the Institute for Research in Biomedicine (IRB) in Bellinzona, where researchers were able to constantly monitor glucose and paracetamol levels without a wire tracker getting in the way of the animals' daily activities. The results were extremely promising, which means that clinical tests on humans could take place in three to five years - especially since the procedure is only minimally invasive, with the chip being implanted just under the epidermis."Knowing the precise and real-time effect of drugs on the metabolism is one of the keys to the type of personalised, precision medicine that we are striving for," said Dr Carrara.
kynix On 2016-09-27
Engineers at PARC, a Xerox company, have come up with a chip that will self-destruct on command; it was demonstrated at DARPA's Wait, What? event in St. Louis on Thursday.The chip was developed under the Defense Advanced Research Projects Agency (DARPA), part of the latter's Vanishing Programmable Resources (VAPR) program.Last year, PARC spoke of DARPA's goal, to demonstrate electronic systems capable of physically disappearing in a controlled, triggerable manner. In April 2014, PARC issued a news release, "PARC Awarded Up To $2 Million from DARPA to Develop Vanishing Electronics" in which it revealed its contract with the Defense Advanced Research Projects Agency to develop a "disappearing electronics" platform called DUST, which stands for Disintegration Upon Stress-Release Trigger."Sophisticated electronics can be made at low cost and are increasingly pervasive throughout the battlefield," the announcement said. "Large numbers can be widely proliferated and used for applications such as distributed remote sensing and communications. However, it is nearly impossible to track and recover every device, resulting in unintended accumulation in the environment, potential unauthorized use, and compromise of intellectual property and technological advantage."The chip, demonstrated at the Thursday event, could be used to store data such as encryption keys but, on command could shatter into pieces so small that it would be it impossible to reconstruct.Military applications come to mind; also, commercial and scientific could find use for the DUST technology.The 2014 announcement noted how in environment science DUST sensors could find use to measure weather patterns such as hurricane predictions or vibrations preceding earthquakes but then be removed from the environment with no footprint. PARC's Sean Garner, part of the DUST project, "Imagine," said Garner, "being able to cover a large area, like the ocean floor, with billions of tiny sensors to 'hear' what is happening within the earth's crust, and have them quickly disintegrate into, essentially, sand, leaving no trace and not harming the planet or sea life."Martyn Williams, senior U.S. correspondent, IDG News Service, reported on the Thursday event; he quoted Gregory Whiting, a PARC senior scientist:"We really wanted to come up with a system that was very rapid and compatible with commercial electronics."A chip is fabricated on a glass substrate. "We take the glass and we ion-exchange temper it to build in stress," said Whiting in the IDG News report.The glass was stressed to breaking point by heat. Reported Williams: "When a circuit was switched on, a small resistor heated up and the glass shattered into thousands of pieces. Even after it broke up, stress remained in the fragments and they continued breaking into even smaller pieces for tens of seconds afterwards." (The self-destruct circuit was triggered by a photo-diode, which switched on the circuit when a bright light fell on it. In the demo, the light was provided by a laser, but the trigger could be anything from a mechanical switch to a radio signal, said Williams.)Beyond a future in security and environmental sciences, Popular Mechanics' John Wenz offered his suggestion for its future. He said it could make for "a great hackathon for people to figure out how to break into a system and shatter the chips (supposing a triggering element is installed internally) in order to either further strengthen the security, or just to be a butthead.
kynix On 2016-09-09
Catalog Brief Introduction What Is System on Chip? Content of The Study Bus Architecture Technology IP Core Reuse Technology Reliability Design Technology Software and Hardware Co-design Technology SoC Design Verification Technology Chip Synthesis / Timing Analysis Technology Testability / Debuggability Design Technology Low Power Consumption Design Technology New Circuit Implementation Technology Embedded Software Migration / Development SoC classification Technical Characteristics of CSoC Technical Characteristics of SoPC Technical Characteristics of ASIC SoC Classification Principles of SoC Classification Model of SoC Development Direction of SoC Technology Computer Science Promotes the Level of SoC Technology SoC Promotes the Development of Computer Architecture SoC Opens Up a New World for The Development of Interdisciplinary Disciplines Brief Introduction of SoC A system on chip (SoC) is a microchip which has all the necessary electronic circuits and other parts of a given system on a single integrated circuit. This technology is especially used in small yet extremely complex consumer electronic devices. There are some devices which have more processing power and memory than a standard desktop. This is possible only with the use of system on chip design. In simple terms a system on chip is an integrated circuit which integrates all components of a computer or any other electronic system into a single chip. It may include analog, digital, mixed-signal and other radio frequency funtions on a single chip substrate. Due to their low power consumption, SoCs are quite common in the mobile electronics market. Embedded systems is the best example of the use of system on chip. Figure 1 The structure of a typical system of chip consists of: —A microcontroller, digital signal processor or microprocessor core. —Memory blocks along with a selection of RAM, ROM, EEPROM and flash memory. —Oscillators, phase-locked loops and other timing sources. —Counter-timers, eral-time timers as well as power-on reset generators. —USB, FireWire, Ethernet, SPI, USART and other external interfaces as well. —Analog interfaces including ADCs and DACs. Along with the above mentioned hardware, system on chip design also has software which controls the microcontroller, microprocessor, peripherals and interfaces. The design flow of a SoC aims at developing both the hardware and software in a parallel manner. Typically most of the system on chip are developed from pre-qualified hardware blocks along with the software drivers which control their operation. While the hardware blocks are arranged together with the help of CAD tools, software-development environment is used to integrate the software modules. The next step is functional verification of the system on chip design to verify and debug both harware as well as software prior to tapeout. The technologies with which SoC can be fabricated are: —Standard Cell —Full Custom —Field-programmable Gate Array As SoC designs consume less power and have higher reliability and lower cost as compared to the multi-chip systems which they replace, they are regarded as the best option to be used. The major problems/ challenges faced by SoC designers are as follows: Functional content complexity – The amount of the content involved in build SoCs leads one to the conclusion that designing these systems is not easy even for large design teams. This is why some form of intellectual property reuse has become an inevitable part of SoC design. Along with functional content complexity, architectural as well as verification challenge are some of the major problems inherent in the SoC designing. Content of The Study SoC design methodology mainly studies Bus Architecture Technology, IP Core Reuse Technology, Reliability Design Technology, Software and Hardware Co-design Technology, SoC Design Verification Technology, Chip Synthesis / Timing Analysis Technology, Testability / Debuggability Design Technology, Low Power Consumption Design Technology, New Circuit Implementation Technology, etc. In addition, Operating System / Embedded Software Migration, Development and Research are also needed to be done in this new interdisciplinary field of research. Bus Architecture Technology Bus structure and interconnection technology directly affect the overall performance of the chip. For a single application field, mature bus architecture can be selected; for those with high serialization or comprehensive performance requirements, in-depth architecture research can be carried out, and the bus architecture with its own characteristics can be constructed. Therefore, it can be refined and strengthened without being restricted by third parties, develop synchronously with the system and become more competitive. At present, the development of SoC is mainly based on platform (including independent construction of the overall architecture), based on core, based on synthesis and other methods, and constantly introduce better performance, stronger scalability of the bus specification. IP Core Reuse Technology IP core is generally divided into hard IP core, soft IP core and firm IP core. Hard IP core refers to the IP core which has been pre-arranged and cannot be modified by the system designer. The soft IP core is usually submitted in the form of HDL language. Firm IP core is composed of RTL description and synthesizable network table. The research focus of IP core reuse is to develop the integration of specification and testability to adapt to a variety of bus interfaces in order to achieve the purpose of reuse with as few outsourcing and test vectors as possible. IP cores should have good development documentation and reference manuals, including data manuals, user guidelines, simulation and reuse models, and compatibility is an important factor. Reliability Design Technology Because SoC is composed of multi-level bus and each bus contains multiple devices (IP core). Therefore, it is very important to ensure the normal operation of the whole chip. And the anti-"deadlock" mechanism and "unlocking" mechanism must be considered, which means that a device (IP core) will not affect the other functions of the whole chip even if it is paralyzed. In addition, with the development of ultra-deep submicron technology, the reliability of bus transmission becomes a serious challenge, so it is necessary to study the fault-tolerant mechanism and fault recovery mechanism. Software and Hardware Co-design Technology Due to the pressure of market and design risk, SoC hardware and software co-design becomes particularly important. Improving hardware / software co-description, co-analysis, co-design, co-simulation and co-verification can greatly reduce the risk of hardware design and shorten the development and debugging time of embedded software. At the same time, the fatal problems existing in the software and hardware can be found in the co-verification environment in time, and the readjustment of the software and hardware can be avoided in the final integration test. SoC Design Verification Technology It is mainly divided into three levels: IP core verification, IP core and bus interface compatibility verification and system-level verification, including design concept verification, design implementation verification, design performance verification, fault simulation, chip testing and so on. From the type of verification, there are compatibility test, corner test, random test, real code test, regression (Regression) test, assertion verification and so on. Due to the increasing complexity of the chip and the high cost of software simulation, hardware simulation verification has become an important verification method. Verification accounts for about 70% of the whole design work. And how to improve the verification coverage and efficiency is the eternal topic of design verification. Chip Synthesis / Timing Analysis Technology Due to the increasing complexity and scale of SoC system, new topics such as multi-clock, multi-voltage and ultra-deep submicron continue to emerge, which puts forward higher requirements for the comprehensive research of SoC. In particular, the research on how to classify and decompose the time series budget and special constraints of critical path requires researchers to master a great deal of system background knowledge. At the same time, the static timing analysis (STA) is becoming more and more complex and the efficiency of back-end dynamic simulation is low, which poses a severe challenge to the overall designers. Testability / Debuggability Design Technology This paper mainly studies and solves the problems of batch production testability and online debuggability. The implementation technologies include DFT, SCAN, BIST, Iddq, JTAG/eJTAG. To study the SoC test architecture based on various IP cores and test the efficient transitivity of vector, It is more important to consider the parallelization of testing and reduce the time occupied by chip testing. In addition, we should pay attention to online debugging to facilitate users to develop and debug SoC-based products. Low Power Consumption Design Technology Low power consumption has become an equally important design goal as area and performance, so accurate evaluation of power consumption has also become an important issue. The power consumption of the chip is mainly composed of jump power consumption, short circuit power consumption and leakage power consumption. In order to reduce power consumption, it is necessary to study the circuit implementation technology, input vector control (IVC) technology, multi-voltage technology, power consumption management technology and software (algorithm) low-power utilization technology from the perspective of SoC multi-level stereo to solve the problem comprehensively. New Circuit Implementation Technology Due to the sharp increase in the number of transistors, the decreasing chip size, the increasing density, the increased reuse frequency of IP cores, the emergence of low voltage, multi-clock, high frequency, high testability, new and difficult packaging and other requirements, as well as the endless emergence of new design technologies, the minimum dimensions of semiconductor technologies develop towards deep submicron. And this requires SoC designers to constantly study new technologies, new tools, key circuit architecture, timing convergence, signal integrity, antenna effect and so on. Embedded Software Migration / Development The main research and development of BIOS and embedded operating system transplantation / development of SoC is to support multi-task, to make program development easier, to improve the stability and reliability of the system, to make maintenance convenient, to make reading and understanding easier. Therefore, it should have the characteristics of good security, strong robustness, high code execution efficiency and so on. For example, the embedded Linux operating system code implantation research on SoC chip can reduce the difficulty based on BSP development for system developers. At the same time, it improves the development efficiency and shortens the development cycle. SoC classification In this paper, SoC is classified into three categories: CSoC, SOPC and ASIC SoC, and then unified them into SoC architecture classification model. Technical characteristics of CSoC CSoC is generally composed of processor, memory, ASIC-based kernel and on-chip reconfigurable components, which has obvious advantages over ASIC SoC and multi-chip board-level development based on standard components. It is characterized by: —CPU + reconfigurable processing artifacts. —Efficiency and flexibility combine well. —Refactoring based determination processing function. —It is superior to supercomputer in image processing, pattern matching and so on. —According to the needs of the task, it can be dynamically reconfigurable to improve the performance-price ratio. At present, the academia pays more attention to the XPP (eXtreme Processing Platform), which is the efficient processor with dynamic reconfiguration. XPP embeds programmable logic modules in a SoC based on a microprocessor core based on a bus architecture to form a reconfigurable SoC platform, as shown in figure 1. The applicable reconfigurable data processing architecture is often composed of processing array element (PAE), communication network packet oriented, hierarchical reconfiguration management tree (CM) and I/O module. XPP has the ability to automatically reconstruct streams and process data streams, breaking through the traditional John von Neumann instruction stream mode. Because of the high degree of regularity, it is easy to obtain instruction-level parallelism and pipeline efficiency. Figure 2. CSoC Architecture based on XPP/Leon Technical characteristics of SoPC SoPC is a special on-chip system. It is a programmable system which has flexible design mode. It can be cut, expanded and upgraded and it also has programmable functions in the development of software and hardware on-line system. It combines the advantages of SoC and FPGA, including the following basic characteristics: —Contains at least one embedded processor IP core —Small capacity on-chip high-speed RAM resources —Rich IP core resources for choice —Sufficient on-chip programmable logic resources —Shared or coexisting processor debugging interface and FPGA programming interface —May contain partially programmable analog circuits The block diagram of SoPC is shown in figure 2. In addition to the above characteristics, it also involves the software and hardware co-design technology, which has aroused widespread concern at present. Because the main logic design of SoPC is carried out in programmable logic devices, and BGA packaging has been widely used in the field of micropackaging, traditional debugging equipment, such as logic analyzer and digital oscilloscope, has been difficult to carry out direct test and analysis. Therefore, it is necessary to put forward higher requirements for software and hardware co-design technology based on simulation technology. At the same time, new debugging technology has been emerging. Figure 3. The block diagram of SoPC Technical characteristics of ASIC SoC ASIC SoC is an application-specific on-chip system, which has the characteristics of high performance, strong real-time, high reliability, low power consumption, low cost and so on. It generally has the following basic characteristics: —At least one CPU kernel. —Normative bus architecture —RAM resources (or on-chip memory access controller) —An appropriate amount of I/O equipment (including analog ones) —Extensible interfaces (such as PCI) —On-line debugging port (eJTAG) —Circuits with testability Figure 4. L*BUS Bus Architecture Diagram ASIC SoC is generally a product based on IP core or SoC development platform. It requires expertise, IP libraries, SoC bus architecture, and embedded software support (including BIOS, OS). It also requires a wide range of multifunctional IP cores and the design to integrate customer logic with it to meet customers’ needs for product development. SoC designers not only take advantage of the latest technology, but also reduce the development cycle and risk by reusing the proven IP core. At present, there are many kinds of SoC bus architecture and each of them is developed to meet the requirements of its specific application field. Some are suitable for downmarket embedded products, some are suitable for handheld products, and some are suitable for high-energy products. In a word, everyone has its own advantages. The development of SoC cannot be separated from the constraints of power consumption, performance, cost, testability, reliability, IP core reusability, platform technical support and software and hardware’s co-development. Developers need to have a strong background in computer architecture in order to support its rapid development. Classification principles of SoC SOC can be classified according to the architecture it adopts: One is the architecture based on instruction stream computing, which is typically represented by the traditional ASIC SoC. According to the control of instruction stream and data stream, this type can be divided into SISD (single instruction stream-single data stream), SIMD (single instruction stream-multiple data stream), MISD (multiple instruction stream-single data stream) and MIMD (multiple instruction stream-multiple data stream) in order to flexibly adapt to the needs of different algorithms in various applications. The second one is an architecture based on data stream computing, which only controls the input / output data of the unit. Working according to the principle of data stream, it is more efficient than instruction stream, but less flexible. Pulsating array based on data stream computing is a typical architecture of this kind. A pulsating array is an array of data path components DPU (Data Path Unit). The data streams out of the data memory according to the beat, completes the calculation through the PU array, and the result flows back to the data memory. PU arrays have only the ability to control data, which is also the origin of FlowWare. Conventional SoPC is its typical technical representative. The third is the architecture based on configuration stream computing. Using coarse-grained FPGA chip as carrier,SoC can dynamically reconstruct the hardware form of architecture design by adopting Morphwave. It can be an array of rPU (reconfigurable Processing Unit) and implemented by Configuwave. The configuration stream comes from the configuration memory called CM (reConfiguration Memory), which controls the changes of the rPU array through reConfiguration Manager and works according to the principle of data stream. CSoC is its typical technical representative. Classification model of SoC According to the classification principles of the SoC architecture mentioned above, we establish a three-dimensional classification model of CDI architecture on the basis of the concepts of instruction stream, data stream and configuration stream, corresponding to I (Instruction Stream Architecture) axis, D (Data Stream Architecture) axis and C (reConfiguration Stream Architecture) axis. And it is shown in figure 4. Any SoC with hybrid computer architecture of instruction stream computing, data stream computing and configuration stream computing can be summarized in CDI three-dimensional space. There are four basic architecture classifications on I axis: SISD, SIMD, MISD and MIMD. On the D axis, there are only two basic states: single data stream architecture and multiple data stream architecture. And there are also only two basic states on the C axis: single reconfiguration stream architecture and multiple reconfiguration stream architecture. Figure 5. CDI Classification Model Diagram Development Direction of SoC Technology Since the concept of SoC was put forward in the late 1990s, the technology has been developed rapidly. Whether it is CSoC, SoPC or ASIC SoC, all of them are gradually related to computer science, microelectronics, materials and technology, electronic communication and so on. Their interdisciplinary development provides a strong support for the technical development of SoC. Computer Science promotes the level of SoC Technology John von Neumann architecture and data stream architecture are the mainstream architectures of computers. The first one is characterized by the integration of program and data while the second one is characterized by the separation of program and data. The miniaturization of general purpose computer provides a source for the development of SoC technology. Bus Architecture Technology, Algorithm Implementation Technology, Modular Design Technology, BIOS Technology, Software Engineering Technology, Software and Hardware Debugging Technology, System Verification Technology, performance Evaluation Technology, Real-time Processing Technology, Reliability Design Technology, Human-computer Interaction Technology, Load Balancing Technology and Low-power Consumption Design Technology in computer field are all reflected in SoC design technology. It also promotes the rapid development of SoC in a few years and becomes one of the main development directions of computers in the post-PC era. Although the development of SoC technology is closely related to the development of technology and the improvement of EDA design means, its core is CPU core, bus architecture and various IP cores. In the overall performance evaluation and implementation technology, all of them are related to the computer professional field. Especially in upmarket applications, such as multi-CPU core integration and heterogeneous integration and other system requirements, computer science will continue to promote the development of SoC technology from different levels. SoC promotes the Development of computer Architecture The development of SoC technology is closely related to the market demand. The main application fields of SoC are computer, communication, consumer electronics, industrial control, transportation and so on. Communications, computers and consumers account for more than 80 percent of SoC's sales, and the proportion of consumers is growing. It can be divided into different categories if we further subdivide SoC market. For computer, there is image processing, hard disk drive, high-grade printer, personal assistant and so on. For communication, there is wired network, wireless network, mobile phone, visual equipment, communication base station and so on. For industrial control, there is process control or processing, test or instrument, medical equipment, monitoring system and so on. And for transportation, there is engine control, instrument device, safety system and so on. With the increasing scale of SoC market, it plays a more and more important role in the field of information technology and electronic products. At present, the SoC market is basically based on middle and low-grade SoC products. With the increasing demand for digital products, the demand for upmarket SoC is becoming more and more urgent. For example, in audio, video, communication and other fields, higher requirements are placed on SoC such as dual-core, quad-core and other multi-core integration. SoC will replace the traditional CPU in the middle and high grade to develop in the direction of better system performance, lower power consumption, lower cost, higher reliability and easier development in order to meet the interactive needs of people with GUI screen-centered multimedia interface and information terminals such as handwritten text input, identity recognition, voice dial-up Internet, sending and receiving e-mail, video playback, online games, videophone, language simultaneous interpretation and so on.SoC will embed enhanced processing devices such as 32-bit, 64-bit RISC chips or digital signal processing chips (DSP). At the same time, it supports the development of embedded RTOS and uses real-time multi-task programming technology and cross-development tool technology to control functional complexity to Inherit and develop computer processor technology. All of this poses greater challenges to computer architecture. Under the guidance of computer architecture, SoC will usher in a new round of technical development. It takes embedded system application as the core, integrates software and hardware, and pursues the maximum inclusiveness of product system in system integration. SoC chip design not only needs strong background knowledge of computer architecture, but also highlights the status of software development, and puts forward higher requirements for development platform and embedded operating system. It provides a broad world for computer professionals to show their skills. With the rapid development of processor / IP core design technology at home and abroad, it provides a powerful driving force for the development of computer architecture. Persisting in the development of processor core, core IP core and bus architecture with independent property rights, and ensuring compatibility, will make the development of SoC in China competitive thus driving the domestic IC industry to further develop. In order to meet the needs of industry, the of SoC designers’s in-depth researches on the architecture of configuration stream, instruction stream and data stream will also make a significant contribution to the development of computer science. SoC opens up a new world for the development of interdisciplinary disciplines SoC is a new field of technology that needs the support of many disciplines. Its development has been inseparable from the technical support from computer science, microelectronics, materials and technology, electronic communications and other fields. New technology and new products will continue to emerge and more in-depth researches on SoC are needed. At present, the development of SoC technology is mainly realized at the same process level, mainly electronic technology. However, in practical applications, higher requirements for microminiaturization and system integration technology are constantly put forward. The development of micro-systems that integrate micro-mechanisms, micro-sensors, micro-actuators, signal processing and control and communication interface circuits and energy, which can perform specific functions, has put on the agenda. MEMS, which combines microelectronics and micromechanics, will become a new basis for the development of SoC. MEMS is also a multidisciplinary frontier research field, involving electronic engineering, mechanical engineering, material engineering, information engineering, physics, chemistry, optics, biomedicine and other disciplines and technologies. The obvious advantage of system integration is to inherit and develop the benefits of various process technologies. Although the development of various processes is extremely unbalanced, SiP (System in Package) design technology can be used to integrate various integrated circuits of different processes such as CMOS circuits, GaAs circuits, SiGe circuits or optoelectronic devices, MEMS devices, and various passive components such as capacitors, inductors, etc. into a package when multiple processes are needed to coexist in the process of system integration. The implementation of more complex systems in a single package can improve packaging efficiency, performance and reliability by about 10 times, and the size and cost can be greatly reduced. The development trend of SoC technology will be the integration of SoC, MEMS and SiP, and the computer architecture will be constantly enriched and developed. SoC's CDI classification model can depict the development of system technology, meet the single chip requirements of more complex systems and promote the interdisciplinary development at the same time. Related products XC7Z100-2FFG900I XC7Z010-1CLG400I
kynix On 2016-09-08
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