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Warm hints: The word in this article is about 3000 words and  reading time is about 10 minutes.SummaryFull bridge push-pull bi-directional DC/DC converters are mostly modeled by state space averaging method with the complex modeling process. Taking the isolated form push-pull bi-directional DC/DC converter as the research object, this article adopted the pulse-width modulation switch model method to obtain the equivalent circuit model of this converter. Based on this model, this article constructed a closedloop control system of the converter under different working modes, carried out the design and verification of voltage control loop and realized the constant voltage charge-discharge control strategy. The experimental and simulation results verify the correctness of the conclusion. CoreFull bridge push-pullPurposeTo obtain the equivalent circuit model of the converterEnglish nameBidirectional DC/DC convertersCategoryElectromechanical deviceFunctionConverting a source of direct current (DC) from one voltage level to anotherFeatureAdopting the pulse-width modulation switch model method CatalogsCatalogs1. Foreword2.2 Modeling of bi-directional DC/DC converter4 Epilogue2. Principle and design2.3 Voltage Closed-loop Control and Simulation 2.1 The working principle of circuit3 Experimental result   Introduction1. ForewordBidirectional DC/DC converters have been widely applied in many fields such as electric vehicles and battery energy storage systems. Bidirectional DC/DC converters have different circuit topologies according to their applications.I have seen some examples of using Buck/Boost converter to realize the bi-directional flow of electric energy. Because there is no transformer in the converter, so the electrical isolation of the high and low voltage side can not be realized, and only a small voltage range has been allowed. In order to solve this problem, it is proposed to use isolation transformer in bidirectional full-bridge DC/DC transform circuit, but the converter uses too many switching devices and therefore causes too many power losses. The isolated full bridge push-pull bi-directional DC/DC converter has been widely used due to the advantages of both types of converters of itself.At present, the state space averaging method is used to deduce the small signal model of bidirectional DC/DC converter, which needs a large amount of mathematical derivations and calculations. In order to simplify the modeling process, the full-bridge push-pull bi-directional DC/DC converter is modeled by using PWM-switch modeling method. The transfer function between output voltage and duty cycle of the converter is obtained in two modes: boost mode and buck mode. In addition , the voltage closed loop control system is constructed based on the derived circuit model, and the voltage loop is designed and corrected by the compensation network , realizing the constant voltage control of the full-bridge push-pull bidirectional DC/DC converter.First step in developing feedback control for a dc-dc converter is modeling. Here, we model the buck converter in terms of average behavior. Detail2. Principle and design2.1 The working principle of circuitFigure 1 shows the topology of the main circuit of full bridge push-pull bi-directional DC/DC converter. ^The power switch tubes S1～S4  are arranged in the form of a full-bridge circuit;^the power switch tubes S5～S6 are arranged in the form of a push-pull circuit;^CHV is a parallel capacitor with HVDC busbar;^CLV is a parallel capacitor with LVDC busbar;^L is a  low-voltage-side energy storage filter inductor;^HV is high-voltage-side DC bus;^LV is a low-voltage-side DC bus.Figure 1 Main circuit of bidirectional DC/DC converterFigure 2 and 3 respectively give the schematic diagrams of the PWM driving waveform of the power switch tube working in boost and buck mode, and the schematic diagram of the voltage waveform of the primary and secondary sides of the transformer. The u12 shown in the diagram is the transformer primary-side voltage and the u34 is the transformer sub-side voltage.Figure 2 Waveforms of the  power switch tube working in boost modeFigure 3 Waveforms of the  power switch tube working in buck mode2.2 Modeling of bidirectional DC/DC converterThe basic idea of PWM-switch modeling method: the nonlinear part will be linearized by taking an average value of the voltage and the current of it in one switching period when it is a stable circuit, and therefore the nonlinear circuit will turn into a linear circuit. The push-pull bidirectional DC/DC converter working in the buck mode can be equivalent to the circuit shown in Fig. 4 (the circuit in the dashed box is meant to indicate the nonlinear circuit), which turns on during [0, DTs] and turns off during [DTs, Ts], where Ts is the switching cycle and D is the duty ratio of the full bridge push-pull bi-directional DC/DC converter turn on. In the mathematical expressions presented in this article, all the uppercase variables represent the steady-state values, and all the lowercase variables represent the instantaneous values.Figure 4 Conducting circuit in buck mode operationIn the equivalent circuit shown in figure 4, the voltage and current are averaged during a PWM switching cycle, among which idc is primary instantaneous current and iL is secondary instantaneous current of transformer; iC is instantaneous current of electric capacity CLV; ucp is the instantaneous voltage between nodes c and p; uap is the instantaneous voltage between nodes a and p; n is the transformation ratio.Assuming that the duty cycle is d=D, now add an AC small signal to its value attachment (where small angle brackets denote AC small signals and the other variables following are the same), the complete instantaneous value expression for duty cycle is as shown in formula 3:Then substituting equation 3 into the original yields equation 1 and 2, so we have:Neglecting the product term of AC small signal, and equation 4 and 5 of  AC small signal can be simplified as equation 6 and 7:The mathematical relations of voltage and current working in steady state (following yields equation 8 and 9) derived from original yields equation 1 and 2, along with equation 6 and 7 can be used to obtain equivalent circuit model of bidirectional DC/DC converter in Buck mode (see the two-port circuit shown in the dashed box of figure 5). The model is linear since the constraint equations describing the two-port circuit are all linear equations. It can be learned from the above modeling process that the linear model of the full bridge push-pull bidirectional DC/DC converter can be easily established by using the switching model modeling method, which has the advantages of less calculation and simple derivation. It can be learned from the above modeling process that the linear model of the full bridge push-pull bidirectional DC/DC converter can be easily established by using the PWM-switch modeling method, which has the advantages of less calculation and simple derivation.The equation 10 gives transfer function between the output voltage and duty cycle of low voltage side bus according to laws of KCL and KVL.Figure 5 gives the equivalent circuit of bidirectional DC/DC in Buck mode obtained from equation 10, among which UHV is the operating voltage of high voltage side bus in steady state, uLV is the instantaneous voltage of low voltage side bus, n is the transformer ratio, R is the load resistance of low-voltage-side DC bus, Uap/D can be regarded as controlled voltage source, and IL/n can be regarded as controlled current source.Figure 5 Small signal equivalent circuit in Buck mode operationThe transfer function between duty cycle and output voltage in Boost mode can be obtained by using the same analysis method as Buck mode, which has shown in equation 11. R1 is the load of high voltage side bus.2.3 Voltage Closed-loop Control and SimulationFigure 6 gives the block diagram of the closed loop control system of small signal circuit model of the full bridge push-pull bidirectional DC/DC converter in two different operating modes. Charge and discharge at constant voltage in two modes can be realized by voltage closed-loop control.What we can see from figure 6:Uref is the given voltage of high-voltage-side and low-voltage-side DC bus; Hv(s) is the transfer function of sampling; Gm(s) is the transfer function of PWM; Gcv(s) is the transfer function of PI of voltage control loop; Gvd(s) is the transfer function of voltage versus duty cycle.Figure 6 Block diagram of voltage closed loop controlTo theoretically verify the correctness of mathematical model establishment and the feasibility of voltage control strategy, we use the PSIM 9.0 software tool for simulation and analysis in this article. Figures 7 and 8 have respectively shown the simulated waveforms in different operating modes. In Buck mode operation, the voltage of low voltage bus can be stabilized at 12V, so the constant voltage charging has been realized; and in Boost mode operation, the voltage of high voltage bus can be stabilized at 400V, so the constant voltage discharge has been realized, which theoretically verifies the correctness of mathematical model establishment and the feasibility of voltage control strategy. u12 and u34 are the voltages of the primary and secondary sides of the transformer respectively, uHV and uLV are voltages of high-voltage side and low-voltage side bus.Figure 7 Simulated voltage waveform in boost mode operationFigure 8 Simulated voltage waveform in buck mode operation Analysis3 Experimental resultIn order to verify the correctness of the small-signal circuit model and the feasibility of voltage feedback control, we built an experimental platform of full-bridge push-pull bi-directional DC/DC converter using TMS320F28035 as the core control chip.Table 1 gives the main circuit parameters of the bidirectional DC/DC converter based on the full bridge push-pull circuit structure.Table 1 Basic circuit parameters of converterFigure 9 gives the output voltage waveform of secondary voltage and low-voltage-side DC bus of transformer in buck mode operation when steady input voltage of high-voltage-side DC bus is 400V (provided by programmable DC power supply) and load resistance of low-voltage-side DC bus is 0.1Ω (provided by programmable DC electronic load). Here the output current of low-voltage-side DC bus iL is stable at about 120A, the output voltage uLV is about 12V, and the output power of low-voltage-side bus Po is about 1.5kW which meets the requirement of rated power designed, now we have realized  the constant-voltage charging of low-voltage-side DC bus.Figure 9 The voltage waveform in Buck mode operationFigure 10 gives the output voltage waveform of primary voltage and  high-voltage-side DC bus of transformer in boost mode operation when steady input voltage of low-voltage-side DC bus is 12V (provided by low-voltage DC power supply) and load resistance of high-voltage-side DC bus is 105Ω (provided by high voltage resistance load box). Here the output current of high-voltage-side DC bus iH is stable at about 3.7A, the output voltage of high-voltage-side DC bus uHV is stable at about 400V, and the output power of high-voltage-side bus Po is about 1.5kW which meets the requirement of rated power designed, until now we have realized  constant-voltage discharge of high-voltage-side DC bus.Due to the high level at the output, technical problems in the winding process for power transformers and the whole experimental device completing by manual welding, the rate of heat dissipation of power transformer appears to be somewhat low and the parasitic inductance and inductive coupling is also rocking the boat, and then we see the voltage waveform oscillation at zero crossing of transformer voltage in Boost mode moderation. However, under the condition of steady state parameters, this experimental platform can work normally and stably for a long time according to the design requirements and can meet the needs of practical applications.Figure 10 The voltage waveform in Boost mode operationFigure 11 is a schematic diagram of the hardware platform which is mainly composed of main circuit board, control circuit board and corresponding test equipment.Figure 11 physical photographs of experimental devices4 EpilogueAccording to the characteristics of bidirectional DC/DC converter applied in fields of battery and electric vehicle energy storage management, a bidirectional DC/DC converter based on full-bridge push-pull topology is obtained by comparing with different circuit topologies. Different from the traditional state-space average modeling, the method of PWM-switch modeling is used now to build small signal equivalent circuits in different mode operations, and the voltage loop has also been designed and corrected. The high-power constant voltage charging is realized in Buck mode moderation and the high-power constant voltage discharge is also realized in boost mode operation. Both modes can work normally and stably to meet the performance requirements of practical applications, which appear to be in high value at fields of battery and electric vehicle energy storage management. Book SuggestionSoft-Switching PWM Full-Bridge Converters: Topologies, Control, and DesignJun 23, 2014This book intends to describe systematically the soft-switching techniques for pulse-width modulation (PWM) full-bridge converters, including the topologies, control and design, and it reveals the relationship among the various topologies and PWM strategies previously proposed by other researchers. The book not only presents theoretical analysis, but also gives many detailed design examples of the converters.---by Xinbo RuanPower Electronics: Converters and RegulatorsOct 28, 2016This book is the result of the extensive experience the authors gained through their year-long occupation at the Faculty of Electrical Engineering at the University of Banja Luka. Starting at the fundamental basics of electrical engineering, the book guides the reader into this field and covers all the relevant types of converters and regulators. Understanding is enhanced by the given examples, exercises and solutions. Thus this book can be used as a textbook for students, for self-study or as a reference book for professionals.---by Branko L. Dokić and Branko BlanušaPulse-Width Modulated DC-DC Power ConvertersOct 26, 2015With improved end-of-chapter summaries of key concepts, review questions, problems and answers, biographies and case studies, this is an essential textbook for graduate and senior undergraduate students in electrical engineering. Its superior readability and clarity of explanations also makes it a key reference for practicing engineers and research scientists. Following the success of Pulse-Width Modulated DC-DC Power Converters this second edition has been thoroughly revised and expanded to cover the latest challenges and advances in the field.---by Marian K. Kazimierczuk Relevant information "Modeling and Control of Full Bridge Push-Pull Bi-Directional DC/DC Converter"About the article "Modeling and Control of Full Bridge Push-Pull Bi-Directional DC/DC Converter", If you have better ideas, don't hesitate to  write your thoughts in the following comment area. You also can find more articles about electronic semiconductor through Google search engine, or refer to the following related articles:How to Learn Analog Circuit DesignLook Forward to the Future of Semiconductor

Warm hints: The word in this article is about 3500 words and  reading time is about 15 minutes.   Based on the heat balance principle, the basic theory for the calculation of steady and transient temperature rise of transformer is discussed.   The calculation of transformer temperature rise is mainly used to make sure that the steady-state temperature rises produced by the transformer with rated load in long-term continuous operation will not exceed the limit specified in the standard or technical contract. In addition, the data of overload operation capacity of transformer running under various rated loads are also used to offer support to the measures taken to ensure safe overload operation of electrical systems.   However, from the author's current reading of recent info on transformer principles, design, and calculation theories available, it may be due to the limitation of space or different aspects of emphasis that they are always making an introduction to various practical formulas for transformer temperature rise calculation in a practical way. As to the involved thermal principle of calculating the transformer temperature rise is always a bit of an oversimplification I think, especially the thermal analyses demonstrating how heat energy be absorbed(or dissipate) and the temperature goes up(or goes down) during a heating process. In this article, therefore I would like to make some theoretical discussions to solve this problem and add some extra explanations needed.   Catalog   I. Brief Introduction II. Heating & Cooling Process 2.1 Heating process when the thermal power is constant 2.2 The cooling process in which the heated body is no   longer supplied with heat 2.3 Just as same as the situation of 2.1, but Τ≠0 when   t=0 III. Further Analysis of Some Formula 3.1 Mechanism of temperature-rising process of heated   body 3.2 Properties and applications of Τu in formula 2 3.3 Definition, function and derivation of the thermal   time constant Τ IV. Conclusion FAQ I. Brief Introduction   It is well known that heat is always transferred automatically from a high-temperature object to a low-temperature object. Heat can transfer (or move) in three ways: conduction, convection, and radiation, usually a combination of two or three of them may cause the transmission (also known as heat dissipation).   Before formally describing this section, I would like to quote two conclusions from laboratory research that are fundamental to thermal science:   1) the temperature rise of an object is directly proportional to the heat (heat) supplied by the outside world and inversely proportional to its own mass and Specific Heat Capacity.   2) the heat energy (calorific energy) that a heating object disperses into a cooler object(cooling medium) within a unit of time is directly proportional to the area of its radiating surface, the temperature difference, and the Heat Transfer Coefficient between the heating object and cooling medium.   Specific heat capacity: the ratio of the heat added to (or removed from) an object to the resulting temperature change per unit mass of material.   Heat transfer coefficient: when the temperature difference between the heating object and the cooling object is 1K, the heat from the unit dissipation surface area to the cooler object within a unit of time.   For the convenience of discussion, the heating object is referred to as the heated body in this paper, and the object which gets the heat released from the heated body is called the cooling body (or the cooling medium).   Take a dry transformer, for example, its winding and core are heating bodies, and the cooling body refers to the air around the transformer. For oil-immersed transformers, in addition to the winding and core known as heating bodies, the oil-filled in the transformer can also be called a heating one in relation to ambient air or cooling water. However, relative to the winding and core, oil is also called a cooling body(cooling medium).   Fig. 1 Transformers are found everywhere alternating current is used   II. Heating & Cooling Process   2.1 Heating process when the thermal power is constant Suppose that in the heating process (that is, the heat is still in a transition state, not reaches a stable state yet), the temperature rise by Τ relative to the cooling medium, the temperature rise increases dΤafter a tiny time unit dt.   The heat supplied by the outside during this dt period is a constant thermal power of Pdt(P. For windings in oil-immersed transformers, it refers to load loss; for oil, it refers to total loss). Let the heat supplied by the outside surroundings during this dt period be Pdt(P is the constant thermal power; for windings in oil-immersed transformer, P refers to load losses, and for oil, the total losses). Some of the Pdt is the heat absorbed when the temperature rise of the heated body increases by dΤ, and the other part is dispersed into the cooling medium.   In order to understand the nature of this physical phenomena in the heating process better, suppose the heated body is an isothermic one, therefore the density, specific heat capacity, and any other parameters being the same, including the heat dissipation capacity of each point on the surface.   According to the principle of thermal balance (it comes down to the law of energy conservation), the states of the heating process described above can be represented by the following equations:   Where   P——Constant value of thermal power c——Specific heat capacity of the heated body G——the mass of the heated body F——Heat dissipation surface area of the heated body k——Heat transfer coefficient  Τ——Temperature difference (or temperature rise) between the heated body and cooling body at a certain time   The first item on the right of Equation (1) indicates the heat energy absorbed by the heated body when it increases the temperature of dΤ; The second item indicates that the heat energy is dispersing to the cooling body while the heated body is storing heat.   When the temperature rise of the heating body does not go up, that is, when the temperature rise reaches a stable state, then there is dΤ=0 and Τ=Τu (Τu means the steady-state temperature rise).   At this point, from formula (1) there is:   According to the above analyses we can see: formula (1) is the mathematical expression of the heat balance principle under the transient state; formula (2) is the mathematical expression of the heat balance principle under steady-state.   From Formula (1) and Formula(2) we can get a first-order differential equation of Τ:   Where: From formula (4), the parameters on the right side of the equation are the physical parameters of the object itself, so Τ is a constant and has a dimension of time, so it is called the thermal time constant. In the physical sense, Τ is the ratio of the heat storage capacity of the heated body to the heat dissipation capacity per unit time of the heating system studied, which is an attribute of the heated body. Therefore formula (4) is considered to be the definition of Τ and the formula (4') is another expression for calculation.   To obtain the solution of formula (3) we let t=0 and Τ=0, then this is what we get:   Note that sometimes it is easier to express the formula (5) with temperature θ instead of temperature rise Τ, so it is reworded as follows: Where:   θ——The temperature of heated body at any given moment and there is θ-θа=Τ θа——The temperature of cooling body θu——The steady state temperature of the heated body that reaches a steady state Δθu——θu-θа=Τu   The rising curve in Fig. 1 shows the temperature rise of heated body changes with time t.   In order to visually see how the Τ changes with the temperature rise, Fig. 1  shows two curves with different Τ and same Τu. Fig. 2 Relation between temperature-rise(Τ)of heated body and time(t) As can be seen directly from formula (5), formula (5') and Fig. 1, the process of temperature rising of a heated body is characterized by the fact that it changes fast at the very start, then gradually slows down, and when the time t becomes equals to (4～6)Τ, it remains almost unchanged, at this point it can be assumed that Τ reaches Τu (theoretically t reaches ∞).   2.2 The cooling process in which the heated body is no longer supplied with heat   When the temperature rise of the heated reaches Τu and no heat will be emitted, the temperature rise begins to go down from Τu to zero, which we call the cooling process. At this point, its transient process equation can still be deduced by formula (1), in which you need only to let P be equal to zero.   Therefore the first-order differential equation of its temperature rise is as follows:   The solution is: All the symbols of parameter in the formula above are identical with those in formula (5), except that Τu is the initial value of temperature rise when t=0; when (4～6)Τ later, Τ≈0.   Why would we worry about Formula 6?    This is because the temperature rise of winding got at the end of the current transformer temperature rise test, is still the value of temperature rise calculated through measurements of the resistance value of the winding which will change with the temperature. The resistance value measurement is still carried out in the temperature rise test under a way of supply voltage been removed, thus the formula (6) should be used to calculate.     2.3 Just as same as the situation of 2.1, but Τ≠0 when t=0 When the heating body is supplied with constant heat power and Τ=Τ0 (≠0) when t=0 satisfied, the whole process of deduction of temperature rise calculation, with the exception of the situation of Τ=Τ0 when t = 0, is the same as 2.1, in other words, the formula of temperature rise can still be deduced from formula (5) as follows: Comparing this with the formula (5) we notice that there is a new second item occurs. Considering the physical meaning of the expression is not obvious enough, it is now rewritten (which will not change the result of the calculation) as: These two formulas above show a case that the transformer is suddenly asked to conduct a overload operation running beyond the steady load.   III. Further Analysis of Some Formula   3.1 Mechanism of temperature-rising process of heated body Formula (5) and Fig. 1 describe the rising process of heated body temperature from a mathematical point of view. This process is characterized by a rapid start and then a gradual slow down until it finally stops rising and reaches a stable temperature rise of Τu .   In this section, characteristics of heating and cooling mechanism in this process will be described from a physical point of view. So we divide the t into n small and equal time periods when t=Τu, that is Δt1=Δt2=……=Δtn=Δt (theoretically t=∞, but in practice, it is desirable to suppose that t=(4～6)T, considering the value required of Tu with a higher accuracy). Therefore, the derivative symbol "d" in this article is replaced with a increment sign "Δ".   Please note that the heat energy supplied by surroundings in each time period is equal to P·Δt (P is the constant thermal power).   Now let us take a look in the first time period Δt1. Since the temperature of heated body has already made be equal to the cooling body when t=0, that is Τ=0, according to the second item of formula (1), we can assume the heat energy emitted is also equal to 0 during the period of Δt1 until the end of present stage. Therefore, during the Δt1 period, the final increments of the temperature rise of the heated bodyΔΤ1 is determined by the total external heat energy (P·Δt). So the temperature rise at the end of first time period Δt1 is Τ1=ΔΤ.    According to the same analytical principle, we continue with the second time period Δt2. Since the initial temperature rise at the beginning of Δt2 is the that of the first time period Δt1, it can be included that Τ1=ΔΤ1. The heat emitted during Δt2 is no longer zero, but . At the end of the Δt2, the increment value of temperature rise of heated body ΔΤ2 is determined by , so there we have ΔΤ2<ΔΤ1 (That is, the increment of temperature rise in the second period is smaller than that in the first period).   Finally, at the end of the second time period Δt2, the temperature rise Τ2 is equal to ΔΤ1+ΔΤ2. The rest may be deduced by analogy, at the end of Δtn time period, the temperature rise is , also ΔΤn=0 has been illustrated at the same time.   According to the changes of temperature increment ΔΤn in each of time period above, there always are: ΔΤ1>ΔΤ2…>ΔΤn-1>ΔΤn (ΔΤn=0), therefore demonstrating the trend that all the heat absorbed by heated body in each time period gradually goes down from P·Δt absorbed in the time period of Δt1 to 0 absorbed in the time period of Δtn. The heat energy emitted in each of the corresponding time periods is gradually increased from 0 to (from the first time period Δt1 to the end of the NO.n time period Δtn). That also means the final temperature rise (steady temperature rise) is: After the temperature rise reaches the stable value of Τu, the heated body no longer absorbs external heat energy, which indicates that all the external heat energy has been dispersed to the cooling body.   3.2 Properties and applications of Τu in formula 2 Formula 2 is a theoretical formula derived from the heat balance principle for calculating the steady-state temperature rise of the heated body. It is difficult to calculate the temperature rise directly for complex heated bodies such as transformers.   Therefore, various manufacturers and scientific research institutions have respectively obtained many practical formulas, according to their own practical experience or scientific research results and the characteristics of the heated body structure and three different heat dissipation forms, including conduction, convection, and radiation.   Furthermore, a heated body such as a transformer having a complex structure does not always have the characteristics of the homogeneous isothermal body assumed in formula 2, and the heat-dissipation capability at each point on the surface is not equal, either.   Therefore, the steady-state temperature rise (Τu) calculated from formula 2 (including the relevant practical formula based on formula 2) on the whole indicates the average value of temperature rise at different points in the heat source.   The calculation of the maximum temperature rise (temperature) of an object at a "hot spot" of concern has so far could only be mainly estimated by experience and the use of temperature rise measurements in certain heaT tests (for example, confirming the difference between the maximum temperature rise and the average value or confirming the multiple values between them to estimate).   3.3 Definition, function and derivation of the thermal time constant Τ Formula 4 is the definition expression of thermal time constant. It is obtained in the derivation of formula 5 from formula 2 and formula 1. Therefore, it is possible to think that equation 4 is obtained under the admission that when t=∞ it has dΤ=0 and Τ=Τu, the latter of which is obtained under the boundary conditions of objective reality. Because the definition of "Τ" and some functions have been described in section 2.1, here i only do some additional analyses to formula 7 which shows applications of transformer temperature rise under a short-time overload operation. Fig. 3 What is a Transformer   The basic theory of transformer and working principle of transformer   Fig. 4 Large power transformers have their core and windings submerged in an oil bath to transfer heat and muffle noise, and also to displace moisture which would otherwise compromise the integrity of the winding insulation. Heat-dissipating "radiator" tubes on the outside of the transformer case provide a convective oil flow path to transfer heat from the transformer's core to ambient air.   First of all, according to the statistics of a large number of dry and oil-immersed power transformers with different capacities, which have been manufactured at home and abroad, the value of Τ is generally not less than 1h (for oil-immersed transformer, although the T of winding is quite low, about 5 min-20 mins, the T of oil is 1h～5h.    Noting that the oil actual temperature rise is generally not lower than the temperature difference between the winding and the oil and that the thermal time constant of the oil should therefore be considered to control the temperature rise of the winding during the overload operation, that is, the temperature difference between winding and ambient air or temperature of cooling water still plays a decisive role.    Although the Τu of the transformer will obviously exceed the temperature rise limit of rated-load operation, as long as the time t has been controlled within T, it can still make the actual temperature rise running in short-time overload not excess the temperature rise limit of short-time overload operation. These permissible limits, according to the standard of the load guide of the oil-immersed power transformer, is related to the operation type within nameplate capacity, namely, normal periodicity, long-term or short-term emergency, and generally higher than that of rated temperature rise.   It can be seen from this that the function of the thermal time constant T is relatively large, so it is necessary to pay close attention to its definition, various affecting factors, and derivation of its formula. However, I have seen some people added another boundary condition except dΤ=0 during the derivation of the expression of Τ: in extreme cases, the heat will not be transferred into the surrounding medium at all, which is also called "adiabatic condition". In this regard, I would like to put forward the following different views for discussion.   (1) In this article, the derivations of formula 4 and formula 5 have only used a "boundary condition" of dΤ=0 (Τ=Τu) when t=∞, so there is no need to add another adiabatic condition for derivation.   It is said that without heat dissipation, the time required to reach a stable temperature is called time constant (Τ), but that will only be true when the second item (dissipated heat) on the right of the equation meets a condition of , now that to reach a steady temperature Τ must be equal to Τu, which is at variance with objective reality of electric accessories including transformers.   Some might say that when people calculate the temperature of a transformer at a short-circuit current, don't they also use the formula obtained under the "adiabatic condition" to calculate the temperature of the transformer? Yes, but the case being considered is only the "short time" one, that is, the formula only applies when short-circuit durations never exceed 10s (actually 2s).    The time is very small compared with the thermal time constant of winding in oil-immersed power transformer (about 5min-20mins) and that of oil (about 1lh～5h). This is still true when compared with the thermal time constant of the windings of dry-type transformers (about or above 30min). In section 3.1 of this article, such a short duration makes it is possible to consider it as an adiabatic transient system. In a broad sense, if the heat energy emitted accounts for only a very small part of the heat supplied by the outside world during a same period, it can be roughly regarded as adiabatic process. At this point, it is precisely because of the recognition of  that it is in line with objective reality.   This proves that adiabatic conditions should not be used as the basis in the derivation of expression of Τ (formula 4) and that of transient temperature rise (formula 5).   (3) From the details of the derivation process in this article, I would like to say that the true expression of temperature rise of the heated body still has not been obtained yet in the end. Think about that, a task for you, my readers.   IV. Conclusion   (1) Starting from the principle of heat balance, this article expounds the model of the heating mechanism in the rising process of temperature rise of the heated body with concise mathematics and physical language.   (2) It is clearly pointed out in this paper that the steady temperature rise of the heated body can be calculated by using formula 2, and formula 5 and formula 7 are the formulas for calculating the temperature rise of the heated body during the transient process.   (3) It is pointed out that to obtain the expression of the transient temperature rise of the thermal time constant Τ and the heated body, the adiabatic condition should not be used for the process of derivation, which is not necessary either.   (4) Due to space constraints, this article has not covered the heat dissipation mechanism of heated body, but you readers can refer to other references about heat loss or transfer in Kynix and other sites.   FAQ   1. How hot is too hot for a power transformer? Transformers designed with high-temperature insulation systems can run safely at temps up to 200°F. But remember, a hot-running transformer is an angry transformer.    2. What is ambient temperature of transformer? The average ambient temperature for a transformer over a 24 hour period should not exceed 30 degrees Celsius. For instance, if the transformer ambient temperature was 40 deg. C for 12 hours, then the transformer must not exceed 20 deg.   3. Should doorbell transformer be hot? Transformers are always going to produce some heat. It's a part of the step-down process. It should only be warm to the touch, however.   4. What is maximum ambient temperature? In general, a safe range is between 60 and 75 degrees Fahrenheit or 15 and 25 degrees Celsius, although the cooler end of that range is better. Ambient temperatures above those ranges make it difficult for a computer's cooling system to keep it at a safe operating temperature.   5. What is the name of oil used in transformer? Mineral oil and Synthetic oil are the majorly used transformer oil. These are the petroleum products, like Naphthenic based transformer oil and Paraffinic based transformer oil. Naphthenic based transformer oils are known for their heat distribution, which is one of the main problems with transformer.   6. What will happen if the regulation of a transformer is poor? If the transformer supplies a very low lagging power factor, large secondary currents will flow resulting in poor voltage regulation due to greater voltage drops in the winding. ... Therefore positive regulation produces a voltage drop in the winding while a negative regulation produces a voltage rise in the winding.   7. What is high transformer temperature? Standard Ratings and Overload Capacity：Dry-type transformers are available in three standard temperature rises: 80C, 115C, or 150C. Liquid-filled transformers come in standard rises of 55C and 65C. These values are based on a maximum ambient temperature of 40C.   8. What is hot spot temperature in transformer? Modern transformers make use of thermally upgraded paper that has been chemically treated to improve the stability of cellulose structure. The rated hot spot temperature for this kind of paper is 110°C and it can be seen that an increase of 7°C will double the aging acceleration factor.   9. How much heat does a 75 kVA transformer give off? According to Cutler-Hammer, a 75-kVA, 150°F-rise, dry-type transformer has an efficiency of 97.2% at 1/4 load and 96.7% at full load. So, figure 3% loss at 75 kVA, which would represent 2,250 W.   10.What happens when transformer is overloaded? The weakening of the system will happen faster if the transformer is frequently overloaded. The net result of small, incremental increases in loading capacity over time is a weakened insulation system. Overloading causes overheating, and eventually thermal degradation that acts thrrough cracks in the insulation.   You May Also Like: Some suggestions about protecting transformers Learn Some Basic Knowledge about Capacitor Voltage Transformer  

Warm hints: The word in this article is about 3000 words and reading time is about 15 minutes   This article is mainly talking about how to design better electromagnetic compatibility if LCD. Electromagnetic compatibility (EMC) is an inevitable issue in the design of LCDs. If the EMC design is not good, it will cause water ripples and strobe flash problems during the broadcast of the TV. EMC design is actually optimized for the electromagnetic interference generated in the product to meet the EMC standards of countries or regions. It is defined as the ability of a device or system to function properly in its electromagnetic environment and does not constitute unacceptable electromagnetic interference (EMI) to anything in the environment.       Catalog I. Brief Introduction II. Power Module EMC Design III. Main Drive Board EMC Design IV. Tuner Board EMC Design V. Whole Machine EMC Design FAQ   I. Brief Introduction Electromagnetic interference is generally divided into conducted interference and radiation interference. Conducted interference refers to the coupling interference of signals on one electrical network to another electrical network through conductive media. Radiated interference means that the interference source couples (disturbs) its signal to another electrical network through space.   The LCD structure mainly includes a liquid crystal display module, a power supply module, a drive module (mainly including the main drive board and a tuner board), and a key button module. General liquid crystal display modules have been tested by EMC before production. Here mainly introduces the design of the power module, drive module, button module, and the whole machine should pay attention to the electromagnetic interference problem.   EMI (ElectroMagnetic Interference) & EMC (Electromegetic Compatibility)   II. Power Module EMC Design The two main functions of the power supply section are to realize the backlight for driving the LCD screen and to provide DC power for other modules (including the drive module and the button module).   The design of the power module directly affects the entire system. If the design is not good, it will cause large water ripples in the TV. In severe cases, the TV will not be used. At the same time, it will seriously affect the normal use of other nearby equipment.   The power supply of LCDs is based on switching power supplies. The causes of electromagnetic interference problems caused by switching power supplies are complex. When designing the switching power supply, it is necessary to prevent the switching power supply from causing interference to the power grid and nearby electronic equipment. It is also necessary to strengthen the adaptability of the switching power supply itself to the electromagnetic interference environment.   To solve the EMC problem of switching power supplies, the following main measures should be taken into consideration during design:   Soft-switching technology: Inrush current and peak voltage are generated when the switching device is turned on/off. This is the main reason for electromagnetic interference and switching loss in the switch. Soft switching technology is an important method to reduce the loss of switching devices and improve the EMC characteristics of switching devices. This technology is mainly to switch the switching tube in the switching power supply at zero voltage and zero current to effectively suppress electromagnetic interference.   Modulation frequency control: Electromagnetic interference is changed according to the switching frequency, and the interference energy is concentrated on the discrete switching frequency point, resulting in large interference intensity. By distributing the energy modulation of the switching signal over a wide frequency band, a series of discrete sidebands are generated. This spreads out the interference spectrum, and the interference energy is distributed on the discrete frequency band, thereby reducing the electromagnetic interference intensity at the switching frequency point.   Component layout and routing: The components associated with the power input signal and output signal are placed near the corresponding ports to avoid interference due to the coupling path. Put components that are related to each other together to avoid interference caused by long traces.   Also, try to avoid parallel routing of signal lines. If unavoidable, try to increase the line spacing. Or add a ground wire in the middle to reduce the interference between each other.   III. Main Drive Board EMC Design The main driver board of the LCD mainly includes an analog signal portion, a high-speed digital circuit portion, and a noise source DC-DC power supply portion.   Component layout and routing: In the layout, the three parts of the analog signal part, the high-speed digital circuit part, and the noise source DC-DC power supply part should be reasonably separated so that the signal coupling between them is the minimum. In terms of device placement, the principle of associating the devices with each other is as close as possible, so that a good anti-noise effect can be obtained.   DC-DC Power Supply Part and Ground: On printed circuit boards, the power line and ground are the most important. Let analog and digital circuits have their own power and ground paths, respectively. The main means of overcoming electromagnetic interference is grounding.   On the driving board of the LCD, the ground of the power supply section (DC-DC) is mainly separated from other grounds such as the decoding and main chip processing, so as to reduce interference of the power supply on the image display and the television sound.   If there are analog ground and the digital ground when designing the circuit, they should be separated when the printed board is laid. To reduce mutual interference. In the layout of double-layer boards and multilayer PCBs, one layer of copper foil is generally used as a dedicated ground plane. The purpose of this is that this ground serves as a shield.   Integrated chip: In the same integrated chip, the ground is also separated from the analog ground and the digital ground. For example, the AD9883 analog-to-digital conversion chip of the AD company, which is often used as the main driver board of the LCD, can be floor-separated between the ground and digital sections of the analog section of the chip during the PCB design. Finally, connect the two points by a relatively short wire. Or connect the two places with a 1nF bypass capacitor.   Crystal oscillator: The clock circuit in the digital circuit is one of the main electromagnetic interference sources in current electronic products and is the main content of EMC design. Crystal is a strong source of radiation. The internal circuit of the crystal generates a large RF current, so that the ground lead of the crystal cannot sufficiently draw a relatively large Ldi/dt current to the ground plane with little loss, and as a result, the metal housing becomes a monopole antenna. The periphery of the crystal is a radiation field.   Therefore, the crystal oscillator circuit is far away from the interface circuit, such as serial port, address line, and data line. In order to avoid the interface circuit bringing the harmonic signal of the crystal out of the printed circuit board to cause electromagnetic interference. Two legs of the crystal oscillator must be added with an RC filter circuit. At the same time, be sure to connect the metal shell of the crystal to the ground on the printed board. In addition, the crystal is placed as close as possible to the chip pins. The ground is used to isolate the clock area, placing a local ground plane and connecting it to the ground through multiple vias.   Capacitance decoupling: Capacitance decoupling is used to reduce electromagnetic interference. Capacitor decoupling can be divided into three types: overall, partial, and inter-board.   The overall decoupling capacitor operates at low frequencies, providing a stable voltage and current for the entire board. It should be placed close to the printed circuit board power cord and ground. The typical decoupling capacitor value is 0.1μF. The typical value of the distributed inductance of this capacitor is 5μH. The 0.1μF decoupling capacitor has 5μH distributed inductance. Its parallel resonant frequency is about 7MHz. That is to say, it has a better decoupling effect for noise below 10MHz, and it has almost no effect on noise above tens of MHz. So for noise above 20MHz, use a 0.01μF capacitor decoupling.   The local decoupling capacitor makes the supply voltage obtained by the integrated circuit more stable; in addition, the high-frequency noise of the device is bypassed.   The decoupling capacitance between boards refers to the capacitance between the power plane and the ground plane and mainly solves the high-frequency transient current generated in the power supply. A 10~100uF electrolytic capacitor is connected across the input of the power supply. If the position of the printed circuit board is allowed, the anti-interference effect of the electrolytic capacitor with 100uF or more will be better. The lead of the decoupling capacitor can not be too long, generally close to the integrated circuit power supply, the connection should be rougher.   Bead filtering: Bead filtering is applied to all signal inputs (such as YPBPR and VGA) on the motherboard. Magnetic beads are designed to suppress high-frequency noise and spike interference on signal lines and power lines, and also have the ability to absorb electrostatic pulses. It acts as a high-frequency resistor, which attenuates high frequencies. The device allows the DC signal to pass and filter out the AC signal.   When selecting beads, you must pay attention to the following factors:   1. What is the unwanted signal frequency range? 2. Who is the noise source; 3, how much noise attenuation; 4. What is the environmental condition (temperature, DC voltage, structural strength); 5. What is the circuit and load impedance? 6. Is there room to place beads on the PCB board?   The first three can be judged by observing the impedance frequency curve provided by the manufacturer. The three curves in the impedance curve are very important, namely the resistance R, inductive reactance X, and total reactance Z. As shown in Figure 1:     Figure 1: Impedance curve and equivalent circuit topology that reflect the bead resistance, inductive reactance, and total inductance   The total impedance is described by the following formula (1):   Z=(R + 2πFL)   From this curve, beads are selected that have the maximum impedance in the frequency range where attenuation of the noise is desired, and where the attenuation of the signal is as small as possible at low and DC.   Chip beads can affect the impedance characteristics under excessive DC voltage. In addition, if the operating temperature rises too high or the external magnetic field is too large, the impedance of the beads will be adversely affected.   Whether using chip beads or chip inductors is also mainly in applications. Chip inductors are needed in the resonant circuit. When it is necessary to eliminate unwanted electromagnetic interference noise, the use of chip beads is the best choice.   IV. Tuner Board EMC Design The tuner board mainly includes a tuner section and an audio processing section.   When conducting the circuit design of the tuner board part and the layout of the PCB board, it is necessary to pay special attention to the electromagnetic interference problem. The following points must be considered:   （1）First, separate the land of the TUNER section (ie the simulated ground) from the land of the other sections. （2） Be sure to connect the metal shell of TUNER to the ground. The connection points can better eliminate electromagnetic interference. The tuner TUNER inherently has a high-frequency circuit, so it must be shielded. （3）When selecting the interface terminals (such as AV terminal, S-VIDEO terminal, etc.), try to use terminals with good conductivity and strong anti-electromagnetic interference, and also connect the ground of the interface terminal with the earth completely. At the same time also added magnetic beads filter. （4）The signal line should be as short and straight as possible. If it cannot be avoided, fly line transitions can be used. Signal lines should not form a ring. Because the ring is equivalent to the number of turns of the coil, the radiation effect of the ring wiring is the strongest. （5）Try to reduce dead copper in large areas. The solution is to connect them to the ground. If a large area of dead copper forms the antenna, electromagnetic interference will be introduced. （6）Do not run under quartz crystals and under noise-sensitive devices.   The audio processing section should pay special attention to the layout of the printed circuit board, first of all, avoid high-speed signal lines and audio and video lines together. For example, if you connect the clock line SCL and the data line SDA in the I2C bus to the traces of the audio line. Since the clock line SCL and the data line SDA in the I2C bus are constantly changing, they interfere with the sound. Obviously, for example, when you use a TV remote control to switch to a TV channel, you can hear a regular "click, click" sound from the speaker. This may be because of the above issues that were overlooked in the PCB layout.     V. Whole Machine EMC Design   The assembly drawing in the whole machine (taking one of the models as an example) is shown in Figure 2: Figure 2: In-machine assembly drawing of a model that reflects various EMI concerns   The connection line numbered 5 in the figure above is the screen line of the digital panel connection screen. Because the screen line is mainly on the screen data. It will cause a great disturbance to the system. The best way to reduce interference is to use twisted pairs and shielded wires. If it is a TTL screen, the screen line needs to be shielded or a magnetic ring outside the connection line. If on the LVDS screen, you need to use twisted pair, plus a magnetic ring. In order to reduce the screen line to the entire system of electromagnetic interference. With shielded twisted pair, the signal current can flow on the two inner conductors, and the noise current flows in the shield layer, thus eliminating the coupling of the common impedance, and any interference will induce the two conductors at the same time so that the noise cancels.   A magnetic ring is also required on the connection between the power supply and the main control board (referenced 4). The main reason is that the power cord will generate relatively large electromagnetic interference to the motherboard.   A magnetic ring should also be added to the connection between the keypad and the motherboard (referenced 9). The main reason is that there is a constant data change (remote control receiver head) on the keypad which causes electromagnetic interference to the system. Plus magnetic rings can effectively shield electromagnetic interference.   A magnetic ring is added to the audio cable (labeled 10) connected to the speaker to reduce the electromagnetic interference from the audio output to the system. If there is a cable (label 6, 7, 8) between the motherboard and the tuner board, you need to add a magnetic ring on the cable. To reduce the electromagnetic interference between cables.   The magnetic ring added above can be added according to the specific situation and can be determined by repeated experiments.   Use of shields: In general, shields are required for liquid crystal display modules, main control boards (including digital boards and tuner boards), and power supplies.   The main frequency of the main chip is the main cause of electromagnetic interference. Frequency harmonics of the main frequency are most likely to produce electromagnetic interference. In the experiment conducted by EMC, the frequency harmonics of the main frequency had large electromagnetic interference. The main chip must be shielded during design. The main shielding measures include a metal shield on the digital board. Adding a shield is the most effective way to resist electromagnetic interference. However, because of the heat dissipation problem of the driver board and the entire system, it is required that the holes on the shield cover be used to dissipate heat. However, its maximum size must be less than 1/100 of the shortest wavelength of noise.   The shield on the tuner board is mainly shielded from the TUNER section.   The shielding of the power supply section is particularly important. If the shielding of the power supply section is not good, it will cause large interference. This will not lead to conduction. And because the heat of the power supply is very severe, the shield must pay attention to the problem of heat dissipation.   Usually, shields have openings and seams that can cause electromagnetic leaks. As a result, the shielding effect is not good. Solve electromagnetic leaks at joints by using electromagnetic seal gaskets at the joints. The electromagnetic leakage of the opening in the shield is related to the size of the opening, the characteristics of the radiation source, and the distance from the radiation source to the opening. The requirement for shielding is met by designing the size of the opening and the distance of the radiation source to the opening. FAQ   1. What can cause electromagnetic interference? Electromagnetic interference (EMI) is a disturbance caused by an electromagnetic field which impedes the proper performance of an electrical device. EMI can come from man-made or natural sources such as the sun or the Earth's magnetic fields.   2. How do you stop electromagnetic interference? The simplest way to reduce magnetically induced interference is to use twisted pair wires. This applies both for shielded and unshielded cables and for interference caused by shield currents or from other sources. Twisting the wires forces them close together, reducing the loop area and therefore the induced voltage.   3. How do you make electromagnetic interference? Plug both devices into a wall outlet in the same house or building. Since the wall outlets in most houses are tied to the same ground, the ground is a common source of conducted interference, especially from the low frequency hum of an electric motor. Turn on both devices at the same time.   4. Is electromagnetic interference bad for you? There is no doubt that short-term exposure to very high levels of electromagnetic fields can be harmful to health. ... Despite extensive research, to date there is no evidence to conclude that exposure to low level electromagnetic fields is harmful to human health.   5. What are three types of interference? Electromagnetic interference (EMI) Co-channel interference (CCI), also known as crosstalk. Adjacent-channel interference (ACI) Intersymbol interference (ISI)   6. What material can block electromagnetic fields? Typical materials used for electromagnetic shielding include sheet metal, metal screen, and metal foam. Common sheet metals for shielding include copper, brass, nickel, silver, steel, and tin.   7. What blocks electromagnetic interference? Carbons. Carbon materials (e.g., coke, graphite, graphene, carbon fiber, carbon nanofiber and carbon nanotube) are not only conductive electrically, they are good absorbers of electromagnetic radiation over a wide frequency range.   8. Can humans cause electromagnetic interference? The human body functions as an antenna in the low-frequency band used by HBC. Owing to this antenna function, electromagnetic waves radiating from electronic devices or wireless services cause electromagnetic interference (EMI) in HBC devices.   9. What are two sources of electromagnetic interference that can affect data transmission? Electromagnetic interference can be categorized as follows: Narrowband EMI or RFI interference typically emanates from intended transmissions, such as radio and TV stations or mobile phones. Broadband EMI or RFI interference is unintentional radiation from sources such as electric power transmission lines.   10. What is the EMC? Electromagnetic Compatibility, also known as EMC, is the interaction of electrical and electronic equipment with its electromagnetic environment, and with other equipment. All electronic devices have the potential to emit electromagnetic fields. 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Warm hints: The word in this article is about 3000 words and reading time is about 15 minutesSummaryThis article is mainly about space monitoring and location technology of AR&VR equipment. All AR&VR products must have accurate spatial monitoring and positioning capabilities in order to achieve a full range of head， hand interactions in order to provide users with a more realistic virtual experience. CoreResearch on space monitoring and location technology of AR&VR equipmentPurposeIntroduce space monitoring and location technology of AR&VR equipmentProductAR&VR EquipmentCategoryElectronic productsApplicationsAR&VR technologyTechnologyInside-out space monitoring and positioning and outside-in space monitoring and positioning     Catalogs CatalogsI、Current Status of AR&VR ProductsV、 PC VRII、Cardboard productsVI、Space positioning technology categoryIII、Head motion controlled all-in-one            machine1. Inside-out space monitoring and positioning technologyIV、 AIO machine with space monitoring and positioning2. Outside-in space monitoring and positioning technology  Introduction I、Current Status of AR&VR ProductsThere are many AR&VR products already on the market. The price varies from Cardboards to Hololens, and the user experience varies greatly. First of all, VR products can be divided into the following categories: cardboard products, one-touch control integrated machine, AIO machine with space monitoring and positioning, PC VR.  DetailII、Cardboard productsCardboard productsThis kind of product is the simplest VR product. It comes from Google's carton VR box. Simply, it uses two convex lenses to project the contents of the mobile phone into screens. It uses the IMU inside the phone to judge the user's head movement to adjust the movement direction of the VR display content. This kind of product began to ship a large number of domestic white cards in 2015, but the overall effect of VR depends on the configuration of the mobile phone and the quality of the optical lens. It is only an entry-level VR experience product.The first generation VR products of game companies and some domestic video content are basically in this form. The most representative is the Storm Box, with a BT control handle for menu selection. The emergence of this type of product has indeed played a big role in the promotion of the entire VR industry, but its drawbacks are also very obvious. The Cardboard-style VR device ushered in a particularly big opportunity in 2016, that is, Google proposed Daydream VR. Google wants to enhance the VR Cardboard users’ experience, and hopes to be able to dominate the entire VR ecosystem in 2016. The Daydream mobile phone Pixel, Pixel XL and Daydream Viewer wearing the Cardboard were released in the year, and also equipped with a built-in IMU remote control handle. According to Google's requirements for VR device user experience, it must reach a mobile phone with a certain hardware configuration, and with Daydream Viewer running related VR applications, so that users will not be dizzy. Since 2016, with the launch of products such as Huawei P9 and Lenovo MotoZ, there are more and more mobile phones supporting Daydream. It is expected that, in 2017, these products will completely break the stalemate of the poor Cardboard user experience.III、Head motion controlled all-in-one machineAll-in-one machineAIO machine, as its name, is a VR device that does not need to be inserted into a mobile phone or connected to a PC. Currently, there are representative DaPeng, Xiaoniao, KanKan, etc. Most of the products are listed in 2016. The features of these products are basically the same use of 1080p or 2K resolution display screens (some of which also use 2Kx2 dual screens) with specially designed FIN products designed for VR products aspherical optical lens. The overall picture quality and distortion have improved a lot. However, these products have a common feature, that is, only a simple head control, can only sit or stand in place by shaking his head to achieve VR control, can not do the first hand interaction. In order to remedy this defect, there are currently some external accessories with spatial position detection (the built-in IMU handle, somatosensory backpack, spatial positioning light ball, etc.) to enhance the overall VR user experience.IV、 AIO machine with space monitoring and positioningAIO machine with space monitoring and positioningSpace monitoring and positioning are generally two ways, Inside-out and Outside-in. Inside-out senses the spatial information outside the device through the built-in sensor and performs related positioning. The Outside-in is just the opposite. It uses an external sensor to sense the position of the VR device and provides positioning information to the VR application. For the all-in-one machine, the current view has selected the Inside-out solution without exception, thus avoiding the need to install an external sensor in advance. The user can pick up the VR device at any time and anywhere. It is expected that some of the major products coming on the market in 2017, such as the second generation of the DaPeng AIO Machine and the Storm AIO Machine, will have space positioning capabilities, which will greatly enhance the VR user experience, especially VR games.V、 PC VRPC VRThe most representative products are the HTC Vive, Sony PSVR and HTC Oculus. After the three swordsmen went public in 2016, the HTC Vive has become a standard configuration for the VR experience room. Many other industry customizations are based on Vive. Sony PSVR has sold about 1 million units in less than half a year, which has greatly improved the overall level of user experience in the entire VR industry. The feature of these three products is the use of external space positioning technology. For example, Vive uses an external infrared laser transmitter, head and handle senses transmitter location to determine its position and trajectory. PSVR and Oculus use external sensors to sense the visible light or infrared light emitted by the headlights and the handle to determine the positions of the heads and the handles, so that the heads and the handles can accurately know their respective relative positions and trajectories in space at any time. This can make the application of VR more realistic.Next, let’s talk about AR products. At present, there is a big gap between AR products. Some AR glasses products only project virtual information, images, etc., and are not actually related to the actual environment where the user is located. Such products can only achieve 6DOF motion tracking by the projected virtual information following the head movement. But it is impossible to fuse the virtual object with the actual environment where the user is. For example, the famous ODG, the latest product only supports 6DOF motion tracking, there is no spatial positioning function.AR product ODGShanghai Zhishi's smart glasses also have similar functions to those of ODG, but their positioning is a live broadcast from the first point of view. Therefore, only relevant information and videos for shooting can be displayed in the glasses without spatial positioning. However, it is understood that they are also developing a built-in TOF depth camera glasses, which can achieve 6DOF + spatial positioning function.Shanghai Zhishi's smart glassesThe currently available AR products have the best space monitoring and positioning capabilities. The best match for virtual objects is the Lenovo Phab2 Pro based on Google's Tango space positioning technology and the Microsoft Hololens. Although these two products are very different in shape, they are essentially the full integration of 6DOF+SLAM, achieving spatial positioning and motion tracking. Their AR effects can basically be virtual objects and the actual environment. Convergence, no matter how the user moves or views from what angle, the feeling is just like the real object is in front of me. However, Hololens' accuracy and stability of 6DOF+SLAM are still higher than those of Tango in terms of the effect of actual use. This is closely related to the choice of hardware design platform, type and number of sensors, and core algorithms.Hololens ARIn addition, there are actually many companies in the country that are developing related AR products. Among them, the distinctive feature of Micro Eye's SMAKKEST is not only similar to Hololens, but also similar to Hololens in terms of function. The effect of 6DOF+SLAM is said to be recognized by Hololens.  AnalysisVI、Space positioning technology categorySpace monitoring and positioning technology, in fact, can be divided into two major categories initially, one is the Inside-out space monitoring and positioning, and the other is the Outside-in space monitoring and positioning.1. Inside-out space monitoring and positioning technologyInside-out space monitoring and positioning technology, technology is essentially similar to the process of human-to-environmentally-aware environment of the human eyewear. It senses the external space from the inside of the device and is therefore called the Inside-out positioning method. Inside-out space monitoring and positioning technology is also divided into two categories. One is the spatial monitoring and positioning based on SLAM technology. This is also a basic function required by the fiery robotics industry. SLAM is the English abbreviation for simultaneous localizatiion and mapping. It means that the device itself starts to move from an unknown location in an unknown environment, locates itself according to location estimates and maps during the movement, and builds incremental maps based on its own positioning to achieve autonomous detection and positioning navigation of the device itself. . At present, most AR products use Inside-out spatial location technology.The representative products of the space monitoring and positioning technology based on SLAM are Lenovo Phab2 Pro Tango mobile phone and Hololens. Both use depth monitoring + Fisheye and IMU fusion for sports monitoring. The difference is that the depth monitoring technology is different (Tango uses TOF, and Hololens uses structured light) and the number of Fisheye motion and feature point monitoring is different. Hololens' spatial positioning effect is more accurate and stable than Tango's, and Hololens' effect is in low light and glass light transmission. The current Tango victory, but Tango technology is not static, the next generation of Tango technology also supports multiple Fisheye camera.The Lenovo Phab2 Pro Tango phone uses a TOF depth camera, a 155-degree FOV Fisheye motion monitoring camera and an RGB camera, Fisheye motion monitoring camera with IMU data fusion, feature point matching, providing the device with a complete trajectory The monitoring, together with the cloud image information of the TOF depth camera, can plot the position of the device itself in space and the trajectory of the movement in real time. At the same time, through Tango's own zone learning function, when returning to the space that has already passed, once the Fisheye camera By detecting the stored feature points and matching them, it is possible to quickly perform spatial positioning. This is very important for AR equipment and it ensures that users can quickly use it anytime, anywhere. The working principle of Tango is not explained here. You can refer to Lin Shigong's another article for detailed understanding.The working principle of TangoThe Hololens design of Microsoft is very unique and very affluent. It has newly developed an HPU (Holographic Processing Unit) based on Intel's CPU and GPU technology. The device adopts the configuration of CPU+GPU+HPU. Like Tango, it does not need to External PCs look to achieve complete space monitoring and positioning. On the sensor side, depth monitoring uses two structured light cameras with four structured light-grating emitters for depth monitoring. In addition, there are two Fisheye cameras on the left and right of Hololens, so that more feature points in the space environment can be monitored. Hololens' space positioning accuracy and stability are therefore much higher than those of Tango.HPU（Holographic Processing Unit）The other type is based on the marker (pointer) space monitoring and positioning technology, simply put some like two-dimensional code, special color graphics patterns or light spots as markers in the actual space, equipment to monitor these markers The location of the point to determine their position and movement trends. The HTC Vive is a representative of this type. The following figure shows the working principle of spatial location of the HTC Vive.The working principle of spatial location of the HTC ViveVive emits laser light through two fixed laser emitters. Each base station has an infrared LED array. Two infrared laser emitters with rotating shafts perpendicular to each other are distributed. One is X-axis scanning, and the other is Y-axis scanning. The lasers have a fixed phase difference of 180 degrees. When one of the lasers emits an X-axis scan, the other laser emits a Y-axis scan.The HTC Vive has a shell that is densely covered with 32 light sensors, each oriented in different directions. These sensors are used to receive the infrared laser emitted by a fixed laser emitter. The computer connected to Vive controls all the devices to operate synchronously. The light sensor on the head reveals the time when the laser light reaches each sensor in the X-axis and Y-axis directions and the phase relationship between the two different laser emitters, and the phase difference of each light sensor can be calculated. Accurately locate the head position and trajectory.There are 24 light sensor on the Vive handle. The working principle and head of the handle are the same. It will not be repeated here.The HTC Vive ShellIn addition, it is necessary to mention that domestic Ximmerse, they also introduced a VR device for the Outside-in space positioning package design, through this space positioning package, can provide space-free VR devices with similar accuracy with the HTC Vive Space monitoring and positioning capabilities. The positioning package includes a dual camera module, two control handles with a light ball. When used, the dual camera module is externally mounted on the head display. The dual camera captures the light ball of the control handle to determine the position of the handle in the space, and the handle Through BT to transmit its 6DOF information to the module, the module fuses the 6DOF and the position information of the ball to achieve omni-directional positioning, thereby improving the interaction of the first hand. The advantage of this solution is that under any ambient lighting conditions, the positioning accuracy is not affected by the ambient light, and the positioning accuracy is high. However, this solution cannot monitor and locate the overall space environment in which the user is located. It can only monitor the spatial position information of the photo ball handle, but its advantage is that the original VR device without space positioning can have at least similar HTC Vive. Spatial positioning capabilities.Ximmerse2. Outside-in space monitoring and positioning technologyOutside-in space monitoring and positioning technology is currently the VR device is a relatively mature space positioning technology, Sony PSVR and Oculus are based on a similar program, but Oculus is in an external infrared camera plus point initiative marks the way to get Higher accuracy and faster response time. The PS VR directly uses the PS 3's MOVE system. The principle is similar to that of the Kinect. An external binocular depth camera is used for motion recognition and tracking. There is a light indication on the head, and a different color light ball is at the top of the handle. The external dual camera checks the trajectory of the headlight and the ball on the handle at any time. At the same time, the PS StaTIon receives the IMU information of the head display and handle returned by the BT. , Through the calculation you can get a complete headshot and handle movement trajectory and positioning in space.PS StaTIonFrom the principle and the effect of actual use, the space monitoring and positioning precision of HTC Vive is not high, although Sony's gaming and PSVR wearing wearing their own moderate than Vive better, but the spatial positioning accuracy is not high, it affects the VR The overall experience of the game. So we see from Sony's official website a new spatial orientation of Sony patent, this patent is to be ready for the next generation of PVSR, from the description of the patent point of view should be similar to HTC's fixed laser emitters way, with this program The current practice of PSVR is the opposite. Instead of using an external camera to take pictures (outside-in positioning), the external VR signal is used to locate the direction of the VR helmet in space. This can provide similar HTC Vive usage accuracy (probably higher), and can capture the user's various poses and trajectories 360 degrees without dead ends.Outside-In positioningOculus space monitoring and positioning technology with Sony PSVR similar difference is PSVR camera uses a dual monitor visible external program, and is an active Oculus uses infrared light to the head and the handle are placed significant infrared emitting LED , Through an external infrared camera for shooting and capturing the headlights and infrared light spot information on the handle, so as to obtain head trajectory and handle movement trajectory and spatial position information.Whether it is Sony PSRV or Oculus's Outside-in program, there is a problem, that is, the external camera is fixed, and when the user is back to the camera, the camera can not detect the head and the handle on the light, may There is a possibility of missed supervision, thus affecting the user experience, which does not exist on the HTC Vive.Another Marker point-based Outside-in space monitoring and positioning technology is Ximmerse's photosphere with dual-camera solution. This is contrary to their previously mentioned Inside-out solution, where dual camera monitors have been placed. Indoor fixed position, and then put the ball in the VR head and handle, head and handle during the movement of a dual camera monitor recorded head and handle in the space of the three-dimensional position and their movement data, through BT or WiFi is passed to VR heads to perform related operations and processing, and feedback is implemented on the screen to allow them to freely move around in the virtual environment and interact with things in the virtual world.Lightball + Dual Camera SolutionAnalog of Lightball + Dual Camera SolutionHere is a video about Augmented Reality vs Virtual Reality:Augmented Reality vs Virtual Reality - AR vs VR | The Future ! | Tamil Tech  Book RecommendationVirtual, Augmented, and Mixed Realities in EducationThis book describes the current state of the art of various types of immersive learning: in research, in practice, and in the marketplace. It discusses advanced approaches in the design and development for various forms of immersive learning environments, and also the emerging innovations in assessment and research in the field.--by Dejian Liu, Chris Dede, Ronghuai Huang, John Richards Experience on Demand: What Virtual Reality Is, How It Works, and What It Can DoVirtual reality is able to effectively blur the line between reality and illusion, pushing the limits of our imagination and granting us access to any experience imaginable. With well-crafted simulations, these experiences, which are so immersive that the brain believes they’re real, are already widely available with a VR headset and will only become more accessible and commonplace. But how does this new medium affect its users, and does it have a future beyond fantasy and escapism?--by Jeremy Bailenson  Relevant information about "Research on Space Monitoring and Location Technology of AR&VR Equipment"About the article " Research on Space Monitoring and Location Technology of AR&VR Equipment", If you have better ideas, don't hesitate to  write your thoughts in the following comment area. You also can find more articles about electronic semiconductor through Google search engine, or refer to the following related articles. 

Warm hints: The word in this article is about 3000 words and  reading time is about 15 minutes.   This paper is mainly about how to learn analog circuit design. An analog circuit is a circuit used to transmit, transform, process, amplify, measure, and display analog signals. Analog signals refer to continuously changing electrical signals. Analog circuit is the basis of the electronic circuit, which mainly includes amplifier circuit, signal processing, and processing circuit, oscillation circuit, modulation and demodulation circuit, and power supply.    Analog circuit   Catalogs   I. What’s the Engineering Thinking in Analog Circuit II. Commonly Used Semiconductor Devices III. Negative Feedback Basic Concepts IV. Operational Amplifier Development V. Conclusion FAQ I. What’s the Engineering Thinking in Analog Circuit   Analog circuit is a very important profession, and difficult for people to learn. Now, let me talk about my understanding of the analog circuit. When it comes to the understanding and application of analog circuits, I’ve done some projects and participated in competitions. The analog circuit is an engineering course, and the earning focus is to master the engineering ideas. It’s better to put it into practice, instead of only doing the exams. What is the engineering idea? Encyclopedia +explains as this: "Engineering is the application of science and mathematics. Through this, natural material and energy characteristics can be made into efficient, reliable, and human-friendly products flow through a variety of structures, machines, products, systems, and processes, with the shortest Time, and less refined manpower, so the concept of engineering comes out and it has evolved into an independent discipline and skill. "For example, in analog circuits, there is a very Important engineering thinking - approximation.   In high school physics class, we learn a lot of circuits are ideal circuits. The wire resistance is always 0, the transformer efficiency is 100%, the ideal voltmeter resistance is infinite, the ideal ammeter resistance is 0, and so on. You can see that many times the calculation in an analog circuit will often omit one or two smaller items and use the equal sign instead of the equal sign directly.   Why use an approximation? To put it plainly, people’s understanding of nature in human science is not comprehensive enough to describe the natural phenomenon with absolute precision. Or human’s understanding is limited. By the means of approximation, people have not only achieved an obvious effect on solving the problem but also greatly simplifies the procedure and saves time and effort. With this thought, many achievements have been made in human science, which has also proved its reliability.    Summary Mold itself is a very complex subject, and the molding course is just one of the most basic things. Analog Circuit Meaning is the electronic circuit that processes analog signals. Most of the signals in nature are analog signals, and they have continuous amplitude values, such as the sound signal when speaking. Analog circuits can be such signal processing (of course, need to be converted into electrical signals), such as amplifier to amplify the sound signal, the radio can send analog sound signals, image signals. It can even be assumed that all circuits are based on analog circuits (even for digital circuits, the underlying principle is based on analog circuits). Its importance is self-evident.    Due to the rapid development of digital circuits and programmable devices, many superior features are demonstrated. Many electronic devices are slowly digital but still can not do without analog circuits. The most important analog circuit devices, non-semiconductor devices are none other than. The most basic and commonly used semiconductor devices are diodes, transistors, FETs, and operational amplifiers. II. Commonly Used Semiconductor Devices   The diodes have many roles. Ordinary diodes can be used for rectification, light-emitting diodes can be used for indicator and lighting, regulators can be regulated, varactor diodes can be used for signal modulation. The mold course related to the part of the diode is relatively simple. And many characteristics of the FET are similar to the transistor, so we often explain transistor or amplifier instead.    The basic function of the transistor is to enlarge. The transistor constitutes a variety of circuits because of its features, reflecting a lot of engineering ideas. The transistor-based circuit is the amplifier whose input sound is small, the output sound is great. Amplifier output and the input voltage (or current) ratio is called magnification, also known as gain. For a voltage, if the time for the horizontal axis, voltage vertical axis for mapping, the graph is the voltage waveform. If an amplifier with a gain of 5 inputs a constant voltage of 1V (the waveform on the left is shown below), the output should always be 5V (the waveform is shown in the middle figure below), neither changing with time nor changing with temperature And the input voltage exactly the same shape. However, if the magnification is unstable and constantly changing, the original input signal will be distorted (as shown on the right), and the signal may change from a horizontal straight line to a curved line. This waveform change is called distortion. Voltage waveform   III. Negative Feedback Basic Concepts   The basic concept of negative feedback makes some very powerful people find a good way: negative feedback. What is negative feedback? "Feedback refers to the output of the system is returned to the input and affect the input, thus affecting the overall system output Feedback can be divided into positive feedback and negative feedback is to make the output and input the opposite effect, the system Output tends to be stable. "The above explanation is hard to make sense. I have two examples. When playing the inverted pendulum, we propped up an inverted wooden stick by hand. When the wooden stick was tilted in one direction, we offset the change by moving the hand to the direction of the stick so that the stick could be in our hand's balance.    When I was in high school, I often had a monthly test. I found that some of my classmates had a habit of starting a good study when a test score was poor and going up next time. When the test was better, the next month will be relaxed, so results will come down again, so again and again. Both of these examples illustrate that negative feedback can make the system more stable. We ignore the specific circuit, only draw a simple diagram to illustrate how the transistor amplifier uses the negative feedback. The triangle below shows a transistor consisting of an amplifier, the magnification is A, the input is I, the output O = I * A, because the magnification A instability, so the output waveform will be distorted.  Negative feedback   Some devices have been added to the circuit as follows. The purple circle is the adder, combined with the purple "+", "-" symbol that its output Y = (+ I) + (- X) = I-X, in the actual circuit with the resistance can be achieved; Block F is the feedback device, which means that the signal is taken out from the output O and multiplied by F to get X, so X = O * F, where F <1 (this part can be realized by resistance in the actual circuit). Triangle refers to the amplifier A, mainly composed of transistors, meeting O = A * Y, and A magnification is unstable, easy to be disturbed. Add a feedback device   You can list the equations: Y = I-XO = Y * AX = O * F to calculate the gain of the entire circuit: Formula   If the magnification A is very large, while F is not small, A * F 》》1 symbol "》》" suggests far greater than the approximate idea. The entire circuit magnification: Formula   IV. Operational Amplifier Development   1.Working principle of operational amplifier Because the feedback device can be realized by the resistance, the resistance value of the ordinary resistance is not easily disturbed by the outside world, so the value of F is very steady, so the magnification of the whole circuit is very steady. We succeeded in solving the stability problem of the transistor by negative feedback. We can see here that the feedback part and the amplification part form a ring, so the amplification of the whole circuit is called the loop gain or the closed-loop gain. Before adding the feedback, the amplification of circuit A is called the open-loop gain. Due to the negative feedback, the stability of the circuit is improved, but there is also a cost: Because the AF 》》1, then "A》》1 / F" open-loop gain is much larger than the closed-loop gain, which means the amplifier gain is greatly reduced. But in general, this is worth it for stability. Operational amplifier In the above circuit, in order to actually create a large open-loop amplifier gain A, often with multi-stage transistor amplifier in series design.   Because the high demand for such high-gain amplifiers is very common, so some people in history put them into a finished circuit board module. This is used directly as a component on the line when needed because it’s very convenient. This is the original op-amp, which is referred to as op-amp. The development of integrated circuits makes a large number of transistor components integrated into a small chip possible, so the common integrated operational amplifier turns up today.    The "op-amp" is named for its mathematical operation originally used to simulate computers. Although now widely used digital computer is no longer used to calculate the operational amplifier, but the name still retained. Today, op-amps play an important role in analog circuits and have also become one of the focuses of the analog circuit. The op-amp has virtual short and virtual interrupt characteristics. Usually, op-amp has two inputs U + and U-, an output Uo, between them to meet Uo = A * (U + -U-) op-amp open-loop gain A often up to dozens Million ~ millions, but the op-amp output voltage limited by the supply voltage can not exceed the supply voltage. So the op-amp input-output relationship similar to the shape below. In the figure, the horizontal axis is (U + -U-) and the vertical axis is Uo. Op amp input - output In the middle of a straight line, the op-amp is in the normal state of amplification, called the linear region, meeting Uo = A * (U + -U-). When the absolute value of the input becomes slightly larger, the output will be power limited, no longer satisfying the above relationship. The value of Uo is usually slightly smaller than the supply voltage range (note that the op-amp can be dual supply, that is the supply voltage range can be afloat between a negative value and a positive value), which is called the non-linear region. Rail-to-rail op-amp output can reach the power supply voltage.   When the operational amplifier in the linear region, the Uo value is very limited, but A large. So U + -U- = UoA ≈ 0 or U + ≈ U-. At this time, the positive and negative op-amp input voltage is almost equal, like a short circuit similarly, which is called a short circuit. So only when the operational amplifier in the enlarged area will have "virtual short" characteristics, rather than the inherent properties of the op-amp. On the other hand, due to the internal structure of the op-amp, its input impedance is large.    The input impedance can be simply understood as: the input impedance = input voltage/input current input impedance, which means that the op-amp input with only a small current can work properly. Because of this, an op-amp can be used for some weak current detection, such as the human brain, myoelectric wave, whose maximum voltage is only a few mV, the current value is very small. This feature of the op-amp is called a virtual interrupt, meaning that there is almost no current flowing into the input like the open circuit. Different from the short circuit, a virtual interrupt is the inherent properties of the op-amp, which will not change with the circuit.   2.Op amp non-ideal characteristics   The op amp's non-ideal characteristics of the op-amp by the transistor composition. Obviously, like the transistor, there will be many undesirable characteristics. The actual operational amplifier will not fully meet the short virtual fault characteristics. Its normal work needs input current input, which is called the input bias current.    The same op-amp input offset voltage, input offset voltage, input offset current, and other non-ideal parameters. These non-ideal characteristics, such as the input bias current is small, sometimes will have a great impact on the circuit, resulting in the circuit does not work. Therefore, there are some ways to reduce the impact of these factors. In practical applications, the non-ideal characteristics of the op-amp are a very important issue. There are many ways to eliminate the non-ideal characteristics of the op-amp, but not introduced here.    Other cores of the molding course are the transistor and op-amp. Around these devices, the molding course will explain a variety of circuits, including the calculation of the amplifier circuit analysis, multi-stage amplifier circuit, the amplifier frequency characteristics, the idea of feedback, power amplifier circuit, comparator, oscillator, integrator, differentiator, waveform generation, Signal processing, filter, integrated power supply circuit and so on. When comparing op-amp and transistor In the actual design of the circuit, the op-amp will be more than the transistor. Because many of the features of op-amps are better than triodes, the circuit design is simple, and the cost of op-amps is often not too high.   Many times you can achieve the same effect with the transistor and op-amp and lower cost of each op-amp. Because op-amps integrate a large number of transistors, the average cost per transistor is very low. For example, a conventional audio pre-amplifier can be handled with a universal op-amp. and if you use the transistor, you may need more transistors, and the human cost during design is far higher than the op-amp program. Of course, the transistor has its advantages.    In some very simple circuits, the stability of the magnification is not strictly required, one or two transistors can accomplish. And triodes are often used to save costs. In addition, in some extreme conditions, such as working in high-frequency and high-power environments (such as RF signal transmitting circuits), a well-designed triode circuit will perform much better than an op-amp, or at a much lower cost. Even in some conditions, only the transistors can be completed, then you need to choose the transistor to build the circuit.   This video give a detailed explanation about analog circuit: Analog Circuits Lecture V. Conclusion   Analog circuits are a very complex discipline that involves more than knowledge written in books. Books are generally introduced in accordance with the principle of work, simplifying a lot of difficulties to understand, but in reality, more factors must be considered. So the gap between the actual circuit and the book is very large. Such as triangular wave generator built with an op-amp introduced in analog circuit books usually can not work in all likelihood. However, the main principle of the actual circuit is the same as the book description. Therefore, the design of analog circuits often requires a lot of experience, for there are many things that can not be explained and even difficult to calculate. I hope this article can help you learn more about analog circuits. FAQ   1. What is meant by analog circuit? The Analog electronic circuit includes an analog signal with any continuously changeable signal. While working on an analog signal, an analog circuit alters the signal in some manner. Analog circuit can be used to convert the original signal into some other format such as a digital signal.   2. What is the difference between digital and analog circuits? Analog Circuits and Digital Circuits is a classic way of differentiating between two types of electronic circuits based on the signals they process. To put it in simple words, Analog Circuits deals with continuous analog signals whereas Digital Circuits deals with discrete digital signals.   3. Where are analog circuits used? Analog circuits represent key components of communications and other systems in widespread, growing commercial use. High-speed transistors are essential to the operation of such circuits.   4. Is digital cheaper than analog? If you are looking at the straight-up module cost an analog vs. a digital version, then yes, the analog module will likely be a cheaper solution. However, if you look at the total cost, or the “value” of the digital module versus an analog solution, then digital will in fact be “cheaper”.   5. What is analog design? Analog design is part of integrated circuit design and focuses on signal fidelity, amplification and filtering. Those who perform the function of analog design are qualified electrical engineers.   6. Why is analog design difficult? Ask most engineers and they would tell you why: analog design is harder than digital, and requires more knowledge and more factors to consider such as a deep understanding of efficient power, precision measurement, wireless connectivity, and reliable circuit protection.   7. Which is better analog or digital design? Analog circuits can be precise, elegant design with various components with very simple. For example, two resistors joining to make a voltage divider. Generally, Analog circuits are much more complex to design compared to which complete the same task as digitally.   8. What is the tool used for analog circuit design? A suite of web tools to help you design signal conditioning circuits faster: Analog Filter Wizard, Precision ADC Driver Tool, Photodiode Wizard, In Amp Diamond Plot, Direct Digital Synthesis Simulator, and Virtual Eval.   9. How hard is circuit design? Circuit design is a lot like any other learned skill, you start with the basics. These basic circuits can be learned in a few days. ... So yes, it can be very difficult to reach a high level of design expertise and you never really master it because the art continues to evolve.   10. How does circuit design work? Digital electronic circuit design takes the electrical signals in the form of discrete values. The data are represented in the form of zeros and ones. Digital circuits extensively use transistors, interconnected to give create logic gates that provide the function of Boolean logic.   You May Also Like:   Look Forward to the Future of Semiconductor GaN High-Electron Mobility Transistor Power Amplifier Trojans are everywhere even the hardware Remote Electronic Transport Promote Organic Photovaltaic Power Generation Make Next-Gen of Computer Be Faster,Better, More efficient Some suggestions about protecting transformers  

Warm hints: The word in this article is about 1000 and the  reading time is about 6 minutes.SummaryResearchers from Purdue University showed a range of concepts and technologies about semiconductor industry at international IEDM 2016 Conference in Dec. 2016. Looking forward to the future of semiconductor,which concepts included innovations to extend the performance of today's silicon-based transistors,along with entirely new types of nanoelectronic devices to complement and potentially replace conventional technology in future computers. This is a device is made from the semiconductor germaniumIssueIn the conference,researchers said,"For the past 50 years, ever more electronic devices envelop us in our day-to-day life, and electronic-device innovation has been a major economic factor in the U.S. and world economy," said Gerhard Klimeck, a professor of electrical and computer engineering and director of Purdue's Network for Computational Nanotechnology in the university's Discovery Park. "These advancements were enabled by making the basic transistors in computer chips ever smaller. Today the critical dimensions in these devices are just some 60 atoms thick, and further device size reductions will certainly stop at small atomic dimensions." New technologies will be needed for industry to keep pace with Moore's law, an observation that the number of transistors on a computer chip doubles about every two years, resulting in rapid progress in computers and telecommunications. It is becoming increasingly difficult to continue shrinking electronic devices made of conventional silicon-based semiconductors, called complementary metal-oxide-semiconductor (CMOS) technology, said Muhammad Ashraful Alam, Purdue University's Jai N. Gupta Professor of Electrical and Computer Engineering. "As transistors are becoming smaller they are facing a number of challenges in terms of increasing their performance and ensuring their reliability," he said. Purdue researchers presented five papers proposing innovative designs to extend CMOS technology and new devices to potentially replace or augment conventional transistors during the annual International Electron Devices Meeting (IEDM 2016) Dec. 5-7 in San Francisco. The conference showcases the latest developments in electronic device technology. Purdue researchers are in the  laboratoryIntegrated circuits, or chips, now contain around 2 billion transistors. The more devices that are packed onto a chip, the greater the heating, with today's chips generating around 100 watts per square centimeter, comparable to that of a nuclear reactor. "As a result, self-heating has become a fundamental concern that hinders performance and can damage transistors, and we are making advances to address it," Alam said. Two of the IEDM conference papers detail research to suppress self-heating and enhance the performance of conventional CMOS chips. The remaining papers deal with new devices for future computer technologies that require lower power to operate, meaning they would not self-heat as significantly. "We are not only working to extend the state-of-art of traditional technology, but also to develop next-generation transistor technologies," Alam said. Transistors are electronic switches that turn on and off to allow computations using the binary code of ones and zeros. A critical component in transistors, called the gate, controls this switching. As progressively smaller transistors are designed, however, this control becomes increasingly difficult because electrons leak around the ultra-small gate. One of the conference papers focuses on a potential solution to this leakage: creating transistors that are surrounded by the gate, instead of the customary flat design. Unfortunately, enveloping the transistor with a gate causes increased heating, which hinders reliability and can damage the device. The researchers used a technique called submicron thermo-reflectance imaging to pinpoint locations of excessive heating. Another paper details a potential approach to suppress this self-heating, modeling how to more effectively dissipate heat by changing how the transistor connects to the complex circuitry in the chip.The three remaining papers propose next-generation devices: networks of nanomagnets, extremely thin layers of a material called black phosphorous and "tunnel" field effect transistors, or FETs. Such technologies would operate at far lower voltages than existing electronics, generating less heat. "You want to use as low a voltage as possible because that reduces power dissipation and if you can reduce power dissipation the battery of your cell phone will last longer, you can do more computing with a smaller amount of power and you will be able to cram more functional elements into a given area," Klimeck said. The tunnel FETS could potentially reduce power consumption by more than 40 times. "Reducing power consumption by a factor of 40 would be a huge development," Klimeck said. Another conference paper details research to develop devices made of black phosphorous, which might one day replace silicon as a semiconductor in transistors. Findings showed the devices can pass large amounts of current with ultra-low resistance while demonstrating good switching performance, said Peide Ye, the Richard J. and Mary Jo Schwartz Professor of Electrical and Computer Engineering. "We have demonstrated the highest performance of this kind of 2-D device," Ye said.Peide Ye,the Richard J. and Mary Jo Schwartz Professor of Electrical and Computer EngineeringDevices made from the material also could bring new types of optical and chemical sensors. The devices were created using a technique called chemical vapor deposition in research performed at Purdue's Birck Nanotechnology Center. Future research will include efforts to create smaller black phosphorous devices, Ye said. A fifth paper details how networks of nanomagnets could serve as the building blocks of future computers. Findings show the networks mimic Ising networks - named after German physicist Ernst Ising - which harness mathematics to solve complex probabilistic problems. The nanomagnet networks might be used to draw from huge databases to perform demanding jobs in areas ranging from business and finance, to health care and scientific research. The conventional approach to performing big data computations is through new software running on CMOS devices. However, nanomagnet networks represent a different approach: developing an entirely new type of hardware for the feat, said Zhihong Chen, an associate professor of electrical and computer engineering.The nanomagnet arrays are potential building blocks for probabilistic computer hardware has been proved. Researchers are still in unremitting efforts to creat new semiconductor technologies.  Article Provided by Purdue UniversityArticle edited by kynix