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TPS51200DRCR Sink and Source DDR Termination Regulator

  • Contents

TPS51200DRCR Description

TPS51200DRCR Pinout and Configuration

TPS51200DRCR Features

TPS51200DRCR Applications

TPS51200DRCR Substitutes

TPS51200DRCR Typical Application

TPS51200DRCR Functional Block Diagram

TPS51200DRCR Layout Guidelines

TPS51200DRCR Package

TPS51200DRCR Datasheet

TPS51200DRCR Description

The TPS51200DRCR is a sink and source double data rate (DDR) termination regulator specifically designed for low input voltage, low-cost, low-noise systems where space is a key consideration. The TPS51200DRCR maintains a fast transient response and requires a minimum output capacitance of only 20 μF. The TPS51200DRCR supports a remote sensing function and all power requirements for DDR, DDR2, DDR3, DDR3L, Low-Power DDR3 and DDR4 VTT bus termination. In addition, the TPS51200DRCR provides an open-drain PGOOD signal to monitor the output regulation and an EN signal that can be used to discharge VTT during S3 (suspend to RAM) for DDR applications. The TPS51200DRCR is available in the thermally efficient 10-pin VSON thermal pad package, and is rated both Green and Pb-free. It is specified from –40°C to +85°C.

 

 

TPS51200DRCR Pinout and Configuration

TPS51200DRCR Features

  • Input Voltage: Supports 2.5-V Rail and 3.3-V Rail
  • VLDOIN Voltage Range: 1.1 V to 3.5 V
  • Sink and Source Termination Regulator Includes Droop Compensation
  • Requires Minimum Output Capacitance of 20-μF(Typically 3 × 10-μF MLCCs) for Memory Termination Applications (DDR)
  • PGOOD to Monitor Output Regulation
  • EN Input
  • REFIN Input Allows for Flexible Input Tracking Either Directly or Through Resistor Divider
  • Remote Sensing (VOSNS)
  • ±10-mA Buffered Reference (REFOUT)
  • Built-in Soft Start, UVLO, and OCL
  • Thermal Shutdown
  • Supports DDR, DDR2, DDR3, DDR3L, LowPower DDR3, and DDR4 VTT Applications
  • 10-Pin VSON Package With Thermal Pad

 

 

TPS51200DRCR Applications

  • Memory Termination Regulator for DDR, DDR2, DDR3, DDR3L, Low-Power DDR3 and DDR4
  • Notebooks, Desktops, and Servers
  • Telecom and Datacom
  • Base Stations
  • LCD-TVs and PDP-TVs
  • Copiers and Printers
  • Set-Top Boxes

 

TPS51200DRCR Substitutes

Part No. Manufacturer
L6731D STMicroelectronics
ISL6312ACRZ Renesas Electronics America Inc
LTC1530CS8-3.3#TRPBF Analog Devices Inc.
NCP81142MNTXG onsemi
NCP4200MNR2G onsemi

 

 

TPS51200DRCR Typical Application

TPS51200DRCR Functional Block Diagram

TPS51200DRCR Layout Guidelines

  • Consider the following points before starting the TPS51200 device layout design.
  • Place the input capacitors as close to VDLOIN pin as possible with short and wide connection.
  • Place the output capacitor as close to VO pin as possible with short and wide connection. Place a ceramic capacitor with a value of at least 10-µF as close to VO pin if the rest of output capacitors need to be placed on the load side.
  • Connect the VOSNS pin to the positive node of output capacitors as a separate trace. In DDR VTT application, connect the VO sense trace to DIMM side to ensure the VTT voltage at DIMM side is well regulated.
  • Consider adding low-pass filter at VOSNS if the VO sense trace is very long.
  • Connect the GND pin and PGND pin to the thermal pad directly.
  • TPS51200 uses its thermal pad to dissipate heat. In order to effectively remove heat fromTPS51200 package, place numerous ground vias on the thermal pad. Use large ground copper plane, especially the copper plane on surface layer, to pour over those vias on thermal pad.

 

 

TPS51200DRCR Package

VFDFN Exposed Pad

 

 

TPS51200DRCR Datasheet

TPS51200DRCR PDF

 

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