The Kynix Blog

Sony's advance in image sensors appears quite natural: the company has developed a set of curved CMOS image sensors based on the curvature of the eye. A report on the sensors in IEEE Spectrum said that, "in a bit of biomimicry," Sony engineers were able to achieve a set of curved CMOS image sensors using a "bending machine" of their own construction.Sony's Kazuichiro Itonaga, a device manager, reported on the new development in Hawaii, at the 2014 Symposia on VLSI Technology and Circuits. This is a conference on semiconductor technology and circuits, which took place from June 9 to June 13.It was unclear how much the chips were curved, said IEEE Spectrum, although Itonaga said they did achieve the same level of curvature found in the human eye. The curved systems were 1.4 times more sensitive at the center of the sensor and twice as sensitive at the edge, according to the Sony engineers.According to IEEE Spectrum, "Photodiodes at the periphery of a sensor array will be bent toward the center, which means light rays will hit them straight on instead of obliquely. What's more, the strain induced on a CMOS sensor by bending it alters the band gap of the silicon devices in the sensor region, lowering the noise created by 'dark current'—the current that flows through a pixel even when it is receiving no external light." A curved CMOS sensor has an edge over a planar sensor, Itonaga noted. Considering its geometry, it can be paired with a flatter lens and larger aperture, which lets in more light.Two chips were reported. First, there was a full-size chip that measured some 43 millimeters along the diagonal, suitable for a camera. A smaller chip with smaller pixels suitable for mobile phones was also reported. Gizmodo said the 43mm was possibly to suit a follow-up to the RX1 compact camera. There is no date yet on when the sensors will make their way into consumer products, but IEEE Spectrum said the team made about 100 full size sensors with their bending machine. No official word yet on when the sensors will show up in products for sale has not deterred speculations on how and where they might appear. SonyAlphaRumors said the full frame curved sensor is likely to come on the new RX2. No matter when, PetaPixel a photography blog, said on Friday that the curved full-frame sensor promises to be "an impressive leap forward in digital imaging technology:" 

SummaryRecently the designers found a approach to improve speed,cost and linearity of A-D conversion--Using  ‘voltage-to-frequency converters’(VFCs) to perform A-D conversions in data acquisition systems that require strict monotonic response,high resolution and reuced noise and moderate speed.The VFC produces a pluse train with frequency proportional to the input voltage.Then a microcontroller or logic converts fre quency into a number by opening a gate for a fixed amount of time and counting how many.However,this approach is not perfect.the main drawback is that to increase speed, designers have to run the VFC at high frequency, which deteriorates linearity.   Design Ideathe design idea of this aproach reverses things.A circuit converts input voltage into a proportional time interval;then,the micro uses that interval to count pulses coming from its internal clock.The results are impressive:1.Good linearity as the voltage-to-period converter runs at low frequency2.Faster A-to-D conversion due to the high value of the clock frequency3.Potentially simpler program or logic, as it only has to count clock pulses, gated by the circuit4.Low priceCircuit and Voltage IssueThe key is that increasing the count frequency does not affect linearity of the A-to-D conversion, while increasing the frequency of the VFC always means worse linearity.Just see the following picture: This picture is a circuit about modified VFC,where the input voltage VIN and the reference voltage VREF swap their roles. The R1-R2 network shifts the input voltage so it is always more positive than the reference voltage and maintain proper operating conditions. The circuit uses all switches of the 4066 part: two in parallel build S1 to reduce the effect of imperfect switch flatness on linearity, one switch goes for S2, and the last switch is part of the start-up circuit, paralleling CINT, and controlled by the logic during initialization.As the input voltage changes from 0 to 5V, the output period changes from 78 to 578µs. Integration capacitor CINT and the threshold level of the one-shot’s Schmitt input do not participate in the period vs voltage relation.Filling the period with 10MHz clock pulses generates numbers from 780 to 5780 – one count per millivolt. Linearity is one count or ±0.02%, which is not a surprise when the maximum frequency is only 12.8kHz. The maximum time of the A-to-D conversion is 578µs. This is 8.65 times faster compared to the case of a 1MHz VFC, where it would take 5,000µs to count 5,000 pulses of 1µs. The interface program is short and simple.Calibration involves some back and forth due to the shift of the input voltage: adjust sensitivity to 100µs/V using the trim-pot of the one-shot. The nominal duration of the one-shot pulse is 26µs. Cancel the 780 count offset in the controller.The following table  shows that the V-to-P approach is significantly better than the V-to-F one (Refs 3, 4). Surprisingly, no chip-maker offers this type of converter.

A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers. Called a near broken-gap tunnel field effect transistor (TFET), the new device uses the quantum mechanical tunneling of electrons through an ultrathin energy barrier to provide high current at low voltage.Penn State, the National Institute of Standards and Technology and IQE, a specialty wafer manufacturer, jointly presented their findings at the International Electron Devices Meeting in Washington, D.C. The IEDM meeting includes representatives from all of the major chip companies and is the recognized forum for reporting breakthroughs in semiconductor and electronic technologies.Tunnel field effect transistors are considered to be a potential replacement for current CMOS transistors, as device makers search for a way to continue shrinking the size of transistors and packing more transistors into a given area. The main challenge facing current chip technology is that as size decreases, the power required to operate transistors does not decrease in step. The results can be seen in batteries that drain faster and increasing heat dissipation that can damage delicate electronic circuits. Various new types of transistor architecture using materials other than the standard silicon are being studied to overcome the power consumption challenge."This transistor has previously been developed in our lab to replace MOSFET transistors for logic applications and to address power issues," said lead author and Penn State graduate student Bijesh Rajamohanan. "In this work we went a step beyond and showed the capability of operating at high frequency, which is handy for applications where power concerns are critical, such as processing and transmitting information from devices implanted inside the human body." For implanted devices, generating too much power and heat can damage the tissue that is being monitored, while draining the battery requires frequent replacement surgery. The researchers, led by Suman Datta, professor of electrical engineering, tuned the material composition of the indium gallium arsenide/gallium arsenide antimony so that the energy barrier was close to zero—or near broken gap, which allowed electrons to tunnel through the barrier when desired. To improve amplification, the researchers moved all the contacts to the same plane at the top surface of the vertical transistor.This device was developed as part of a larger program sponsored by the National Science Foundation through the Nanosystems Engineering Research Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (NERC-ASSIST). The broader goal of the ASSIST program is to develop battery-free, body-powered wearable health monitoring systems with Penn State, North Carolina State University, University of Virginia, and Florida International University as participating institutions.   

USB-C has become the new era of connectivity in 2025. Devices now use this universal serial bus connector for faster data transfers, higher power delivery, and improved compatibility. Many people ask about type c vs usb c, but both terms often describe the same connector shape. The usb-c standard makes connecting devices simple, reliable, and efficient. Users now enjoy seamless compatibility across laptops, phones, and accessories. This new era of connectivity sets a clear path for better data and charging experiences with every usb device.Type C vs USB CConnector vs StandardMany people wonder about the difference in the type c vs usb c debate. The answer starts with understanding the connector and the standard. The USB Type-C connector describes the physical shape and design. This connector is small, oval, and reversible. Users can plug it in either way, which makes it easier to use than older usb connectors. The usb-c connector also lasts longer because of its sturdy build.The usb-c standard, on the other hand, refers to the rules and features that work with the usb-c connector. These rules include how fast data can transfer, how much power the connector can deliver, and what types of signals it can carry. For example, the usb-c standard allows for high-speed data transfer, fast charging, and even video or audio signals. The usb type c connector acts as the doorway, while the usb-c standard decides what can pass through.Tip: Not every usb-c connector supports the same features. Always check the device or cable for its usb standard and data transfer speed.The usb-c connector has changed how people connect devices. It replaced many older usb connectors, such as USB-A and USB-B, by offering one universal connector for many uses. The usb-c standard keeps improving, so users get faster data transfer and more power with each new version.Common MisconceptionsConfusion often surrounds the type c vs usb c topic. Many users think all usb-c connectors and cables work the same way. This is not true. The usb-c connector only describes the shape. The usb standard, like USB 3.2 or USB 2.0, tells how fast data can transfer and how much power the connector can handle.Some people believe that every usb-c cable supports fast charging or high-speed data transfer. In reality, different cables have different abilities. For example, a cable for a laptop may handle more power than one for a smartphone. Using the wrong cable can lead to slow charging or even damage. The usb-c standard helps prevent problems, but users must still choose the right cable for their needs.Another common myth is that fast charging with usb-c can harm batteries. Modern usb-c connectors and devices include safety features that protect against overcharging and overheating. The usb standard ensures safe data transfer and power delivery.MythFactAll usb-c connectors are the sameDifferent cables support different usb standards and data transfer speedsFast charging is unsafeThe usb-c standard includes safety features for chargingAny usb-c cable works for every deviceDevices need cables that match their power and data needsThe type c vs usb c confusion often comes from mixing up the connector with the standard. The usb-c connector is just the shape. The usb standard decides what the connector can do. Knowing this difference helps users pick the right usb connectors and cables for their devices.USB EvolutionUSB-A OriginsThe evolution of usb connectors began in the late 1990s. USB-A first appeared in 1996 with the launch of USB 1.0. This connector changed how people connected devices to computers. Before usb-a, users relied on bulky ports like PS/2, serial, and parallel. USB type a made it easier to connect mice, keyboards, and printers. By 1998, computers started to include usb ports as a standard feature. Apple’s iMac helped speed up the adoption of usb connectors by using only usb ports. The usb-a connector offered a simple, rectangular shape, but it only fit one way. This design sometimes made plugging in cables frustrating.YearMilestoneDescription1996USB 1.0 LaunchIntroduced Type-A and Type-B connectors with speeds of 1.5 Mbps (low speed) and 12 Mbps (full speed). Not widely adopted initially.1998USB 1.1 UpgradeImproved adoption, maintained speeds, standardized Type-A and Type-B connectors.2000USB 2.0 ReleaseIncreased speed to 480 Mbps, introduced Mini-A and Mini-B connectors, supported battery charging.2007Micro ConnectorsReplaced Mini connectors with Micro-A, Micro-AB, and Micro-B connectors; introduced USB On-The-Go for device-to-device communication.2008USB 3.0 LaunchIntroduced SuperSpeed USB with 5 Gbps transfer rate, backward compatible plugs and cables.2013USB 3.1 LaunchTwo variants: Gen 1 (5 Gbps) and Gen 2 (10 Gbps), improved data rates.2014USB-C IntroductionNew reversible, smaller connector supporting higher data and power transfer rates.2017USB 3.2 ReleaseAdded new modes with USB-C, doubling speeds up to 20 Gbps using dual-lane data transfer.2019USB4 ReleaseBased on Thunderbolt 3 protocol, speeds up to 40 Gbps, uses USB-C connectors, supports power delivery up to 240W.2022USB4 2.0Increased speeds up to 80 Gbps over USB-C.USB-B, Mini, and MicroAs usb technology advanced, new connectors appeared to solve problems. USB-B was created for larger devices like printers and scanners. However, usb-b connectors were too big for small gadgets. The evolution continued with mini and micro usb connectors. Mini usb arrived in 2000 for cameras and early phones. It was smaller than usb-a and usb-b, but still too thick for slim devices. Micro usb launched in 2007, offering a thinner shape and better durability. Micro usb connectors doubled the insertion lifetime compared to mini usb. Both mini and micro usb connectors kept the one-way plug design, which sometimes caused confusion. Micro usb also introduced new features like USB On-The-Go, letting devices connect directly without a computer.USB-A was too large for small devices, leading to the creation of usb-b, mini, and micro connectors.Mini usb worked for cameras but not for thin phones.Micro usb improved size and durability, but still required correct orientation.Rise of USB-CThe next step in the evolution of usb connectors came with usb-c in 2014. This connector solved many old problems. USB-C features a small, oval shape and works in any direction. Users no longer struggle with plug orientation. USB-C supports high-speed data transfer, fast charging, and advanced protocols like Thunderbolt and DisplayPort. The usb-c connector can deliver up to 240 watts of power, making it strong enough for laptops and monitors. USB 4.0 uses usb-c connectors to reach speeds up to 40 Gbps. The usb-c connector replaced many older types, making cables and ports simpler for everyone. In 2024, new rules in the EU made usb-c the standard for mobile devices, showing its global importance.Image Source: statics.mylandingpages.coNote: USB-C unifies usb connectors for all devices, supports usb 4.0, and makes data transfer and charging faster and easier.Why USB-CSpeed and PowerUSB-C stands out because it offers much faster data transfer and higher power delivery than older connectors. Devices can now move large files, stream high-quality video, and charge quickly. The usb standard has improved with each version, making usb-c the top choice for speed and power.USB TypeMaximum Data Transfer SpeedMaximum Power DeliveryAdditional FeaturesUSB-A (Standard USB)Up to 10 Gbps (USB 3.1)Up to 4.5W (USB 3.0)Limited power delivery, non-reversible connectorUSB-BSimilar to USB-A in speed and powerSimilar to USB-ATypically used for peripherals, non-reversibleUSB-CUp to 40 Gbps (Thunderbolt 3 / USB4)Up to 100W (USB PD), up to 240W (USB PD 3.1)Reversible connector, supports simultaneous data, power, and video outputImage Source: statics.mylandingpages.coThe usb-c connector supports data transfer rates up to 40 Gbps with USB4 and Thunderbolt 3. This speed is much higher than usb-a or usb-b. The usb-c standard also allows power delivery up to 240W, which means users can charge laptops, monitors, and even some gaming devices. The usb standard uses dynamic power negotiation, so each device gets the right amount of power. This feature keeps charging safe and efficient.Note: USB-C power delivery is an open standard. It works with many brands and devices, unlike older proprietary chargers that only fit one type of device.The usb-c standard supports fast data transfer for large files, high-resolution video, and quick charging. This makes it the best choice for modern technology.Reversible DesignThe reversible design of usb-c solves a problem that frustrated many users. Older usb connectors like usb-a and usb-b only fit one way. People often tried to plug them in upside down, which wasted time and caused wear.USB-C has a symmetrical, oval shape. Users can insert the connector in either direction. The usb-c standard uses 24 contacts in two rows, so the cable works no matter how it is plugged in. This design reduces mistakes and makes connecting devices easier for everyone.The usb-c connector also uses spring latches and grounding fingers. These features keep the connection secure and reliable. The reversible design supports high data transfer speed and power delivery, while keeping the connector small and easy to use.Tip: The reversible usb-c connector helps people of all ages connect devices quickly, with less frustration and fewer errors.VersatilityUSB-C is more than just a connector for charging phones. The usb-c standard supports many types of data transfer and power delivery. It works with a wide range of devices, from smartphones and tablets to laptops, monitors, and even virtual reality headsets.USB-C supports all usb device speeds, from low-speed to SuperSpeed and beyond.The usb-c standard allows alternate modes, such as DisplayPort and MHL, to send video and audio over the same cable.Power delivery can reach up to 240W, so users can charge large devices like laptops.Devices can switch roles, acting as a host or a function, which was not possible with older usb connectors.USB-C FeatureTechnical CapabilityRelevance to Emerging Technologies (VR, High-Resolution Displays)High Data Transfer SpeedsUp to 80 Gbps with USB4Enables fast streaming and data transfer required for immersive VR and 4K/8K videoPower Delivery (USB PD)Negotiates and delivers higher wattageSupports charging and powering VR headsets and high-res monitorsDisplayPort Alt Mode (DP Alt Mode)Video output over USB-C cable using DisplayPort protocolAllows connection to high-resolution external displays through a single cableMulti-protocol SupportSupports USB, Thunderbolt, DisplayPortProvides versatile connectivity essential for AR/VR devices and advanced displaysIndustry AdoptionMajor tech companies updating devices to USB-CEnsures broad compatibility and future-proofing for emerging techThe usb-c standard also helps the environment. The EU now requires usb-c for most devices. This rule reduces electronic waste by letting people reuse cables and chargers. Fewer chargers end up in landfills, which helps protect the planet.Note: USB-C adapters and dongles help connect new devices to older equipment. This keeps older technology useful and reduces waste.USB-C’s versatility makes it the best choice for today’s technology. It supports fast data transfer, high power delivery, and many device types. The usb-c standard brings simplicity, speed, and sustainability to the world of usb.Adoption TrendsIndustry ShiftMany industries have moved quickly to embrace USB-C. Consumer electronics companies lead this change. They use USB-C in smartphones, laptops, tablets, and audio or video devices. Industrial automation also benefits from USB-C, especially in factories and production lines. These industries choose USB-C for several reasons:Universal compatibility across many devicesReversible connector design that makes plugging in easierFaster data transfer rates, reaching up to 10 Gbps and beyondHigher power delivery, supporting fast charging and even powering larger devicesAbility to send audio and video signals, reducing the need for extra cablesSimpler device design and better user experienceLess setup time and complexity in industrial settingsDevice makers also see USB-C as a way to stay ahead in technology. Standardizing on USB-C lowers development costs and helps companies meet rising consumer demand for efficient and sustainable products. The adoption of USB-C also helps reduce electronic waste by replacing many older connectors.Market research shows strong growth for USB-C:AspectDetailsMarket Size (2024)USD 5.2 BillionProjected Market Size (2033)USD 12.8 BillionCAGR (2026-2033)10.5%Key Growth DriversTechnology advances, changing consumer needs, competitive strategiesFastest Growing RegionAsia-PacificOther Regional TrendsNorth America and Europe show steady growth, helped by research and regulationsConsumer ImpactConsumers now enjoy a simpler and more reliable experience with USB-C. The reversible design and slim shape make devices easier to use and carry. People can use one charger for many devices, which saves money and reduces clutter. Fast charging and high-speed data transfer also improve daily life.Regulations, especially in the European Union, push companies to use USB-C. The EU requires USB-C for phones, tablets, and earbuds by the end of 2024, and for laptops by 2026. This rule encourages companies worldwide to follow the same standard, making USB-C more common everywhere. These changes help reduce electronic waste and support sustainability.Companies work together to make sure their products are compatible. They use digital marketing and social media to teach people about the benefits of USB-C. Schools and families save money by using multi-port USB-C charging stations instead of buying many different adapters. Over time, the adoption of USB-C helps everyone by making technology easier, faster, and more eco-friendly.USB-C stands as the universal standard because it offers a reversible design, fast data transfer, and high power delivery. Users benefit from one connector for many devices, making technology easier for everyone.Educational guides help people understand that not all USB-C cables work the same way.Knowing the difference between Type C and USB-C lets users choose the right cable for their needs.Embracing USB-C means a simpler, faster, and more connected future. This connector supports the future of technology, helps reduce waste, and prepares everyone for the future of smart devices. The future looks bright with USB-C leading the way.FAQWhat is the main difference between USB-C and older USB connectors?USB-C uses a small, reversible design. It supports faster data transfer and higher power delivery. Older connectors, like USB-A and USB-B, only fit one way and have lower speed and power limits.Can every USB-C cable charge all devices?Not every USB-C cable supports the same power or speed. Some cables only charge phones, while others power laptops. Always check the cable’s label or packaging for its charging and data capabilities.Does USB-C work with older USB devices?USB-C can connect to older devices with adapters or special cables. The speed and power depend on the oldest device in the connection. Users should check compatibility before connecting.Why do some USB-C ports support video output and others do not?Some USB-C ports support "Alternate Modes" like DisplayPort or HDMI. These ports send video signals. Not all devices include this feature. Users should check device specifications for video support.

（The new device is smaller than a thumbnail with a size of 0.1 x 4mm, and could be integrated into everyday electronic devices like smartphones.） Integrated circuits, so called chips, are used in everyday electronic equipment like mobile phones and computers. It is a set of electronic circuits on one small flat piece of semiconductor material, normally silicon. But this material has some limitations when it comes to processing data. To overcome these limitations and improve data processing, researchers are developing optical circuits made of chalcogenide glass. This special type of glass is used for ultrafast telecommunication networks, transferring information at the speed of light. Integrating these glass optical circuits into silicon chips could lead to a more advanced communications system, processing data a hundred times faster. Can these two materials be combined? The answer is yes! In a collaboration with physicists in the University of Sydney's Australian Institute for Nanoscale Science and Technology (AINST), the Australian National University (ANU) and RMIT University, the CUDOS research group around PhD candidate Blair Morrison and senior researcher Dr Alvaro Casas Bedoya created compact, mass manufacturable optical circuits with enhanced functionalities by combining nonlinear glasses with silicon-based material. "In the last few years the group at the University of Sydney has repeatedly demonstrated exciting functionalities, such as broadband microwave devices that enhance radar, using these novel chalcogenide glasses," Blair Morrison said from the University of Sydney CUDOS node. "Now we have shown it is possible to combine this material with the current industry standard platform for photonic integration, silicon," he said. "We integrated a novel nonlinear glass into an industrially scalable CMOS compatible platform. We maintained the key advantages of both the silicon and the glass, and made a functional and efficient ultra-compact optical circuit," said Dr Alvaro Casas Bedoya who is the lead photonics nanofabrication manager for CUDOS. "A wealth of new opportunities will be created, and this takes us one step closer to moving our research from the lab into industrial applications," said Blair Morrison. CUDOS Director and ARC Laureate Fellow Professor Benjamin Eggleton from the University of Sydney said this new approach will one day allow the industry to miniaturise the photonics functionalities from devices that are the size of a laptop to the size of a smartphone and even smaller, allowing for deployment in real world applications. "This is exciting, because this is a platform which is more compatible with existing semiconductor manufacturing and will allow us to integrate multiple functionalities on a single silicon chip, with active and passive components, such as detectors and modulators, required for advanced applications," said Professor Eggleton who supervised the project. The multi-university research team went through the whole manufacturing process: The fabrication of these devices uses silicon wafers from a semiconductor foundry in Belgium, a dedicated facility in ANU's Laser Physics Centre for the glass deposition, lithography in the RMIT University's School of Engineering and are then characterised and tested in the University of Sydney's AINST. To showcase the potential of the new approach, the CUDOS researchers further demonstrated a compact novel laser based on the light-sound interactions, the first time in an integrated optical circuit. "The breakthrough here is this realisation that we can actually interface, we can integrate that glass onto silicon and we can interface from silicon to the glass very efficiently -- we can harness the best of both worlds," Professor Eggleton said. Professor Susan Pond, the Director of AINST, emphasized that this project is one of AINST flagship activities that deals with harnessing interactions between photons and phonon at the nanoscale. This work links fundamental research in light matter interactions at the nanoscale with an end user perspective and strong coupling to industry. Ref.KY32-LMX6502SQKY32-LN2300KY32-LN3251MPW

Two microcontroller lines from STMicroelectronics increase energy efficiency, flexibility, and feature integration at the high end of the STM32F4 Access Line for high-performance embedded designs. Qualified up to 125°C, these STM32 devices target always-on sensor acquisition and general-purpose industrial applications and present a robust and cost-effective upgrade from STM32F1 MCUs. The STM32F413 and crypto-enhanced STM32F423 integrate up to 1.5MB Flash and dense SRAM of 320KB. These are the most highly featured of the STM32F4 Access Lines, with rich audio capabilities including a Serial Audio Interface (SAI) and an enhanced voice-acquisition interface with multi-channel Digital Filter for Sigma-Delta Modulators (DFSDM) that enables low-power sound localisation and beam forming. The devices also provide peripheral integration, with two 12-bit Digital-Analogue Converters (DACs), up to 10 UARTs, and three CAN 2.0B active interfaces. The crypto-enhanced STM32F423 also has a True Random-Number Generator (TRNG) and AES-256 cryptographic hardware accelerator.Sitting at the top of the STM32F4 Access Lines, the MCUs introduce a 100MHz dual-mode Quad SPI for connecting serial off-chip memory, 16-bit Flexible Memory Controller (FMC) for external SRAM, PSRAM or NOR Flash, up to 16-bit QVGA or 8-bit WQVGA LCD interface, and USB OTG with Link Power Management (LPM) and dual power rails that save external level shifting.In addition, both lines feature a RAM-access scheme that uses the Instruction and Data (I/D) buses and the System BUS (SBUS) to connect to separate RAM1 (256KB) and RAM2 (64KB) areas thereby minimising contentions. An enhanced DMA Batch Acquisition Mode (BAM+) takes advantage of these separate RAM1 and RAM2 areas to process code and data extremely efficiently in sensor-hub applications.Delivering high performance, the STM32 microcontrollers combine the 100MHz 125DMIPS/339 EEMBC CoreMark ARM Cortex-M4 core with ST’s power-saving Dynamic Efficiency technologies that cut RUN mode current up to 112µA/MHz. These Dynamic Efficiency technologies include the ST ART Accelerator for zero-wait execution from Flash, and the supply-voltage extending down to 1.7V, to maximise the battery life of always-connected devices.Designers can immediately start their projects using the NUCLEO-F413ZH development board. This STM32 Nucleo-144 board comes with the ST-LINK/V2-1 debugger/programmer, software libraries and examples, and can be used directly with ARM mbed online resources. Ref:KY32-STM32F401CBU6KY32-STM32F401CCU6KY362-STM32F401C-DISCO