The Kynix Blog - News Room

Printed organic photodetectors and large-area image sensors company, Isorg, has announced that its first large-sized high-resolution (500dpi) flexible plastic fingerprint sensor, co-developed with FlexEnable, won the 2017 Best of Sensors Expo – Silver Applications Award. The high-resolution, ultra-thin, 500dpi flexible image sensor (sensitive from visible to near infrared) offers system integrators advantages in performance and compactness. Its ability to conform to three-dimensional shapes sets it apart from conventional image sensors. The device provides dual detection: fingerprinting as well as vein matching. Due to its large-area sensing and high-resolution image quality, the device is highly suited to biometric applications from fingerprint scanners and smartcards to mobile phones, where accuracy and robustness as well as cost-competiveness are key. Several biometric solution providers have sampled the flexible image sensor, verifying its readiness for deployment in products and compliance with FBI Image Quality Standards (IQS). “Isorg is very honoured to have received an international award for our groundbreaking high-resolution flexible image sensor technology whilst attending the most important global trade event dedicated to sensor innovations,” said Emmanuel Guerineau, General Manager and CFO at Isorg. “We are delighted to have collaborated with FlexEnable to produce the world’s first printed electronics image sensor that overcomes the limitations of traditional sensors. Biometric solution providers will be able to take advantage of the key differentiating factors that our technology brings, such as customised formats in large and small sizes, and easy integration. We see these opening up new opportunities across multiple applications.” Isorg is planning to launch high-volume production of the flexible image sensor at its new plant in Limoges, France, in order to support its large-scale commercialisation in the global biometrics market. The global biometrics hardware market is expected to grow from $3.9bn (approximately £2.99bn) in 2016 to $6.2bn (approximately £4.76bn) by 2021, according to the Yole Développement report on ‘Sensors for Biometry and Recognition 2016′. Central to the 500dpi flexible image sensor is an Organic Photodiode (OPD), a printed structure developed by Isorg that converts light into current – responsible for capturing the fingerprint. Isorg also developed the readout electronics, the forensics quality processing software and the optics to enable seamless integration in products. FlexEnable, a specialist in developing and industrialising flexible organic electronics, developed the Organic TFT backplane technology, an alternative to amorphous silicon. This partnership between the two companies began in Q4 2013. “We are delighted that the large area flexible fingerprint sensor we developed with Isorg has been recognised with such a prestigious award. Thanks to being thin, light and glass-free, the sensor can be conformed to almost any surface to enable new form factors and use cases not possible with conventional fingerprint sensors,” said Paul Cain, Strategy Director at FlexEnable. Designed on a large area (3x3.2”; 7.62x8.13cm) plastic substrate, the flexible image sensor is ultra-thin (300µ), therefore remarkably lightweight, compact and highly resistant to shock. Sensors Expo and Conference, held in San Jose, California, is the largest gathering of engineers and engineering professionals involved in sensors and sensing-related technologies. For over 30 years, it has welcomed more than 6,400 professionals from across the US and over 40 countries to explore today’s sensor technologies and find the solutions to tomorrow’s sensing challenges. The Best of Sensors Expo Awards are announced in conjunction with Sensors Online, a leading resource and authority on sensing, communication and control. The awards are designed to spotlight the advances in both innovations and real-world applications of sensors. Ref.NOIL2SM1300A-GDCMT9V022IA7ATCMT9V011

(Random telegraph noise from single molecule was adsorbed on SWNT.) Noise is low-frequency random fluctuation that occurs in many systems, including electronics, environments, and organisms. Noise can obscure signals, so it is often removed from electronics and radio transmissions. The origin of noise in nanoscale electronics is currently of much interest, and devices that operate using noise have been proposed. Materials with a high surface-to-volume ratio are attractive for studying the noise produced by nanoscale electronics because they are very sensitive to changes of their surfaces. A representative material of this type is carbon nanotubes, which are rolled sheets of the graphene hexagonal network, which is only one carbon atom thick. A Japanese collaboration led by Osaka University has explored the ability of single molecules to affect the noise generated by carbon nanotube-based nanoscale electronic devices. The team fabricated simple devices consisting of a carbon nanotube bridging two electrodes. The devices were exposed to different large molecules, causing some to bind to the carbon nanotube surface. It was found that different molecules gave unique noise signals related to the properties of the molecules. The strength of the interaction between the carbon nanotubes and molecules was able to be predicted from the obtained noise signals. "The signal generated by the carbon nanotube device changed following the adsorption of specific single molecules," says first author Agung Setiadi. "This is because the adsorbed molecule generated a trap state in the carbon nanotube, which changed its conductance." What this means is that the carbon nanotube-based devices were so sensitive that the researchers were able to detect unique signature from single molecules. The ability to characterize single molecules using highly sensitive nanoelectronics is an exciting prospect in the field of sensors, particularly for neuro- and biosensor applications. "Use of noise signals to identify molecular activity ((interaction) or (active orbital)) is attractive for developing advanced sensing devices," explains corresponding author Megumi Akai-Kasaya. "We demonstrated that noise can be exploited to improve the signal detection ability of a device." The results of this successful demonstration will be published in the near future in a follow-up article. Signal detection sensitivity may be increased through controllable noise generation. These carbon nanotube-based devices illustrate that it is possible to detect single molecules through their unique noise signatures in the device current signals. Improved knowledge of the molecular-level origin of noise should lead to the development of electronics that use noise to improve their performance rather than degrade it.. Ref.A1321ELHLT-TAS5030-ATST 

Electrical engineers at the University of California San Diego have developed a temperature sensor that runs on only 113 picowatts of power -- 628 times lower power than the state of the art and about 10 billion times smaller than a watt. This near-zero-power temperature sensor could extend the battery life of wearable or implantable devices that monitor body temperature, smart home monitoring systems, Internet of Things devices and environmental monitoring systems.   The technology could also enable a new class of devices that can be powered by harvesting energy from low-power sources, such as the body or the surrounding environment, researchers said. The work was published in Scientific Reports on June 30.   "Our vision is to make wearable devices that are so unobtrusive, so invisible that users are virtually unaware that they're wearing their wearables, making them 'unawearables.' Our new near-zero-power technology could one day eliminate the need to ever change or recharge a battery," said Patrick Mercier, an electrical engineering professor at UC San Diego Jacobs School of Engineering and the study's senior author.   "We're building systems that have such low power requirements that they could potentially run for years on just a tiny battery," said Hui Wang, an electrical engineering Ph.D. student in Mercier's lab and the first author of the study.   Building ultra-low power, miniaturized electronic devices is the theme of Mercier's Energy-Efficient Microsystems lab at UC San Diego. Mercier also serves as co-director for the Center for Wearable Sensors at UC San Diego. A big part of his group's work focuses on boosting energy efficiencies of individual parts of an integrated circuit in order to reduce the power requirement of the system as a whole.   One example is the temperature sensor found in healthcare devices or smart thermostats. While the power requirement of state-of-the-art temperature sensors has been reduced to as low as tens of nanowatts, the one developed by Mercier's group runs on just 113 picowatts -- 628 times lower power.   Minimizing power   Their new approach involves minimizing power in two domains: the current source and the conversion of temperature to a digital readout.   Researchers built an ultra-low power current source using what are called "gate leakage" transistors -- transistors in which tiny levels of current leak through the electronic barrier, or the gate. Transistors typically have a gate that can turn on and off the flow of electrons. But as the size of modern transistors continues to shrink, the gate material becomes so thin that it can no longer block electrons from leaking through -- a phenomenon known as the quantum tunneling effect.   Gate leakage is considered problematic in systems such as microprocessors or precision analog circuits. Here, researchers are taking advantage of it -- they're using these minuscule levels of electron flow to power the circuit.   "Many researchers are trying to get rid of leakage current, but we are exploiting it to build an ultra-low power current source," Hui said.   Using these current sources, researchers developed a less power-hungry way to digitize temperature. This process normally requires passing current through a resistor -- its resistance changes with temperature -- then measuring the resulting voltage, and then converting that voltage to its corresponding temperature using a high power analog to digital converter.   Instead of this conventional process, researchers developed an innovative system to digitize temperature directly and save power. Their system consists of two ultra-low power current sources: one that charges a capacitor in a fixed amount of time regardless of temperature, and one that charges at a rate that varies with temperature -- slower at lower temperatures, faster at higher temperatures.   As the temperature changes, the system adapts so that the temperature-dependent current source charges in the same amount of time as the fixed current source. A built-in digital feedback loop equalizes the charging times by reconnecting the temperature-dependent current source to a capacitor of a different size -- the size of this capacitor is directly proportional to the actual temperature. For example, when the temperature falls, the temperature-dependent current source will charge slower, and the feedback loop compensates by switching to a smaller capacitor, which dictates a particular digital readout.   The temperature sensor is integrated into a small chip measuring 0.15 × 0.15 square millimeters in area. It operates at temperatures ranging from minus 20 C to 40 C. Its performance is fairly comparable to that of the state of the art even at near-zero-power, researchers said. One tradeoff is that the sensor has a response time of approximately one temperature update per second, which is slightly slower than existing temperature sensors. However, this response time is sufficient for devices that operate in the human body, homes and other environments where temperature do not fluctuate rapidly, researchers said.   Moving forward, the team is working to improve the accuracy of the temperature sensor. The team is also optimizing the design so that it can be successfully integrated into commercial devices.     Ref. ADT7410TRZ-REEL DS18B20

 Omron Electronic Components has extended its non-contact MEMS thermal sensor range with a new narrow-field version specifically designed to provide accurate non-contact measurements of an objects’ surface temperature for industrial control, medical and building automation systems. Omron is relaunching its full range of MEMS thermal sensors in Europe, including wider field versions ideal for detecting room occupancy and similar applications.   The new Omron D6T-1A-02 is a super-sensitive infra-red (IR) temperature sensor that makes full use of proprietary Omron MEMS sensing technology. It can measure the surface temperature of an object between -40 up to +80°C in the target area with an accuracy of +/-1.5°C and a resolution of 0.06°C.  The device includes a state-of-the-art MEMS thermopile, a sensor ASIC (Application Specific Integrated Circuit) and a signal processing microprocessor in a tiny package of only 12.0mm x 11.6mm x 9.2mm. The D6T-1A-02 features a narrow field of view of 26.5 degrees square, allowing it to accurately assess the surface temperature of a specific object in this area. Features also include a digital I2C output which offers excellent noise immunity (measured as noise equivalent temperature difference) of 140mK. The Omron D6T thermal sensor is also ideal for building automation applications, measuring the temperature in a room, or detecting occupancy even when people are stationary. For these applications, Omron is offering versions with a wider field of view. These include a 1x1 device, the D6T-1A-01, with a field 58 degrees square. A 4x4 version and a 1x8 version are also available. These ultra-sensitive sensors are an outstanding alternative to pyroelectric sensors or PIR detectors in home automation, building automation, healthcare, security and industrial applications, which often fail to distinguish between an unoccupied space and a stationary person. While standard thermal sensors are only able to measure temperature at one contact point, the D6T range can measure the temperature of an entire area contactlessly. Signals generated by infrared rays are extremely weak. To achieve reliable detection, Omron has developed and manufactured every part of the new high sensitivity thermal sensor in-house, from the MEMS sensors to the ASICs and other application-specific parts. The technology behind Omron’s D6T thermal sensors combines a MEMS micro-mirror structure for efficient IR radiation detection with a high-performance silicon lens to focus the infrared rays onto its thermopiles. The ASIC then uses proprietary algorithms to make the necessary computations and convert sensor signals into digital I2C outputs. All components were developed in-house and are fabricated in Omron’s own MEMS facilities. Ref.KY66-G6SK-2-DC5KY66-G5LA-14-DC5

Texas Instruments (TI) introduced the industry's first differential inductive switch, with a dual-coil architecture that automatically compensates for variations in temperature and component aging. The LDC0851 detects the presence or absence of conductive material by using a simple coil drawn on a printed circuit board (PCB). This unique approach enables low-cost, highly reliable switching implementations for a variety of uses including buttons, knobs, door open/close detection, and speed and directional sensing in personal electronics, appliances, industrial equipment and communications applications. The LDC0851 provides a temperature-stable switching accuracy of better than 1 percent of the sensor coil diameter, removing the need for production calibration and minimizing part-to-part variation. Unlike alternative sensing technologies, the LDC0851's contactless and magnet-free design is immune to dirt, dust or other environmental factors, providing designers a reliable, low-cost solution. The device joins TI's distinctive portfolio of inductive-sensing integrated circuits (ICs) including the LDC1614 family of multichannel inductance-to-digital converters.  Key features and benefits of the LDC0851: ·Stable switching threshold:The differential architecture maintains the switching threshold across variations in temperature, humidity and other environmental factors, as well as providing immunity to component aging for stable, long-term performance. ·High accuracy:The device can deliver better than 1 percent switching accuracy, which is up to 10 times more accurate than magnetic sensor-based designs, reducing the need for production calibration. ·High reliability:The device's immunity to nonconductive contaminants such as oil, dirt and dust can help extend product lifetimes and reduce replacement costs. The solution is also unaffected by direct current (DC) magnetic fields, ensuring robust operation and reliability in a wide range of environments. ·Low power:Duty cycling of the LDC0851 allows for less than 20-µA average current consumption at 10 samples per second, which is up to five times lower than competitive solutions. Tools and support to jump-start design The LDC0851EVM evaluation module helps designers easily configure the LDC0851 and start designing it into a system without programming.（The LDC0851EVM evaluation module.）An incremental rotary encoder reference design (TIDA-00828) demonstrates the LDC0851 in a simple 32-position rotary-knob design. Using only two LDC0851 inductive switches, the system can track rotation position and direction, and designers can easily scale the number of encoder positions up or down.（TIDA-00828 Inductive Sensing 32-Position Encoder Knob ReferenceDesign using the LDC0851.） System designers can start their inductive-sensing design in minutes with TI's WEBENCH Coil Designer. This online tool simplifies sensor-coil design based on application and system requirements. The optimized design is exportable to a variety of computer-aided design (CAD) programs to quickly incorporate the sensor coil into an overall system layout. Ref.KY362-LDC0851EVMKY362-LDC1614EVM     

UK power firm Amantys Power Electronics has developed its next generation IGBT gate drive technology which is being demonstrated this week at the PCIM exhibition in Nuremberg. Called NG Gate Drive, it has been designed to be compatible with IGBT modules known as LinPak, XHP, nHPD2 and SemiTrans20 that are available from several power semiconductor manufacturers.This is achieved because IGBT module variation, such as the position of gate drive connections, is accommodated through use of a module interface card which means the NG Gate Drive can target modules from 1700V to 3300V, and up to 6500V in the future.It will drive up to six IGBT modules in parallel.The company has incorporated its own two-way communication protocol between the gate drive and a central controller, allowing configuration of the gate drive in the target power stack.Configurable parameters, include the gate resistors (Rgon, Rgoff and Rgsoftoff), gate-emitter capacitor (Cge), operating mode (two level or three level) and timeouts such as the fault lock out time and dead time.Module also features multi-level desaturation detection for improved protection of the IGBT module. It records faults that the gate drive has seen during operation.Potential applications could include traction, wind energy and medium voltage motor drives. Ref:KY32-STK672-540KY32-BA5834FM-E2KY32-BD7957FS