STMicroelectronics SPC560P50L5CEFAY

General description

The MPC5607B is a new family of next generation microcontrollers built on the Power Architecture™ embedded category. This document describes the features of the family and options available within the family members, and highlights important electrical and physical characteristics of the device.
The MPC5607B family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of body electronics applications within the vehicle. The advanced and cost-efficient host processor core of the MPC5607B automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU (Auxillary Processor Unit), providing improved code density. It operates at speeds of up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

Features

• Single issue, 32-bit CPU core complex (e200z0h)
— Compliant with the Power Architecture™ embedded category
— Enhanced instruction set allowing variable length encoding (VLE) for code size footprint reduction. With the optional encoding of mixed 16-bit and 32-bit instructions, it is possible to achieve significant code size footprint reduction.
• Up to 1.5 Mbytes on-chip Flash supported with the Flash controller
• Up to 96 Kbytes on-chip SRAM
• Memory protection unit (MPU) with 8 region descriptors and 32-byte region granularity on certain family members
• Interrupt controller (INTC) capable of handling 204 selectable-priority interrupt sources
• Frequency modulated phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters
• 16-channel eDMA controller with multiple transfer request sources using DMA multiplexer
• Boot assist module (BAM) supports internal Flash programming via a serial link (CAN or SCI)
• Timer supports I/O channels providing a range of 16-bit input capture, output compare, and pulse width modulation functions (eMIOS)
• 2 analog-to-digital converters (ADC): one 10-bit and one 12-bit
• Cross Trigger Unit to enable synchronization of ADC conversions with a timer event from the eMIOS or PIT
• Up to 6 serial peripheral interface (DSPI) modules
• Up to 10 serial communication interface (LINFlex) modules
• Up to 6 enhanced full CAN (FlexCAN) modules with configurable buffers
• 1 inter-integrated circuit (I2C) interface module
• Up to 149 configurable general purpose pins supporting input and output operations (package dependent)
• Real-Time Counter (RTC)
— Clock source from internal 128 kHz or 16 MHz oscillator supporting autonomous wakeup with 1 ms resolution with maximum timeout of 2 seconds
— Optional support for RTC with clock source from external 32 kHz crystal oscillator, supporting wakeup with 1 sec resolution and maximum timeout of 1 hour
• Up to 8 periodic interrupt timers (PIT) with 32-bit counter resolution
• Nexus development interface (NDI) per IEEE-ISTO 5001-2003 Class Two Plus
• Device/board boundary scan testing supported per Joint Test Action Group (JTAG) of IEEE (IEEE 1149.1)
• On-chip voltage regulator (VREG) for regulation of input supply for all internal levels