Phone

    00852-6915 1330

TLE6225G Low-Side Switch: Specs, Obsolescence & Alternatives

  • Contents

Quick-Reference Card: TLE6225G at a Glance

Attribute Detail
Component Type Smart Quad Channel Low-Side Switch
Manufacturer Infineon Technologies
Key Spec 350mA maximum output current per channel
Supply Voltage 4.5V to 32V
Package Options 20-SOIC (PG-DSO-20-6)
Lifecycle Status Obsolete / End of Life (EOL)
Best For Automotive engine management and industrial relay/lamp driving

TLE6225G IC package 20-SOIC


1. What Is the TLE6225G? (Definition + Architecture)

The TLE6225G is a Smart Quad Channel Low-Side Switch from Infineon Technologies that drives automotive and industrial loads up to 350mA per channel while providing integrated fault protection. Unlike discrete MOSFETs, this IC integrates four open-drain DMOS output stages with dedicated logic-level inputs, making it a "smart" switch capable of self-preservation in harsh electrical environments.

1.1 Core Architecture & Design Philosophy

Infineon designed the TLE6225G to bridge the gap between low-voltage microcontrollers and high-voltage/high-current peripheral loads. The internal architecture features built-in open load detection, overtemperature shutdown, and overvoltage clamping. By integrating these protections directly into the silicon, engineers can eliminate dozens of passive components and discrete protection diodes from their BOM. The inputs are specifically designed to be compatible with 3V logic, allowing direct drive from modern MCUs without level shifters.

1.2 Where It Fits in the Signal Chain / Power Path

This component sits downstream of the main control intelligence (like an STM32 or automotive ECU) and acts as the final power-handling stage before the load. It sinks current to ground, meaning it is typically placed between the negative terminal of an inductive load (like a relay coil or solenoid) and the system ground.


2. Electrical Characteristics: The Numbers That Matter

2.1 Power Supply & Consumption Profile

The TLE6225G operates across a wide supply voltage range of 4.5V to 32V. * Why it matters: This wide envelope allows it to survive the severe voltage transients typical in 12V and 24V automotive systems, including mild load dumps. Furthermore, its very low standby quiescent current makes it highly suitable for battery-operated modules that must remain connected to power while the vehicle or system is turned off.

2.2 Performance Specs (Speed, Accuracy, or Efficiency)

Each of the four channels can handle a maximum of 350mA, with a typical On-State Resistance (R_DS(on)) of 1.7 Ω. * Why it matters: At the maximum 350mA load, a 1.7 Ω resistance results in a voltage drop of approximately 0.6V across the switch, generating about 200mW of heat per channel. If you are driving all four channels at maximum capacity simultaneously, you must account for nearly 1W of power dissipation in the 20-SOIC package, requiring adequate copper pouring on the PCB for thermal relief.

2.3 Absolute Maximum Ratings — What Will Kill It

  • Operating Temperature: -40°C to 150°C.
  • Overcurrent: Exceeding the internal thermal limits will trigger the overtemperature protection.
  • Inductive Kickback: While the chip has integrated overvoltage protection for inductive loads, continuously dumping massive flyback energy beyond the datasheet's specified clamping energy limit will degrade and eventually destroy the DMOS stages.

3. Pinout & Package Guide

3.1 Pin-by-Pin Functional Groups

Pin Group Pins Function
Power VS, GND System power supply and ground references.
Inputs IN1, IN2, IN3, IN4 3V-compatible logic inputs from the microcontroller.
Outputs OUT1, OUT2, OUT3, OUT4 Open-drain DMOS outputs connecting to the low side of the load.
Diagnostics ST1, ST2, ST3, ST4 Status outputs for fault detection (open load, short circuit).

(Refer to the official datasheet for the exact pin numbering and NC pin locations.)

3.2 Package Variants & Soldering Notes

Package Pitch Thermal Pad? Soldering Method
20-SOIC (PG-DSO-20-6) 1.27mm No Standard Reflow / Hand Soldering

The 20-SOIC package is easy to hand-solder during prototyping. Since it lacks an exposed bottom thermal pad, heat dissipation relies heavily on the GND pins. Ensure these pins are tied to a large ground plane using multiple thermal vias.

3.3 Part Number Decoder

  • TLE: Infineon Automotive IC family
  • 6225: Specific quad-channel low-side switch series
  • G: Indicates a surface-mount (SOIC) "Green" (RoHS compliant) package

4. Known Issues, Errata & Real-World Pain Points

Problem: Component Obsolescence * Root Cause: The TLE6225G is officially marked as End of Life (EOL) and is obsolete. Infineon has transitioned its portfolio to newer, more efficient silicon processes. * Recommended Fix: Do not use this part for new designs. Migrate to the manufacturer's recommended replacement, such as the TLE75004EPDXUMA1 (SPIDER+ 12V family).

Problem: Current Limitation and Thermal Shutdown * Root Cause: The maximum output current is hard-limited to 350mA per channel. Engineers migrating from discrete MOSFETs often underestimate the thermal accumulation in a quad-package, leading to unexpected thermal shutdowns when driving heavier inductive loads like large solenoids. * Recommended Fix: Ensure your worst-case load current remains strictly below 350mA. For higher loads, select a higher-current low-side switch alternative or parallel discrete MOSFETs.

Problem: Matrix Driving Complexity * Root Cause: When used in motor matrix arrays (e.g., in vending machines, paired with high-side drivers like the UDN2987), improper synchronization between the high-side and low-side switches can cause unintended load activation or shoot-through-like conditions. * Recommended Fix: Implement precise microcontroller timing and dead-time logic to ensure only the strictly intended row/column pairs are driven simultaneously.


5. Application Circuits & Integration Examples

5.1 Typical Application: Relay and Inductive Load Driving

In a typical automotive or industrial control unit, the TLE6225G is used to drive 12V relays. The high side of the relay coil is tied directly to the 12V battery rail, while the low side connects to an OUT pin on the TLE6225G. Because the IC includes internal clamping, external freewheeling diodes are technically optional, but adding them across the relay coil is still a best practice to minimize electrical noise and reduce thermal stress on the IC during turn-off.

5.2 Interface Example: Connecting to a Microcontroller

Because the TLE6225G is compatible with 3V microcontrollers, you can connect its input pins directly to an STM32, ESP32, or standard 5V Arduino without level shifting.

// Pseudocode for basic Arduino / STM32 HAL integration
#define IN1_PIN 5
#define IN2_PIN 6

void setup_TLE6225G() {
    // Set MCU pins as outputs
    pinMode(IN1_PIN, OUTPUT);
    pinMode(IN2_PIN, OUTPUT);

    // Initialize loads to OFF (Low-side switch off = open circuit)
    digitalWrite(IN1_PIN, LOW);
    digitalWrite(IN2_PIN, LOW);
}

void activate_relay_1() {
    // Drive IN1 HIGH to turn ON the low-side DMOS (sinks current to GND)
    digitalWrite(IN1_PIN, HIGH);
}

6. Alternatives, Replacements & Cross-Reference

If you are facing supply chain issues due to the TLE6225G's obsolete status, several alternatives exist.

6.1 Pin-Compatible Drop-In Replacements

(Note: Always verify exact pinout and diagnostic logic in the datasheet before finalizing a board spin.)

Part Number Manufacturer Key Difference Compatible?
E-L9338MD STMicroelectronics Quad low-side switch, similar architecture ?? (Verify package pitch)
L93PI STMicroelectronics Quad low-side driver ?? (Check logic thresholds)
MIC2027-2YM Microchip Warning: This is generally a high-side USB power switch. ? (Not a drop-in)

6.2 Upgrade Path (Better Performance)

For new designs, Infineon recommends upgrading to the TLE75004EPDXUMA1. It offers significantly lower R_DS(on), advanced SPI diagnostics, and a much smaller footprint, making it the modern standard for quad-channel low-side driving.

6.3 Cost-Down Alternatives

If SPI diagnostics are not required and cost is the primary driver, consider using an array of discrete dual N-channel logic-level MOSFETs (e.g., 2x BSS138 or similar, depending on current needs) paired with discrete flyback diodes.


7. Procurement & Supply Chain Intelligence

  • Lifecycle Status: Obsolete / EOL. This component is no longer manufactured.
  • Typical MOQ & Lead Time: N/A from franchised distributors. Available only through secondary broker markets.
  • BOM Risk Factors: Extremely high. Sourcing the TLE6225G relies entirely on remnant stock. Purchasing obsolete automotive silicon from unauthorized brokers carries a high risk of acquiring counterfeit, improperly stored, or reclaimed parts.
  • Recommended Safety Stock: Zero. Redesign the board to accommodate an active component.
  • Authorized Distributors: None currently stock this part for new production.

8. Frequently Asked Questions

Q: What is the TLE6225G used for? The TLE6225G is primarily used in automotive engine management, brake control, and industrial systems to drive relays, lamps, lines, and motor matrix arrays.

Q: What are the best alternatives to the TLE6225G? For legacy repairs, the STMicroelectronics E-L9338MD or L93PI may serve as functional equivalents. For new designs, Infineon's TLE75004EPDXUMA1 is the recommended modern upgrade.

Q: Is the TLE6225G still in production? No, the TLE6225G is classified as End of Life (EOL) and is completely obsolete.

Q: Can the TLE6225G work with 3.3V logic? Yes, the input pins are specifically designed to be compatible with 3V and 5V microcontrollers, requiring no external level shifters.

Q: Where can I find the TLE6225G datasheet and evaluation board? While the evaluation board is no longer manufactured, the legacy datasheet can still be found on Infineon's official website or through major electronic component database archives.


9. Resources & Tools

  • Evaluation / Development Kit: No longer available (Obsolete).
  • Reference Designs: Search Infineon's application notes for "Smart Low-Side Switches" to find migration guides to the SPIDER+ family.
  • Community Libraries: Basic GPIO control requires no special libraries; standard Arduino digitalWrite() or STM32 HAL GPIO functions are sufficient.
  • SPICE / LTspice Model: Legacy models may be available via Infineon's designer portal, though support is deprecated.

TLE6225GXUMA1 Documents & Media

Download datasheets and manufacturer documentation for Infineon Technologies TLE6225GXUMA1.
Datasheets
datasheet
Other Related Documents
ConflictMineralStatement

TLE6225GXUMA1 PCB Symbol, Footprint & 3D Model

Infineon Technologies TLE6225GXUMA1

Infineon Technologies

IC SW SMART QUAD LOSIDE DSO-20

Get a quote

Quantity:

Click To Quote

Kynix

Kynix was founded in 2008, specializing in the electronic components distribution business. We adhere to honesty and ethics as our business philosophy and have gradually established an excellent reputation and credibility in our international business. With the accurate quotation, excellent credit, reasonable price, reliable quality, fast delivery, and authentic service, we have won the praise of the majority of customers.

Join our mailing list!

Be the first to know about new products, special offers, and more.

Leave a Reply

We'd love to hear from you! Feel free to share your thoughts and comments below. Rest assured, your email address will remain private.

Name *
Email *
Captcha *
Rating:

Kynix

  • How to purchase

  • Order
  • Search & Inquiry
  • Shipping & Tracking
  • Payment Methods
  • Contact Us

  • Tel: 00852-6915 1330
  • Email: info@kynix.com
  • Follow Us

authentication

Kynix

© 2008-2026 kynix.com all rights reserved.