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HMC667 Complete Reference: Specs, Drop-in Replacements, and Design Tips

  • Contents

Quick-Reference Card: HMC667 at a Glance

Attribute Detail
Component Type GaAs pHEMT MMIC Low Noise Amplifier (LNA)
Manufacturer Analog Devices Inc.
Key Spec 0.75 dB Noise Figure
Supply Voltage +3V to +5V
Package Options 6-Lead 2x2mm DFN
Lifecycle Status Obsolete (End of Life)
Best For WiMAX, WLAN, and Fixed Wireless receivers (2.3-2.7 GHz)

HMC667 product photo or IC package


1. What Is the HMC667? (Definition + Architecture)

The HMC667 is a GaAs pHEMT MMIC Low Noise Amplifier from Analog Devices Inc. that provides high gain and industry-leading noise performance for receivers operating in the 2.3 GHz to 2.7 GHz frequency band. Designed as a high-linearity solution, it allows engineers to maximize system sensitivity without sacrificing dynamic range.

1.1 Core Architecture & Design Philosophy

The HMC667 utilizes a Gallium Arsenide (GaAs) pseudomorphic High Electron Mobility Transistor (pHEMT) process. This technology was chosen by the designers to achieve an ultra-low noise floor (0.75 dB) while maintaining high electron mobility, which is critical for high-frequency performance in the S-band. Internally, the MMIC is matched to 50 ohms, simplifying the external circuitry required for integration.

1.2 Where It Fits in the Signal Chain / Power Path

In a typical RF receiver architecture, the HMC667 sits at the very front of the signal chain, immediately following the antenna switch or bandpass filter. Its role is to amplify weak incoming signals (WiMAX or WLAN) while adding as little thermal noise as possible before the signal reaches the mixer or down-converter.


2. Electrical Characteristics: The Numbers That Matter

2.1 Power Supply & Consumption Profile

The HMC667 operates on a single positive supply voltage between +3V and +5V. At a standard +5V bias, the device draws approximately 59 mA of quiescent current. Because the gain and noise figure are sensitive to supply stability, designers should use high-quality decoupling capacitors to prevent power supply noise from modulating the RF signal.

2.2 Performance Specs (Speed, Accuracy, or Efficiency)

  • Noise Figure (0.75 dB): This is the standout metric. A sub-1dB noise figure is essential for long-range WiMAX and fixed wireless applications where signal-to-noise ratio (SNR) is at a premium.
  • Gain (19 dB): Provides significant "punch" to overcome downstream losses in the signal chain.
  • Output IP3 (+29.5 dBm): High linearity ensures that the amplifier remains stable even in the presence of strong interfering signals, preventing intermodulation distortion.

2.3 Absolute Maximum Ratings — What Will Kill It

  • Supply Voltage: Exceeding the maximum rated voltage (typically +5.5V or +7V depending on the specific revision) will cause permanent junction breakdown.
  • RF Input Power: Do not exceed the rated RF input power levels (refer to datasheet for exact dBm limits), as excessive power can saturate and damage the GaAs gates.
  • ESD Sensitivity: Like most GaAs devices, this part is Class 1A (HBM) sensitive; handle only at static-safe workstations.

3. Pinout & Package Guide

3.1 Pin-by-Pin Functional Groups

The HMC667 uses a compact 6-lead 2x2mm DFN package. Refer to the official datasheet for exact pin numbering.

Pin Group Pins Function
RF Input RF_IN 50-Ohm matched signal input
RF Output / Vcc RF_OUT & VCC Combined RF output and DC bias input
Ground GND / Paddle RF and Thermal ground (must be soldered)
Control N/C or Config Non-connected or manufacturer test pins

3.2 Package Variants & Soldering Notes

Package Pitch Thermal Pad? Soldering Method
6-Lead DFN 0.5 mm Yes (Exposed) Reflow Only

The 2x2mm DFN is extremely small. The exposed center paddle is not just for electrical grounding; it is the primary thermal path. Poor solder coverage on this paddle will lead to junction overheating and premature failure.

3.3 Part Number Decoder

The HMC667 follows the standard Hittite/ADI numbering: * HMC: Hittite Microwave Corporation (Legacy prefix) * 667: Part identifier * LP2: 2x2 mm DFN package * E: RoHS compliant / Lead-free


4. Known Issues, Errata & Real-World Pain Points

4.1 Obsolete Part Status

Problem: The HMC667 is officially marked as Obsolete by Analog Devices. Root Cause: Shift in manufacturing focus toward newer, higher-integration RF front-ends. Fix: Do not use this part for new designs. If you are maintaining a legacy system, secure remaining stock from authorized brokers or begin a redesign using the alternatives listed in Section 6.

4.2 Lack of Simulation Data

Problem: RF engineers have noted difficulty finding full noise parameter files (.s2p) for specific EDA tools. Fix: Rely on the 50-ohm noise figure plots provided in the datasheet for manual calculations, or contact ADI technical support to request legacy S-parameter data.

4.3 Thermal Management

Problem: In high-ambient temperature environments, the 59mA current draw in a 2x2mm package creates significant heat. Fix: Use a minimum of four 8-mil (0.2mm) thermal vias directly under the exposed paddle to pull heat into the internal ground planes.


5. Application Circuits & Integration Examples

5.1 Typical Application: WiMAX Receiver Front-End

In a WiMAX receiver, the HMC667 is used to provide the first stage of amplification. The circuit requires an external bias tee (often an inductor and a capacitor) on the RF_OUT line to provide DC power to the MMIC while allowing the RF signal to pass to the next stage.

5.2 Interface Example: Connecting to a Microcontroller

The HMC667 is an analog RF component and does not have a digital interface (I2C/SPI). However, if your system requires "power-down" functionality, you must use an external MOSFET switch to cut the +5V Vcc supply to the LNA.

// Pseudocode for LNA Power Control
void enable_LNA() {
  digitalWrite(LNA_ENABLE_PIN, HIGH); // Drive MOSFET gate to supply 5V to HMC667
  delay(1); // Allow bias to stabilize
}

6. Alternatives, Replacements & Cross-Reference

6.1 Pin-Compatible Drop-In Replacements

Since the HMC667 is obsolete, "drop-in" replacements are rare. Most modern equivalents require a layout change.

Part Number Manufacturer Key Difference Compatible?
HMC715LP3E Analog Devices Larger package (3x3 QFN), lower noise ?? (Layout Change)
TQP3M9007 Qorvo Different footprint, similar 2.3-2.7GHz performance ?? (Layout Change)

6.2 Upgrade Path (Better Performance)

For new designs, the HMC715LP3E offers a lower noise figure (0.35 dB) and higher OIP3, though it comes in a larger 3x3mm package.

6.3 Cost-Down Alternatives

Consider Skyworks Solutions or NXP RF amplifiers in the 2.4 GHz range. These often provide similar gain profiles at a lower price point for high-volume consumer WLAN applications.


7. Procurement & Supply Chain Intelligence

  • Lifecycle Status: Obsolete. This part is no longer in active production.
  • Typical MOQ & Lead Time: Not applicable for new orders. Lead times through brokers vary based on existing global "grey market" inventory.
  • BOM Risk Factors: High Risk. Relying on an obsolete, single-source GaAs part is dangerous for production.
  • Recommended Safety Stock: Maintain enough stock for 2 years of repairs/spares if a redesign is not feasible.
  • Authorized Distributors: Check Mouser, Digi-Key, or Arrow for "Remaining Stock" or "Factory Stock" notifications.

8. Frequently Asked Questions

Q: What is the HMC667 used for? The HMC667 is primarily used as a Low Noise Amplifier in the receiver front-end of WiMAX, WLAN, and fixed wireless systems operating between 2.3 GHz and 2.7 GHz.

Q: What are the best alternatives to the HMC667? The HMC715LP3E and HMC605LP3E from Analog Devices are the closest performance matches, though they require different PCB footprints. Qorvo's TQP3M series is also a strong competitor.

Q: Is the HMC667 still in production? No, the HMC667 is obsolete. It is not recommended for new designs, and procurement teams should look for replacements or authorized old stock.

Q: Can the HMC667 work with 3.3V logic? The HMC667 is an analog device; it doesn't use logic. However, it can operate on a 3.3V power supply, though gain and OIP3 performance will be slightly lower than at 5V.

Q: Where can I find the HMC667 datasheet and evaluation board? The datasheet is available on the Analog Devices website under the "Obsolete Products" section. Evaluation boards (HMC667LP2) are generally no longer available for purchase.


9. Resources & Tools

  • Evaluation Kit: HMC667LP2 (Legacy)
  • Reference Designs: Refer to ADI's WiMAX Infrastructure application notes.
  • SPICE / LTspice Model: Contact ADI for legacy S-parameter files.

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