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Radio Frequency Packages Tutorial: Integrated Laminate Substrates and Passive Devices

  • Contents

The laminate substrates, one of the most widely used carriers in RF module packaging. This method that combines the traditional laminate substrates technology with the integrated passive device technology (IPD) is a win-win solution that can achieve the best balance in cost, size, performance, and flexibility. The application of laminate substrates with IPD devices is discussed with two examples in this article.

 

 


Catalog

I. General Introduction

II. Comparison of IPD and SMD(Surface Mounted Devices) and LTCC Discrete   Device Circuits

III. Application Examples

IV. Conclusion

FAQ

 


I. General Introduction

 

A wide range of packaging carrier technologies are available in radio frequency packages(hereinafter referred to as RF) and wireless products, including lead frames, laminate substrates, low-temperature co-fired ceramic (hereinafter referred to as LTCC), and silicon backplane. Because the increasing function has higher requirements for integration, also more demands put forward for the system-level packaging method (SiP).

RF Technology

Lead frame substrate packaging technology has been greatly developed in the past few years, including etching inductors, adding passive devices to pins, stacking technology of chips, and so on. Frame substrates are the cheapest cost option, but higher functionality requires more wiring and more vertical space utilized, therefore framework package is rarely used in RF integration solutions.

 

LTCC has been proven to be a high-performance substrate material that provides high integration due to its multi-layer structure, the high dielectric is constant, and high-quality factor inductance. The passive device can be embedded in LTCC, such as independent RCL or functional blocks containing RCL, so that SMT(surface mounted technology) devices require minimal planar space and improved electrical performance.

 

Integration is the advantage of LTCC, however, warping, cracks, secondary reliability of substrate, and the whole supply chain structure (transfer of substrate during packaging) limit the LTCC, which makes it impossible to become a popular carrier substrate selection.

 

Silicon substrate carriers, such as the chip-scale module package(CSMP) of STATS ChipPAC, have been widely used in wireless solutions requiring high integration, excellent electrical performance, and small profile coefficients. CSMP is an ideal packaging form of a fully integrated solution that can include RFIC and baseband IC. However, such integration is not the lowest cost and is not required for all RF and wireless devices.

 

The above-mentioned reasons lead us to think of the laminate substrates, one of the most widely used carriers in RF module packaging. This method that combines the traditional laminate substrates technology with the integrated passive device technology (IPD) is a win-win solution that can achieve the best balance in cost, size, performance, and flexibility. The application of laminate substrates with IPD devices is discussed with two examples in this article.

 

 


II. Comparison of IPD and SMD(Surface Mounted Devices) and LTCC Discrete Device Circuits

 

RF modules need independent RCL or combined RCLs to implement functional blocks such as filters, diplexer, balun, which are usually the SMD or IPD.

 

The traditional laminate substrate is not suitable for embedded passive devices, and high dielectric material lamination is limited by large cost. Spiral inductors can be designed inside the laminate substrate, but the inductance is limited. Therefore, laminate substrates are more likely to combine SMT with IPD, which has the advantages of cost, shape size, performance, and so on.

 

It needs to trade-off when SMDs be used and when specific passive devices are designed into reasonable IPDs. For example, when a capacitor larger than 100.0pF is required, the use of SMT devices has the advantage of size and cost.

 

In addition, SMT passive devices are generally recommended when a small number of decoupling capacitors or independent inductors and resistors are required in the design. The surface mount device can make full use of the Z direction of the occupied space while the IPD mainly uses the XY direction, the latter has very limited utilization of the Z height direction.

 

Thus it is wise to use SMT devices when the surface area of the IPD devices exceeds the available space. In order to find the best balance between IPD and SMT devices, a curve describing the relationship between the device value and the area required by IPD is developed (Fig. 1) for design reference.

 

Inductance and Capacitance of IPD fabricated on Silicon substrate

Fig.1 Inductance and Capacitance of IPD fabricated on Silicon substrate

Using silicon-based IPD technology, an 0201 SMD device (0.15mm2) can generate a 25.0nH inductance value or 50.0pF capacitance value. In other words, If the capacity is smaller than these two values, the external dimensions of the devices/circuits scheme are smaller than that of 0201 devices.

 

IPD schemes are suitable for functional blocks for a variety of reasons. First, although the silicon-based IPD inductor also uses a spiral form, it can use smaller linewidth and isolation space. In addition, high-resistive silicon substrates are allowed to produce higher-quality inductors.

 

As a result, the mass and shape coefficients of an IPD inductor are comparable to those of SMD devices. Second, small-capacity capacitors (in RF applications) are easier to build in IPD. Finally, comparing with connecting SMD devices with PCB, or internal connections to LTCC, the interconnect paths on silicon substrates are shorter.

 

For an ultra-wideband (UWB) application filter, as an example, the existing LTCC filter size is 3.2mm × 2.5mm × 0.8mm, and if the same layout is used in IPD, the size will be 1.6mm × 1.0mm × 0.5mm (Figure 2). IPD filter has a thinner shape and its size has been reduced by five times.

Size Comparison between LTCC Filter and IPD Filter

Fig.2 Size Comparison between LTCC Filter and IPD Filter

Comparing with other cases, for filters (such as LPF or BPF), IPD can get five times smaller shapes; for unbalanced transformers, using IPD shape can be two times smaller.

 

Another way is to use embedded inductors (inside laminates) and SMT capacitors to make filters, but in this way means occupying more space than LTCC or IPD, also including performance limitations.

 

In addition, since the process of assembling a whole integrated functional block is split into two parts (PCB inductor and SMT capacitor), the package requirements must be stricter for the assembly processes.

 

SMT devices have different sizes. In the RF module application, the most commonly used is 0201. Smaller 01005 devices have just appeared, but they are usually more expensive and have limited device value.

 

These SMT devices are usually attached to the laminate using a high-speed mounting machine, which is then soldered back to the laminate.

 

Fig. 3 An IPD are Bonded on A Laminated Substrate or Upside Down on It in an RF Module

Fig. 3 An IPD are Bonded on A Laminated Substrate or Upside Down on It in an RF Module

The IPD can be in the form of a bare chip or a convex device and then welded to the substrate by wire bonding or inversion (Fig. 3). The convex IPD chip and SMT device can be pasted by a high-speed mounting machine. After finished, the other chips can be directly placed on the substrate by wire bonding.

 


III. Application Examples

 

Example 1—GSM Matching Circuit

In an RF receiver, matching circuits are needed to improve the performance of PA and LNA active circuits. These matching circuits include RCL devices. Considering cost and performance, these RCL devices can be removed from the chip and implemented in the form of SMD or IPD.

 

We compare a client's GSM transport module with an out-of-chip adaptor. In this module, there are 73 passive devices for matching circuits and DC decoupling. If only SMD elements are used (assuming all devices can be 0201), the package size will be 11mm × 11mm. However, if some devices are implemented in the form of IPD, the size of the module can be significantly reduced (Table 1).

 

Package Size Comparsion between SMD and IPD+SMD

Table.1 Package Size Comparsion between SMD and IPD+SMD

IPD is very suitable for the low frequency (860MHz) and high frequency (1800MHz) adapters of GSM. In addition to some large capacity decoupling capacitors, 55 RCLs can be made in a smaller IPD network, which the package size can be only 7mm × 7 mm. In order to simplify, the complexity of routing is not taken into account in all examples.

 

It should be noted that the IPD network is treated as an integrated chip because its shape coefficient and thickness are similar to that of an integrated circuit.

 

IPD network is stacked with the transport chip, although it increases the thickness of the module, the IPD thickness is only 0.25mm, thus there is no obvious effect on the thickness increase (although it increases the thickness of the module when the IPD network stacked with the transport chip, there is no obvious effect on the thickness as the IPD thickness is only 0.25mm).

 

Therefore, the IPD packaging stack saves space and can be stacked on top or bottom of another chip by wire bonding or flip-chip bonding.

 

Example 2—GSM Balun Circuits

In order to suppress the noise and improve the PA performance, differential output settings are often used for PA, thus a transformer is needed to convert the single-step terminal to the differential one. However, transformers that can be supplied by the industry have a fixed impedance transformer ratio, such as 50.0~100. 0 Ω transformers or 50.0~200. 0 Ω transformers.

 

Most PAs have low output impedance to transmit high power, which requires a matching circuit between the transformer and PA, as shown in figure 5 (b). In this example, the output matching circuit and transformer function block of PA are used to demonstrate the effects of IPD technology.

 

Package Comparison of Two Schemes

Fig.4 Package Comparison of Two Schemes

There are GSM low frequency (860 MHz) and high frequency (1800 MHz) circuits in the application. Different frequencies have different matching circuits and transformers to convert a differential-terminal output to a single-step output (50.0Ω). In the existing form of the product, a customer uses a standard chip LTCC transformer with dimensions of 2.0 mm * 1.25 mm * 0.95 mm and 1.6 mm * 0.8 mm * 0.8 mm * 0. 6 mm.

 

Because the standard transformer has 50.0Ωto 200.0Ωimpedance conversion and does not match the specific power amplifier output impedance, the module needs to be independent with a 4RCL device. The current LTCC + SMD solutions are shown in Table 2.

 

Size Comparsion between IPD and LTCC + SMD

Table.2 Size Comparsion between IPD and LTCC + SMD  

 

Because an IPD transformer can be designed to match any amplifier output impedance, there is no need to use a separate matching circuit (4 RCL) to each frequency band. In other words, the matching function can be embedded into the Balun transformer.

 

The overall size of the IPD scheme is 2.5 mm2, which is about four times smaller than the size of the existing LTCC+SMD scheme. In addition, the matchers and transformer circuits are only about 0.25mm high, which is also thinner than discrete LTCC devices.

 

(a) IPD Balun in the high and low frequency band of GSM, the sizes are 1.5mm*1.0mm and 1.0mm * 1.0mm, and Matching function has been embedded in Balun transformer. Figure 5 (b) The function-block solution of output matching circuit and transformer.

Fig.5 (a) IPD Balun in the high and low frequency band of GSM, the sizes are 1.5mm*1.0mm and 1.0mm * 1.0mm, and Matching function has been embedded in Balun transformer. Figure 5 (b) The function-block solution of output matching circuit and transformer.

IPD solution eliminates the use of SMD devices completely in matchers and transformer modules. It not only reduces the area by four times but also greatly cuts the cost of the packaging process. Because it is integrated into an IPD module instead of using a LTCC separator, balun transformer, and four RCLs, the effects of yield and process changes are improved.

 


IV. Conclusion

 

 

There have been many studies on the ideal solution of RF packaging in recent years, and the most important thing is to strike a balance between cost, volume, and performance. Although remarkable progress has been made in the lead frame technology, the performance of the LTCC substrate has been improved. The technology of IPD integration and laminate substrates is still the best considerate solution.

 

Laminate substrates have low cost, high flexibility, mature supply chains, and fast manufacturing cycles. IPD can produce excellent RF functional blocks and can be mounted on laminate substrates as easily as chips or SMT devices. Combining laminate substrates with IPD provides a very broad range of RF solutions. The two GSM examples studied in this article are just illustrating the typical size reduction. This technology can also be used in RF circuits of mobile TV, GPS, WLAN, and WiMax devices.

 

 


FAQ

 

1. What is RF and how it works?

Radio frequency waves (RF) are generated when an alternating current goes through a conductive material. ... Frequency is measured in hertz (or cycles per second) and wavelength is measured in meters (or centimeters). Radio waves are electromagnetic waves and they travel at the speed of light in free space.

 

2. How do RF modules transmit data?

An RF transmitter receives serial data and transmits it wirelessly through RF through its antenna connected at pin4. The transmission occurs at the rate of 1Kbps - 10Kbps. The transmitted data is received by an RF receiver operating at the same frequency as that of the transmitter.

 

3. How does RF transceiver work?

RF transceiver module is used in a particular device where both the transmitter and receiver houses in a single module. Such devices transmit and receives RF signal, so that is named as RF Transceiver. ... The transmitter and Receiver parts in the RF transceivers called as RF Up converter and RF Down converter.

 

4.What is RF transmitter and receiver?

RF signals travel in the transmitter and receiver even when there is an obstruction. It operates at a specific frequency of 433MHz. RF transmitter receives serial data and transmits to the receiver through an antenna which is connected to the 4th pin of the transmitter.

 

5. Is RF dangerous?

RF radiation has lower energy than some other types of non-ionizing radiation, like visible light and infrared, but it has higher energy than extremely low-frequency (ELF) radiation. If RF radiation is absorbed by the body in large enough amounts, it can produce heat. This can lead to burns and body tissue damage.

 

6. Why is RF used?

RF energy in more specific applications, like in the medical field, have equally specified purposes. MRI (Magnetic Resonance Imaging) uses RF waves to generate images of the human body. RF is also used to destroy cancer cells and perform cosmetic treatments that tighten skin, reduce fat, or promote skin cell healing.

 

7. Is WIFI a RF?

Very basically, Wi-Fi is made up of stations that transmit and receive data. Wireless transmissions are made up of radio frequency signals, or RF signals, which travel using a variety of movement behaviors (also called propagation behaviors).

 

8. How is RF signal transmitted?

As the RF waves move away from the transmitting antenna they move towards another antenna attached to the receiver, which is the final component in the wireless medium. The receiver takes the signal that it received from the antenna and translates the modulated signals and passes them on to be processed.

 

9. What devices use RF?

Modern devices often generate electromagnetic fields of radio frequency (RF) ranging from 100 kHz to 300 GHz. Key sources of RF fields include mobile phones, cordless phones, local wireless networks and radio transmission towers. They are also used by medical scanners, radar systems and microwave ovens.

 

10.How far can RF travel?

The distance a radio wave travels in a vacuum, in one second, is 299,792,458 meters (983,571,056 ft), which is the wavelength of a 1 hertz radio signal. A 1 megahertz radio wave (mid-AM band) has a wavelength of 299.79 meters (983.6 ft).

 

11. What RF sensing?

Unlike traditional hardware sensors, RF sensing provides users with low-cost and unobtrusive services. Fur- thermore, due to the broadcast nature of RF sig- nals, RF sensing can be used not only to monitor multiple subjects, but also to capture changes in the environment over a large area.

 

12. What is the frequency range of RF?

Radio frequency (RF) is the oscillation rate of an alternating electric current or voltage or of a magnetic, electric or electromagnetic field or mechanical system in the frequency range from around 20 kHz to around 300 GHz.

 

13. How do you calculate RF?

The Rf value of a compound is equal to the distance traveled by the compound divided by the distance traveled by the solvent front (both measured from the origin).

 

14. How do I connect RF headphones to my TV?

On the back of the headphone transmitter, connect the other end of the audio cable to the AUDIO IN jack. Connect the AC adapter into the transmitter's DC IN 9V jack and then plug it into a wall outlet. Adjust the TV volume to the desired level. Turn on the wireless headphones and adjust the volume to the desired level.

 

15. What is the difference between RF and IR?

RF (radio frequency) technology uses radio waves to transmit the audio signal. These are susceptible to RF interference. IR (infrared) technology uses infrared light to carry the audio signal thus keeping the signal in the room and eliminating RF interference.

 


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