TE Connectivity TX18AB00A2008

[CTS]

GENERAL DESCRIPTION

The iZIF™ is a custom aluminum heat frame that integrates the PCB retainer for improved structural integrity and thermal efficiency (.8°C-in./W). The iZIF™ is a highly reliable patentpending design for rugged military and aerospace circuit card applications. It features a quarter-turn lock, uniform clamping pressure, and can be sized to fit small daughter cards up to 9U VME. A bottom plate may also be added for additional cooling and structural integrity. The iZIF™ features a 1/8” stainless steel socket head cap rod with beryllium copper spring. A variety of finishes are available such as chemical film, black anodize, and electroless nickel.

GENERAL DESCRIPTION

CTS’s thermal links provide superior retention because of the 6 to 8-segment fingers versus the 2 or 3-segment fingers available from other manufacturers. These thermal links are offered for TO-5s, TO-8s and TO-18s with or without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high vibration and shock loads. The thermal links can be inserted and removed multiple times without loss of retention or damage to the finish over the entire JEDEC case diameter range. They can be installed with a rivet or eyelet, soldered to a PC pad or heat sink, mounted with a single screw or with a threaded stud and hex nut.