Integrated Device Technology (IDT) CA91C142D-33IEV

■ DESCRIPTION

AccelArrayTM* is a new structured ASIC family, offering short development time, and low development cost with pre-diffused IP macros into base masters and pre-designed common 3 to 4 metal layers out of 6 to 7 layers. By using 0.11 µm CMOS process technology, the devices can support 6 million logic gates, 4.55 Mbits SRAM and 3.125 Gbps high speed transmission macros. Ultra-high pin count FC-BGA (up to 729 pins to 1681 pins) packages are available.

■ FEATURES

• High-speed, large scale ASIC produced in short development time:
TAT = One third compared with Standard Cell ASICs (target value)
• Uses an architecture that simplifies physical design tasks.
• Pre-designed common masters with IR-drop free.
• Pre-designed test circuit insertion to reduce test synthesis tasks.
• Uses a dedicated timing-driven layout tool to reduce development time.
• Signal Integrity Free (pre-designed main clock trees without design verifications)
• Max built-in gate number : 6,000,000 gates or more
• Technology : 0.11 µm Silicon gate CMOS, 6 to 7-metal layers (wiring material: copper), low-k inter-layer film
• Internal cells support high-speed operation
• Power supply voltage : +1.2 V ± 0.1 V/2.5 V ± 0.2 V (Dual power supply. Needs 1.5 V power supply during using HTSL.).
• Operation junction temperature : −40 °C to +125 °C (standard)
• Max operating frequency: 333 MHz (internal circuit)
• Support for fast interface/macro (200 MHz/400 MHz DDR I/F, 2.5 Gbps PCI Express, 3.125 Gbps XAUI, etc.)
• Special interfaces (P-CML,LVDS,PCI,HSTL,SSTL-2, etc.)
• Embedded macro : PLL, SRAM
• 8-channel clock supply system incorporating a PLL
• Supports Memory-BIST/Boundary-SCAN
• Package : FC-BGA (729 pins to 1681 pins)
• ARM core is supported.