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- an 2016-09-29 in (IC Chips)
- IBM preps new wireless chip technology to allow mobile operators to clear the data bottleneck
- IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company's latest silicon-germanium (SiGe) chip-making process is designed to
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- an 2026-07-09 in (IC Chips)
- Wi-Fi 6 vs Wi-Fi 6E vs Wi-Fi 7: Choosing the Right Wireless Chip
- Technical Comparison: This data-driven guide covers the Wi-Fi 6 vs Wi-Fi 7 chip for IoT engineers, product designers, and advanced users optimizing local network stability.Stop obsessing over $500 fla
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- an 2026-08-25 in (IC Chips)
- CPLD vs FPGA: Which Programmable Logic Device Fits Your Design?
- Short answer: Choose a CPLD-class device when the design demands instant-on, deterministic, low-complexity supervisory or glue logic. Choose an FPGA when the design demands high-density parallel compu
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- an 2017-05-05 in (IC Chips)
- Novel technique measures warpage in next-gen integrated circuits
- As integrated circuit components are coming up against size limits, manufacturers are turning to new approaches based on stacking extremely thin wafers. However, the thin wafers easily warp under the
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