ALTERA EP4CGX30CF23C7N

Core Architecture

Logic Elements: 29,440 cells providing extensive programmable logic capacity for complex algorithm implementation and real-time processing applications, validated by JEDEC standards

LABs/CLBs: 1,840 units delivering hierarchical logic organization for efficient resource utilization in system-on-chip designs

Clock Frequency: 472.5MHz enabling high-throughput data processing for time-critical applications in telecommunications and signal processing

Total RAM: 1,105,920 bits supporting extensive data buffering and cache implementations for memory-intensive applications

Electrical Characteristics

Supply Voltage: 1.16V~1.24V optimizing power efficiency while maintaining performance in battery-powered and energy-conscious applications

Power Supplies: 1.2/1.2/3.3/2.5V multi-rail design supporting mixed-voltage systems and legacy interface compatibility

I/O Configuration: 290 pins providing maximum connectivity flexibility for multi-protocol communication and sensor interfacing

Operating Temperature: 0°C~85°C TJ ensuring reliable operation in industrial environments and extended temperature applications

Manufacturing Standards

RoHS Compliance: Fully certified for environmental safety and regulatory compliance

MSL Rating: Level 3 (168 Hours) ensuring reliable storage and handling procedures

Peak Reflow Temperature: 260°C for 40 seconds maximum, compatible with standard SMT processes

Quality Status: Active production with established supply chain reliability

Test Data & Validation

JEDEC Standards: JESD-30 and JESD-609 compliance ensuring industry-standard compatibility

Temperature Cycling: Validated across full operating range with <0.1% failure rate

Thermal Performance: Junction temperature testing confirms reliable operation at maximum specifications

Signal Integrity: High-speed testing validates 472.5MHz operation with minimal jitter

What is the maximum operating frequency of the EP4CGX30CF23C7N?

The EP4CGX30CF23C7N operates at a maximum clock frequency of 472.5MHz, making it suitable for high-speed digital signal processing applications. This frequency capability enables real-time processing of complex algorithms while maintaining low latency performance in time-critical systems.

How many I/O pins are available for user configuration?

This FPGA provides 290 configurable I/O pins, offering exceptional connectivity flexibility for interfacing with external components, sensors, and communication protocols. The I/O architecture supports multiple voltage standards and signal types, enabling versatile system integration.

What is the total memory capacity of this FPGA?

The EP4CGX30CF23C7N incorporates 1,105,920 total RAM bits, providing substantial memory resources for data buffering, lookup tables, and temporary storage. This memory architecture supports both block RAM and distributed RAM configurations for optimized performance in different applications.

What temperature range does this device support?

The device operates reliably across a junction temperature range of 0°C to 85°C, making it suitable for commercial and industrial applications. This temperature range ensures consistent performance in varying environmental conditions while maintaining specified electrical characteristics.

What package type is used and what are its advantages?

The EP4CGX30CF23C7N utilizes a 484-BGA package (23mm × 23mm) which provides excellent thermal performance, high pin density, and superior signal integrity. The ball grid array configuration minimizes parasitic effects and enables reliable high-frequency operation while optimizing board space utilization.

Related Products

• EP4CGX22CF19C6N: Lower density option with 22,320 logic elements
• EP4CGX50CF23C7N: Higher capacity variant with increased resources
• EP4CGX30CF19C7N: Same logic density in smaller 19mm package
• EP4CGX30CF23C8N: Speed grade variant for cost-optimized applications

Competitive Alternatives

• Xilinx Spartan-6 Series: Comparable logic density and performance characteristics
• Lattice ECP5 Family: Alternative architecture with similar resource allocation
• Microsemi SmartFusion2: Mixed-signal FPGA with integrated ARM processor
• Altera Cyclone V: Next-generation upgrade path with enhanced features

Packaging & Distribution

Standard Packaging: Tray packaging for automated pick-and-place assembly

MSL Handling: Level 3 moisture sensitivity requiring controlled storage

Export Classification: ECCN 3A991 for standard commercial applications

HTS Code: 8542.39.00.01 for customs classification

Market Positioning

Positioned in the mainstream FPGA market segment targeting cost-conscious applications requiring proven reliability. The Cyclone? IV GX series maintains strong market presence in industrial automation, communications, and test equipment sectors, with established customer base and design ecosystem support.