W741C2600668
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Manufacturer Part#:

W741C2600668

Product Category: IC Chips
Manufacturer: WINBOND
Description:
  datasheetW741C2600668 Datasheet
Package: DIE
Quantity: 6060 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
Real Time Availability
Stock:6,060 Can Ship Immediately
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Manufacturer: WINBOND
Product Category: IC Chips
Search Part number : "W741C" Included word is 6
Part Number Manufacturer Package Quantity Description
W741C2601671 WINBOND DIE 9060
W741C2601971 KEXIN BGA 11060
W741C2608221H WINDBOND DIE 61360
W741C2609282H WINDBOND DIE 20360
W741C2001931 KEXIN BGA 11060
W741C2507670H WINBOND 5060
W741C2600668 RELATED PRODUCT PICTURE
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  • W741C2601671
  • W741C2601971
  • W741C2608221H
  • W741C2609282H
  • W741C2001931
  • W741C2507670H
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