HY5DU28322AF-2.5
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Manufacturer Part#:

HY5DU28322AF-2.5

Product Category: IC Chips
Manufacturer: SAMSUNG
Description:
  HY5DU28322AF-2.5 Datasheet
Package: BGA
Quantity: 580 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
Real Time Availability
Stock:580 Can Ship Immediately
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Manufacturer: SAMSUNG
Product Category: IC Chips
Search Part number : "HY5DU" Included word is 15
Part Number Manufacturer Package Quantity Description
HY5DU643222BF-33 HYNIX BGA 437
HY5DU283222AF-25 HYUNDAI BGA 3876
HY5DU561622ETP-4 HYNIX TSOP66 7681
HY5DU12822DTP-D43-C HYNIX TSOP 74
HY5DU561622FTP HYNIX TSOP 154
HY5DU121622CTP-J-C HYNIX TSSOP 92
HY5DU561622CTP-4 HYNIX TSSOP 887
HY5DU56822CT-D43 HYNIX TSOP 78
HY5DU283222BF-33 HYNIX BGA-144 5566
HY5DU121622D-FP-5 HYNIX BGA 144
HY5DU12822DTP-J HYNIX TSOP 750
HY5DU281622ETP-J HY TSOP 4080
HY5DU283222AF-28 HYNIX BGA 1300
HY5DU283222BF-33-C HYNIX BGA 26334
HY5DU28322AFP-33 HYNIX BGA 92
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