CMS17
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Manufacturer Part#:

CMS17

Product Category: IC Chips
Manufacturer: TOSHIBA
Description:
  datasheetCMS17 Datasheet
Package: DO-214
Quantity: 80261 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
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Manufacturer: TOSHIBA
Product Category: IC Chips
Features, Applications

Switching Mode Power Supply Applications Portable Equipment Battery Applications

Forward voltage: VFM 0.48 V (max) Average forward current: IF (AV) 2.0 A Repetitive peak reverse voltage: VRRM 30 V Suitable for compact assembly due to a small surface-mount package: "M-FLATTM" (Toshiba package name)" Unit: mm


Characteristic Repetitive peak reverse voltage Average forward current Nonrepetitive peak surge current Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 2.0 (Note 30 (50 Hz) -40~150 Unit A °C


Note = 77°C Device mounted on a ceramic board Board size: 50 mm Soldering size: 2 mm Board thickness: 0.64 t Rectangular waveform 15 V


Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).


Characteristic Peak forward voltage Symbol VFM (1) VFM (2) IRRM (1) IRRM (2) Cj Test Condition IFM 1.0 A (pulse test) IFM 2.0 A (pulse test) VRRM 5 V (pulse test) VRRM 30 V (pulse test) = 1.0 MHz Device mounted on a ceramic board (board size: × 50 mm) (soldering land: × 2 mm) (board thickness: 0.64 t) Thermal resistance (junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 1.4 mm) (board thickness: 1.6 t) Thermal resistance (junction to lead) Rth (j-) Min Typ. Max 100 60 Unit V


Peak repetitive reverse current Junction capacitance

1) Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device to ensure high reliability. We recommend that the device be used Tj of below 120°C.


Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifiers databook for further information.



Device mounted on a ceramic board: board size: 50 mm soldering land: 2 mm board thickness: 0.64 t

1000 500 Device mounted on a glass-epoxy board: board size: 50 mm Soldering land: 1.4 mm board thickness: 1.6 t


50 30 Device mounted on a glass-epoxy board: board size: 50 mm Soldering land: 6.0 mm board thickness: 1.6 t


5 3 Device mounted on a ceramic board: board size: 50 mm Soldering land: 2.0 mm board thickness: 0.64 t

Search Part number : "CMS17" Included word is 2
Part Number Manufacturer Package Quantity Description
CMS17 TE12L,Q TOSHIBA SOD-128 4060 DIODE SCHOTTKY 30V 2A MFLAT
CMS17(TE12L,Q) TOSHIBA SOD-128 18360 DIODE SCHOTTKY 30V 2A MFLAT
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