CMF04
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Manufacturer Part#:

CMF04

Product Category: IC Chips
Manufacturer: TOSHIBA
Description:
  datasheetCMF04 Datasheet
Package: M-FLAT
Quantity: 392800 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
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Manufacturer: TOSHIBA
Product Category: IC Chips
Features, Applications

TOSHIBA Fast Recovery Diode Silicon Diffused Type

High Speed Rectifier Applications (Fast Recovery) Switching Mode Power Supply Applications DC/DC Converter Applications


Repetitive peak reverse voltage: VRRM 800 V Average forward current: IF (AV) 0.5 A Forward voltage: VFM 2.5 V (max) Very fast reverse-recovery time: trr 100 ns (max.) Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Unit: mm


Characteristic Repetitive peak reverse voltage Average forward current Peak one-cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 800 0.5 (Note 10 (50 Hz) (Note 3) -40~150 Unit A °C


Note = 127°C Rectangular waveform = 180°) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note3: This rating specifies the non-repetitive peak current in one cycle 50 Hz sine wave, condition angle 180°. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.


Characteristic Peak forward voltage Repetitive peak reverse current Reverse recovery time Forward recovery time Symbol VFM IRRM trr tfr Test Condition IFM 0.5 A (pulse test) VRRM 800 V (pulse test) 1 A, di/dt -30 A/s 1 A Device mounted on a ceramic board (board size: × 50 mm) (soldering land: × 2 mm) (board thickness: 0.64 t) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 1.4 mm) (board thickness: 1.6 t) Thermal resistance (junction to lead) Rth (j-) Min Typ. 550 Max 50 100 Unit A ns


Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information.



Device mounted on a glass-epoxy board (board size: × 50 mm, land size: × 6 mm) 160

Device mounted on a glass-epoxy board (board size: × 50 mm, land size: × 1.4 mm, board thickness: 1.6 t)


100 Device mounted on a glass-epoxy board (board size: × 50 mm, land size: × 6 mm, board thickness: 1.6 t) Device mounted on a ceramic board (board size: × 50 mm, land size: × 2 mm, board thickness: 0.64 t)

Search Part number : "CMF04" Included word is 3
Part Number Manufacturer Package Quantity Description
CMF04(TE12L,Q) TOSHIBA M-FLAT 32992
CMF04(TE12LQ) TOSHIBA M-FLAT 53360
CMF04(TE12R,Q,M) M-FLAT 5132
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