W741C2601671
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Manufacturer Part#:

W741C2601671

Product Category: IC Chips
Manufacturer: WINBOND
Description:
  W741C2601671 Datasheet
Package: DIE
Quantity: 9060 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
Real Time Availability
Stock:9,060 Can Ship Immediately
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Multiples:1
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Manufacturer: WINBOND
Product Category: IC Chips
Search Part number : "W741C" Included word is 5
Part Number Manufacturer Package Quantity Description
W741C2601971 KEXIN BGA 11060
W741C2608221H WINDBOND DIE 61360
W741C2609282H WINDBOND DIE 20360
W741C2001931 KEXIN BGA 11060
W741C2507670H WINBOND 5060
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