A3P1000-PQG208M
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Manufacturer Part#:

A3P1000-PQG208M

Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer: Microsemi Corporation
Description: IC FPGA 154 I/O 208PQFP
  datasheetA3P1000-PQG208M Datasheet
Package: 208-BFQFP
Quantity: 135 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
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Manufacturer: Microsemi Corporation
Product Category: Embedded - FPGAs (Field Programmable Gate Array)
Series: ProASIC3
Product: A3P1000
Mounting-Style: SMD/SMT
Tradename: Actel
Package-Case: 208-BFQFP
Operating-Temperature: -55°C ~ 125°C (TJ)
Mounting-Type: Surface Mount
Voltage-Supply: 1.425 V ~ 1.575 V
Supplier-Device-Package: 208-PQFP (28x28)
Number-of-Gates: 1000000
Number-of-I-O: 154
Number-of-LABs-CLBs:
Number-of-Logic-Elements-Cells:
Total-RAM-Bits: 147456
Maximum-Operating-Temperature: + 125 C
Minimum-Operating-Temperature: - 55 C
Operating-Supply-Voltage: 1.5 V
Operating-Supply-Current: 8 mA
Maximum-Operating-Frequency: 350 MHz
Package-Case: PQFP-208
Number-of-I-Os: 154 I/O
Number-of-Logic-Array-Blocks-LABs: -
Number-of-Logic-Elements: 11000
Total-Memory: 147456 bit
Features, Applications

Features and Benefits

Military Temperature Tested and Qualified

‧ Each Device Tested from –55°C to 125°C


Firm-Error Immune

‧ Not Susceptible to Neutron-Induced Configuration Loss


Low Power

‧ Dramatic Reduction in Dynamic and Static Power

‧ 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power

‧ Low Power Consumption in Flash*Freeze Mode Allows forInstantaneous Entry To / Exit From Low-Power Flash*Freeze?Mode

‧ Supports Single-Voltage System Operation

‧ Low-Impedance Switches


High Capacity

‧ 600 k to 3 M System Gates

‧ Up to 504 kbits of True Dual-Port SRAM

‧ Up to 620 User I/Os


Reprogrammable Flash Technology

‧ 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

‧ Live-at-Power-Up (LAPU) Level 0 Support

‧ Single-Chip Solution

‧ Retains Programmed Design when Powered Off


High Performance

‧ 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) SystemPerformance

‧ 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-BitPCI (1.2 V systems)


In-System Programming (ISP) and Security

‧ Secure ISP Using On-Chip 128-Bit Advanced EncryptionStandard (AES) Decryption via JTAG (IEEE 1532–compliant)

‧ FlashLock to Secure FPGA Contents 

High-Performance Routing Hierarchy 

‧ Segmented, Hierarchical Routing and Clock Structure 

‧ High-Performance, Low-Skew Global Network

‧ Architecture Supports Ultra-High Utilization


Advanced and Pro (Professional) I/Os

‧ 700 Mbps DDR, LVDS-Capable I/Os

‧ 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

‧ Bank-Selectable I/O Voltages—up to 8 Banks per Chip

‧ Single-Ended 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input 

‧ Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS 

‧ Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Class I and II (A3PE3000L only) 

‧ I/O Registers on Input, Output, and Enable Paths 

‧ Hot-Swappable and Cold-Sparing I/Os 

‧ Programmable Output Slew Rate and Drive Strength 

‧ Programmable Input Delay (A3PE3000L only) 

‧ Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L) 

‧ Weak Pull-Up/-Down 

‧ IEEE 1149.1 (JTAG) Boundary Scan Test 

‧ Pin-Compatible Packages across the Military ProASIC 


Clock Conditioning Circuit (CCC) and PLL 

‧ Six CCC Blocks, One with Integrated PLL (ProASIC3) and All with Integrated PLL (ProASIC3EL) 

‧ Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback 

‧ Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V systems) and 350 MHz (1.5 V systems) SRAMs and FIFOs 

‧ Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations available) 

‧ True Dual-Port SRAM (except ×18) 

‧ 24 SRAM and FIFO Configurations with Synchronous Operation: – 250 MHz: For 1.2 V Systems – 350 MHz: For 1.5 V Systems


Search Part number : "A3P10" Included word is 15
Part Number Manufacturer Package Quantity Description
A3P1000-1FG144M Microsemi Corporation 144-LBGA 585 IC FPGA 97 I/O 144FBGA
A3P1000-FG144I Microsemi Corporation 144-LBGA 576 IC FPGA 97 I/O 144FBGA
A3P1000-1FGG144 Microsemi Corporation 144-LBGA 76 IC FPGA 97 I/O 144FBGA
A3P1000-FG144M ACTEL BGA 660 IC FPGA 97 I/O 144FBGA
A3P1000-1FGG144I Microsemi Corporation 144-LBGA 841 IC FPGA 97 I/O 144FBGA
A3P1000-FG144T Microsemi Corporation 144-LBGA 574 IC FPGA 97 I/O 144FBGA
A3P1000-FG256M Microsemi Corporation 256-LBGA 568 IC FPGA 177 I/O 256FBGA
A3P1000-1FGG144M Microsemi Corporation 144-LBGA 670 IC FPGA 97 I/O 144FBGA
A3P1000-1FGG256I Microsemi Corporation 256-LBGA 508 IC FPGA 177 I/O 256FBGA
A3P1000-FG484 Microsemi Corporation 484-BGA 4060 IC FPGA 300 I/O 484FBGA
A3P1000-1FGG256M Microsemi Corporation 256-LBGA 515 IC FPGA 177 I/O 256FBGA
A3P1000-FG484A ACTEL BGA 3957
A3P1000-1PQ208I Microsemi Corporation 208-BFQFP 515 IC FPGA 154 I/O 208PQFP
A3P1000-FGG144M Microsemi Corporation 144-LBGA 531 IC FPGA 97 I/O 144FBGA
A3P1000-1PQ208M Microsemi Corporation 208-BFQFP 221 IC FPGA 154 I/O 208PQFP
A3P1000-PQG208M RELATED PRODUCT PICTURE
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  • A3P1000-1FG144M
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  • A3P1000-1FGG144
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