XCKU115-1FLVF1924I
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XCKU115-1FLVF1924I

Product Category: IC Chips
Manufacturer: XILINX
Description: IC FPGA KINTEX-U 1924FCBGA
  datasheetXCKU115-1FLVF1924I Datasheet
Package: FCBGA
Quantity: 50 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
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Manufacturer: XILINX
Product Category: IC Chips
Series: Kintex® UltraScale™
Operating-Temperature: -40°C ~ 100°C (TJ)
Number-of-LABs-CLBs: 82920
Number-of-Logic-Elements-Cells: 1451100
Number-of-I-O: 728
Voltage-Supply: 0.922 V ~ 0.979 V
Part-Status: Active
Total-RAM-Bits: 77721600
Features, Applications

RF Data Converter Subsystem Overview

Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio frequency analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog converters (RF-DACs). The high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be individually configured for real data or can be configured in pairs for real and imaginary I/Q data. The 12-bit RF-ADCs support sample rates up to 2GSPS or 4GSPS, depending on the selected device. The 14-bit RF-DACs support sample rates up to 6.4GSPS.


Soft Decision Forward Error Correction (SD-FEC) Overview

Some Zynq UltraScale+ RFSoCs include highly flexible soft-decision FEC blocks for decoding and encoding data as a means to control errors in data transmission over unreliable or noisy communication channels.The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul, DOCSIS, and LTE applications.


Processing System Overview

Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the ARM Cortex-A53 (APU) with dual-core ARM Cortex-R5 (RPU) processing system (PS). Some devices also include a dedicated ARM Mali?-400 MP2 graphics processing unit (GPU). See Table 2.

Table 2: Zynq UltraScale+ MPSoC and RFSoC Device Features


MPSoC
RFSoC

CG DevicesEG DevicesEV DevicesDR Devices
APUDual-core ARM Cortex-A53Quad-core ARM Cortex-A53Quad-core ARM Cortex-A53Quad-core ARM Cortex-A53
RPUDual-core ARM Cortex-R5Dual-core ARM Cortex-R5Dual-core ARM Cortex-R5Dual-core ARM Cortex-R5
GPUMali-400MP2Mali-400MP2
VCUH.264/H.265

To support the processors' functionality, a number of peripherals with dedicated functions are included in the PS. For interfacing to external memories for data or configuration storage, the PS includes a multi-protocol dynamic memory controller, a DMA controller, a NAND controller, an SD/eMMC controller and a Quad SPI controller. In addition to interfacing to external memories, the APU also includes a Level-1 (L1) and Level-2 (L2) cache hierarchy; the RPU includes an L1 cache and Tightly Coupled memory subsystem. Each has access to a 256KB on-chip memory. For high-speed interfacing, the PS includes 4 channels of transmit (TX) and receive (RX) pairs of transceivers, called PS-GTR transceivers, supporting data rates of up to 6.0Gb/s. These transceivers can interface to the high-speed peripheral blocks to support PCIe Gen2 root complex or end point in x1, x2, or x4 configurations; Serial-ATA (SATA) at 1.5Gb/s, 3.0Gb/s, or 6.0Gb/s data rates; and up to two lanes of Display Port at 1.62Gb/s, 2.7Gb/s, or 5.4Gb/s data rates. The PS-GTR transceivers can also interface to components over USB 3.0 and Serial Gigabit Media Independent Interface (SGMII).


For general connectivity, the PS includes: a pair of USB 2.0 controllers, which can be configured as host, device, or On-The-Go (OTG); an I2C controller; a UART; and a CAN2.0B controller that conforms to ISO11898-1. There are also four triple speed Ethernet MACs and 128 bits of GPIO, of which 78 bits are available through the MIO and 96 through the EMIO. High-bandwidth connectivity based on the ARM AMBAR AXI4 protocol connects the processing units with the peripherals and provides interface between the PS and the programmable logic (PL). For additional information, go to: DS891, Zynq UltraScale+ MPSoC Overview.


I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken

Data is transported on and off chip through a combination of the high-performance parallel SelectIO? interface and high-speed serial transceiver connectivity. I/O blocks provide support for cutting-edge memory interface and network protocols through flexible I/O standard and voltage support. The serial transceivers in the UltraScale architecture-based devices transfer data up to 32.75Gb/s, enabling 25G+ backplane designs with dramatically lower power per bit than previous generation transceivers. All
transceivers, except the PS-GTR, support the required data rates for PCIe Gen3, and Gen4 (rev 0.5), and integrated blocks for PCIe enable UltraScale devices to support up to Gen4 x8 and Gen3 x16 Endpoint and Root Port designs. Integrated blocks for 150Gb/s Interlaken and 100Gb/s Ethernet (100G MAC/PCS) extend the capabilities of UltraScale devices, enabling simple, reliable support for Nx100G switch and bridge applications. Virtex UltraScale+ HBM devices include Cache Coherent Interconnect for Accelerators (CCIX) ports for coherently sharing data with different processors.


Clocks and Memory Interfaces
UltraScale devices contain powerful clock management circuitry, including clock synthesis, buffering, and routing components that together provide a highly capable framework to meet design requirements. The clock network allows for extremely flexible distribution of clocks to minimize the skew, power consumption, and delay associated with clock signals. The clock management technology is tightly integrated with dedicated memory interface circuitry to enable support for high-performance external
memories, including DDR4. In addition to parallel memory interfaces, UltraScale devices support serial memories, such as hybrid memory cube (HMC).

Routing, SSI, Logic, Storage, and Signal Processing
Configurable Logic Blocks (CLBs) containing 6-input look-up tables (LUTs) and flip-flops, DSP slices with 27x18 multipliers, 36Kb block RAMs with built-in FIFO and ECC support, and 4Kx72 UltraRAM blocks (in UltraScale+ devices) are all connected with an abundance of high-performance, low-latency interconnect.In addition to logical functions, the CLB provides shift register, multiplexer, and carry logic functionality as well as the ability to configure the LUTs as distributed memory to complement the highly capable and configurable block RAMs. The DSP slice, with its 96-bit-wide XOR functionality, 27-bit pre-adder, and 30-bit A input, performs numerous independent functions including multiply accumulate, multiply add, and pattern detect. In addition to the device interconnect, in devices using SSI technology, signals can cross between super-logic regions (SLRs) using dedicated, low-latency interface tiles. These combined routing resources enable easy support for next-generation bus data widths. Virtex UltraScale+ HBM devices include up to 8GB of high bandwidth memory.


Configuration, Encryption, and System Monitoring
The configuration and encryption block performs numerous device-level functions critical to the successful operation of the FPGA, MPSoC, or RFSoC. This high-performance configuration block enables device configuration from external media through various protocols, including PCIe, often with no requirement to use multi-function I/O pins during configuration. The configuration block also provides 256-bit AES-GCM decryption capability at the same performance as unencrypted configuration.Additional features include SEU detection and correction, partial reconfiguration support, and battery-backed RAM or eFUSE technology for AES key storage to provide additional security. The System Monitor enables the monitoring of the physical environment via on-chip temperature and supply sensors and can also monitor up to 17 external analog inputs. With Zynq UltraScale+ MPSoCs and RFSoCs, the device is booted via the Configuration and Security Unit (CSU), which supports secure boot via the 256-bit AES-GCM and SHA/384 blocks. The cryptographic engines in the CSU can be used after boot for user encryption.

Migrating Devices
UltraScale and UltraScale+ families provide footprint compatibility to enable users to migrate designs from one device or family to another. Any two packages with the same footprint identifier code are footprint compatible. For example, Kintex UltraScale devices in the A1156 packages are footprint compatible with Kintex UltraScale+ devices in the A1156 packages. Likewise, Virtex UltraScale devices in the B2104 packages are compatible with Virtex UltraScale+ devices and Kintex UltraScale devices in the
B2104 packages. All valid device/package combinations are provided in the Device-Package Combinations and Maximum I/Os tables in this document. Refer to UG583, UltraScale Architecture PCB Design User Guide for more detail on migrating between UltraScale and UltraScale+ devices and packages.


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XCKU115-2FLVF1924E XILINX FCBGA 50 IC FPGA KINTEX-U 1924FCBGA
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