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Product Category: IC Chips
Manufacturer: TOSHIBA
  datasheetCMH02 Datasheet
Package: M-FLAT
Quantity: 75580 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
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Manufacturer: TOSHIBA
Product Category: IC Chips
Features, Applications

TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type

Unit: mm Repetitive peak reverse voltage: VRRM 400 V Average forward current: IF (AV) 3.0 A Low forward voltage: VFM=1.3 V (Max.) Very fast reverse recovery time: trr =50ns (Max.) Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name)

Characteristics Repetitive peak reverse voltage Average forward current Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 400 3.0 (Note 40 (50 Hz) -40~150 Unit A °C

Device mounted on a ceramic board size: 50 mm soldering land: ×2 mm board thickness:0.64t

Note 2: Using continuously under heavy loads (e.g. the application of TOSHIBA 3-4E1A high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the Weight: 0.023 g (typ.) reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Peak repetitive reverse current Reverse recovery time Forward recovery time IRRM trr tfr Test Condition IFM 0.1 A (pulse test) IFM 1.0 A (pulse test) IFM 3.0 A (pulse test) VRRM 400 V (pulse test) 1 A, di/dt = -30 A/s 1.0 A Device mounted on a ceramic board (board size: × 50 mm) (soldering land: × 2 mm) (board thickness: 0.64 t) Thermal resistance (junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: × 50 mm) (soldering land: × 1.4 mm) (board thickness: 1.6 t) Thermal resistance (junction to lead) Rth (j-) Min Typ. 0.93 1.1 Max ns V Unit

The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out adequate heat design. If you can't design a circuit with excellent heat radiation, set the margin by using an allowable Tamax-IF (AV) curve.

This rating specifies the non-repetitive peak current in one cycle a 50-Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used Tj of below 120 under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the device's mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information.

Pulse test iF (A) Average forward power dissipation PF (AV) (W)

Ta max - IF (AV) Maximum allowable ambient temperature Ta max (°C)

Device mounted on a glass-epoxy board: board size: 50 mm Soldering land: 6.0 mm board thickness: 1.6 t

1000 500 Device mounted on a glass-epoxy board: board size: 50 mm Soldering land: 1.4 mm board thickness: 1.6 t

50 30 Device mounted on a glass-epoxy board: board size: 50 mm Soldering land: 6.0 mm board thickness: 1.6 t

5 3 Device mounted on a ceramic board: board size: 50 mm Soldering land: 2.0 mm board thickness: 0.64 t

Search Part number : "CMH02" Included word is 3
Part Number Manufacturer Package Quantity Description
CMH02A Toshiba SOD-128 60160 DIODE GEN PURP 400V 3A MFLAT
  • CMH02A
  • CMH02A(TE12L,Q)
  • CMH02A(TE12LQ)
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