KLM2G1HE3F-B001
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Manufacturer Part#:

KLM2G1HE3F-B001

Product Category: IC Chips
Manufacturer: SAMSUNG
Description:
  datasheetKLM2G1HE3F-B001 Datasheet
Package: BGA
Quantity: 18301 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
Real Time Availability
Stock:18,301 Can Ship Immediately
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Manufacturer: SAMSUNG
Product Category: IC Chips
Search Part number : "KLM2G" Included word is 8
Part Number Manufacturer Package Quantity Description
KLM2G1HE3F-B002 SAMSUNG BGA 457
KLM2G1DEDD-A101 SAMSUNG BGA 6800
KLM2G1DEFD-A301 SAMSUNG FBGA 6267
KLM2G1HE3F-BOO1 SAMSUNG BGA 1661
KLM2G1DEHE-B101 SAMSUNG BGA 2819
KLM2G1DEDD-A101 SAMSUNG BGA 6800
KLM2G1HE3F-B001 SAMSUNG BGA 18301
KLM2G1DEHE-B101 SAMSUNG BGA 2819
KLM2G1HE3F-B001 RELATED PRODUCT PICTURE
left
  • KLM2G1HE3F-B002
  • KLM2G1DEDD-A101
  • KLM2G1DEFD-A301
  • KLM2G1HE3F-BOO1
  • KLM2G1DEHE-B101
  • KLM2G1DEDD-A101
  • KLM2G1HE3F-B001
  • KLM2G1DEHE-B101
right
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