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Kynix Part #: KY32-CLM1117M
Manufacturer Part#:


Product Category: IC Chips
Manufacturer: CALOGIC
  datasheetCLM1117M Datasheet
Package: SOT-223
Quantity: 2165 PCS
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level(MSL): 3(168 Hours)
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Manufacturer: CALOGIC
Product Category: IC Chips
Features, Applications

FEATURES PRODUCT DESCRIPTION The Calogic is a low power positive voltage regulator designed to meet 800mA output current and comply with SCSI-II specifications with a fixed output voltage of 2.85V. This device is an excellent choice for use in batterypowered applications, as active terminators for the SCSI bus, and portable computers. The CLM1117 features very low quiescent current and very low dropout voltage at a full load and lower as output current decreases. This product is available as an adjustable or fixed 3V, 3.3V, and 5V output voltages. The device is offered a 3-pin surface mount package SOT-223. The output capacitor 10μF or larger is needed for output stability CLM1117 as required by most of the other regulator circuits. ORDERING INFORMATION Part CLM1117M CLM1117M-X Package SOT-223 Temperature Industrial

Guaranteed 800mA Output Three Terminal Adjustable or Fixed & 12V Very Low Quiescent Current Low Dropout Voltage of 1.2 Volts at Full Load Extremely Tight Load and Line Regulation Very Low Temperature Coefficient Fixed 2.8V Device for SCSI-II Active Terminator Logic-Controlled Electronic Shutdown Internal Overcurrent Limiting & Thermal Overload Protection Surface Mount Package SOT-223

APPLICATIONS SCSI-II Active Terminator Portable/ Palm Top / Notebook Computers Battery Chargers Disk Drives Portable Consumer Equipment Portable Instrumentation SMPS Post-Regulator

CALOGIC CORPORATION, 237 Whitney Place, Fremont, California 94539, Telephone: 510-656-2900, FAX: 510-651-3025

ABSOLUTE MAXIMUM RATINGS Power Dissipation. Internally Limited Lead Temp. (Soldering, 5 Seconds). 260oC Storage Temperature Range. to +150oC Operating Junction Temperature Range to +125oC Input Voltage. to 6V Input Supply Voltage. to +20V ESD Rating. 2KV Min

ELECTRICAL CHARACTERISTICS: VIN = 3.3μf, unless otherwise noted. Boldface apply over full operating temperature range.

CONDITIONS IOUT = 10mA, IIN 4.85V 0 IOUT 800mA, 4.25 VIN 10V 0 IOUT 500mA, VIN = 4.05V IOUT = 10mA, VIN 5.00V 0 IOUT 800mA, 4.50 VIN 10V IOUT = 10mA, IIN 5.30V 0 IOUT 800mA, 4.80 VIN 10V IOUT = 10mA, IIN 7.00V 0 IOUT 800mA, 6.50 VIN 12V

(Note 1) 4.25V VIN 10V, VOUT 4.50V VIN 12V, VOUT 4.80V VIN 12V, VOUT 4.50V VIN 15V, VOUT 0 IOUT 800mA, 0 IOUT 800mA, 0 IOUT 800mA, 0 IOUT 800mA 4.25V VIN 6.5V (VIN - VOUT) 25oC, 30mS Pulse fRIPPLE = 120Hz, (VIN - VOUT = 3V, VRIPPLE % of VOUT f 10kHz Junction to case, at tab = 2.85, IOUT = 0

Dropout Voltage (Note 2) Quiescent Voltage Current Limit Thermal Regulation Ripple Rejection Long Term Stability RMS Output Noiase Thermal Resistance

Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at very low values of programmed output voltage, the minimum input supply voltage 2V (2.3V over temperature) must be taken input account. Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effect.

APPLICATION NOTES EXTERNAL CAPACITOR To ensure the stability of the CLM1117 an output capacitor of at least 10μF (tantalum) or 50μF (aluminum) is required. The value may change based on the application requirements on the output load or temperature range. The capacitor equivalent series resistance (ESR) will effect the CLM1117 stability. The value of the ESR can vary from the type of capacitor used in the applications. The recommended value for ESR is 0.5. The output capacitance could increase in size to above the minimum value. The larger value of output capacitance as high as 100μF can improve the load transient response. SOLDERING METHODS The CLM1117 SOT-223 package is designed to be compatible with infrared reflow or vapor-phase reflow soldering techniques. During soldering the non-active or mildly active fluxes may be used. The CLM1117 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65oC of the soldering temperature range. THERMAL CHARACTERISTICS The thermal resistance CLM1117 is Co/W from junction to tab and 31 Co/W from tab to ambient for a total of 46 Co/W from junction to ambient. The CLM1117 features the internal thermal limiting to protect the device during overload conditions. Special care needs to be taken during continuous load conditions to insure the maximum junction temperature does not exceed 125oC. Taking the FR-4 printed circuit board and 1/16 thick with 1 ounce copper foil as an experiment & fig.2), the PCB material is effective at transmitting heat with the tab attached to the pad area and a ground plane layer on the backside of the substrate. Refer to table 1 for the results of the experiment. The thermal interaction from other components in the application can effect the thermal resistance of the CLM1117. TABLE 1.


The actual thermal resistance can be determined with experimentation. CLM1117 power dissipation is calculated as follows: PD = (VIN - VOUT) (IOUT) Maximum Junction Temperature Range: TJ = Tambient (max) + PD (thermal resistance (Junction-to-ambient)) Maximum Junction Temperature must not exceed = 750mW

THERMAL RESISTANCE JUNCTION TO AMBIENT 46 oC/Wo 47 oC/Wo 49 oC/Wo 51 oC/Wo 53 oC/Wo 55 oC/Wo 58 oC/Wo 59 oC/Wo 67 oC/Wo 72 oC/Wo 85 oC/Wo

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